JPS5748250A - Metal cap for semiconductor device - Google Patents

Metal cap for semiconductor device

Info

Publication number
JPS5748250A
JPS5748250A JP12324580A JP12324580A JPS5748250A JP S5748250 A JPS5748250 A JP S5748250A JP 12324580 A JP12324580 A JP 12324580A JP 12324580 A JP12324580 A JP 12324580A JP S5748250 A JPS5748250 A JP S5748250A
Authority
JP
Japan
Prior art keywords
seam
metal
metal cap
projections
drawn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12324580A
Other languages
Japanese (ja)
Inventor
Shigeru Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12324580A priority Critical patent/JPS5748250A/en
Publication of JPS5748250A publication Critical patent/JPS5748250A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To eliminate nonuniform plating due to overlap of metal caps in the plating process and facilitate the automatic feed by means of an automatic loader, by providing small projections to a metal cap. CONSTITUTION:A square metal cap 11 to be seam-welded is provided with samll projections 18 near the four corners of a drawn part 17 to be a positioning part with respect to a ceramic package, when a thin metal plate is drawn, the projections 18 being smaller in height than the depth of the drawn part 17. Said small projections 18 so functions that when metal caps 11 overlap with each other, a gap is provided therebetween. Said metal cap 11 is seam-welded to a metal frame part 2 of a ceramic package 3. Thereby, it is possible to stabilize the automatic assembly in seam welding operation and improve a seam-weld seal type semiconductor device in quality.
JP12324580A 1980-09-05 1980-09-05 Metal cap for semiconductor device Pending JPS5748250A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12324580A JPS5748250A (en) 1980-09-05 1980-09-05 Metal cap for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12324580A JPS5748250A (en) 1980-09-05 1980-09-05 Metal cap for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5748250A true JPS5748250A (en) 1982-03-19

Family

ID=14855791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12324580A Pending JPS5748250A (en) 1980-09-05 1980-09-05 Metal cap for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5748250A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551745A (en) * 1981-09-30 1985-11-05 Fujitsu Limited Package for semiconductor device
JPS6226846A (en) * 1985-07-26 1987-02-04 Nec Corp Semiconductor device sealing cap
EP0330176A2 (en) * 1988-02-22 1989-08-30 Kabushiki Kaisha Toshiba Cover plate for semiconductor devices
JPH02122714A (en) * 1988-10-31 1990-05-10 Matsushima Kogyo Co Ltd Piezoelectric vibrator

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551745A (en) * 1981-09-30 1985-11-05 Fujitsu Limited Package for semiconductor device
JPS6226846A (en) * 1985-07-26 1987-02-04 Nec Corp Semiconductor device sealing cap
EP0330176A2 (en) * 1988-02-22 1989-08-30 Kabushiki Kaisha Toshiba Cover plate for semiconductor devices
US5096081A (en) * 1988-02-22 1992-03-17 Kabushiki Kaisha Toshiba Cover plate for semiconductor devices
JPH02122714A (en) * 1988-10-31 1990-05-10 Matsushima Kogyo Co Ltd Piezoelectric vibrator

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