JPS5355974A - Airtight sealing method for semiconductor device container - Google Patents

Airtight sealing method for semiconductor device container

Info

Publication number
JPS5355974A
JPS5355974A JP13086876A JP13086876A JPS5355974A JP S5355974 A JPS5355974 A JP S5355974A JP 13086876 A JP13086876 A JP 13086876A JP 13086876 A JP13086876 A JP 13086876A JP S5355974 A JPS5355974 A JP S5355974A
Authority
JP
Japan
Prior art keywords
airtight sealing
semiconductor device
sealing method
device container
perform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13086876A
Other languages
Japanese (ja)
Other versions
JPS562416B2 (en
Inventor
Katsuhiko Suzuki
Masanaga Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP13086876A priority Critical patent/JPS5355974A/en
Publication of JPS5355974A publication Critical patent/JPS5355974A/en
Publication of JPS562416B2 publication Critical patent/JPS562416B2/ja
Granted legal-status Critical Current

Links

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To perform an airtight sealing for an optional polygonal seal frame with high efficiency by using a long cone of a low taper angle or a conical board roll electrode.
COPYRIGHT: (C)1978,JPO&Japio
JP13086876A 1976-10-29 1976-10-29 Airtight sealing method for semiconductor device container Granted JPS5355974A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13086876A JPS5355974A (en) 1976-10-29 1976-10-29 Airtight sealing method for semiconductor device container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13086876A JPS5355974A (en) 1976-10-29 1976-10-29 Airtight sealing method for semiconductor device container

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP16666581A Division JPS57172754A (en) 1981-10-19 1981-10-19 Hermetically sealing method for container of semiconductor substrate
JP58237424A Division JPS59145545A (en) 1983-12-16 1983-12-16 Method for airtight sealing of package for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5355974A true JPS5355974A (en) 1978-05-20
JPS562416B2 JPS562416B2 (en) 1981-01-20

Family

ID=15044566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13086876A Granted JPS5355974A (en) 1976-10-29 1976-10-29 Airtight sealing method for semiconductor device container

Country Status (1)

Country Link
JP (1) JPS5355974A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0348040A (en) * 1989-07-13 1991-03-01 Honda Motor Co Ltd Balancer device for internal combustion engine

Also Published As

Publication number Publication date
JPS562416B2 (en) 1981-01-20

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