KR960039306A - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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KR960039306A
KR960039306A KR1019960013381A KR19960013381A KR960039306A KR 960039306 A KR960039306 A KR 960039306A KR 1019960013381 A KR1019960013381 A KR 1019960013381A KR 19960013381 A KR19960013381 A KR 19960013381A KR 960039306 A KR960039306 A KR 960039306A
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radiator plate
plate
semiconductor device
radiator
semiconductor chip
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KR1019960013381A
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KR100231934B1 (ko
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고우키 기타오카
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쯔지 하루오
샤프 가부시끼가이샤
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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Abstract

본 발명의 반도체 장치는; 상부면, 하부면 및 측면을 가진 반도체칩; 상부면, 하부면 및 측면을 가진 판부분과 상부면, 하부면 및 측면을 가진 몸체부분을 포함하며, 상기 몸체부분의 상부면이 상기 판부분의 하부면의 면적보다 좁은 면적으로 되어 있고 상기 판부분의 하부면에 연결되어 있는 방열을 위한 제1방열기 판; 상부면, 하부면 및 측면을 가지며, 상기 상부면이 상기 제1방열기 판의 몸체부분의 하부면 보다 넓은 면적으로 되어있는 방열을 위한 제2방열기 판; 상기 반도체칩의 하부면과 측면을 둘러싸고 있는 케이스 몸체; 및 상기 반도체칩의 상부면위에 배치되어 상기 케이스 몸체와 연결되어 있는 뚜껑을 포함한다. 반도체 장치에 있어서, 상기 반도체 칩의 하부면이 상기 제1방열기 판의 판부분의 상부면과 연결되어 있고, 상기 제1방열기 판의 몸체부분의 하부면이 상기 제2방열기 판의 상부면과 연결되어 상기 제1방열기 판의 판부분의 하부면과 상기 제2방열기 판의 상부면 사이에 공간을 형성하고 있으며, 상기 케이스 몸체의 일부가 상기 제1방열기 판의 판부분의 하부면과 상기 제2방열기 판의 상부면 사이에 배치되어 제1방열기 판의 판부분의 하부면과 제2방열기 판의 상부면 사이에 형성된 공간을 채우고 있다.

Description

반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예의 반도체 장치의 부분 절단 사시도.

Claims (10)

  1. 상부면, 하부면 및 측면을 가진 반도체칩; 상부면, 하부면 및 측면을 가진 판부분과 상부면, 하부면 및 측면을 가진 몸체부분을 포함하며, 상기 몸체부분의 상부면이 상기 판부분의 하부면의 면적보다 좁은 면적으로 되어있고 상기 판부분의 하부면에 연결되어 있는 방열을 위한 제1방열기판; 상부면, 하부면 및 측면을 가지며, 상기 상부면이 상기 제1방열기 판의 몸체부분의 하부면보다 넓은 면적으로 되어있는 방열을 위한 제2방열기 판; 상기 반도체칩의 하부면과 측면을 둘러싸고 있는 케이스 몸체; 및 상기 반도체칩의 상부면위에 배치되어 상기 케이스 몸체와 연결되어 있는 뚜껑을 포함하며, 상기 반도체 칩의 하부면이 상기 제1방열기 판의 판부분의 상부면과 연결되어 있고, 상기 제1방열기 판의 몸체부분의 하부면이 상기 제2방열기 판의 상부면과 연결되어 상기 제1방열기 판의 판부분의 하부면과 상기 제2방열기 판의 상부면 사이에 공간을 형성하고 있으며, 상기 케이스 몸체의 일부가 상기 제1방열기 판의 판부분의 하부면과 상기 제2방열기 판의 상부면 사이에 배치되어 그 방열기 판들 사이에 형성된 공간을 채우고 있는 반도체 장치.
  2. 제1항에 있어서, 상기 케이스 몸체는 상기 제2방열기 판을 둘러싸고 있는 반도체 장치.
  3. 제1항에 있어서, 상기 반도체칩의 하부면의 면적은 상기 제1방열기 판의 판부분의 상부면의 면적보다 넓고, 상기 제1방열기 판의 판부분의 상부면의 면적은 상기 제1방열기 판의 몸체부분의 하부면의 면적보다 넓은 반도체 장치.
  4. 제1항에 있어서, 상기 제1방열기 판의 판부분의 상부면은 상기 제1방열기 판의 몸체부분의 하부면에 대해 평행한 반도체 장치.
  5. 제1항에 있어서, 상기 제1방열기 판의 판부분의 상부면을 상기 제2방열기 판의 하부면에 대해 평행한 반도체 장치.
  6. 제1항에 있어서, 상기 반도체칩은 상기 케이스 몸체와 접촉되지 않은 반도체 장치.
  7. 제1항에 있어서, 상기 반도체칩은 고체촬상장치인 반도체 장치.
  8. 제1항에 있어서, 상기 뚜껑은 투명한 부재인 반도체 장치.
  9. 제1항에 있어서, 상기 케이스 몸체는 수지로 제조되는 반도체 장치.
  10. 제1항에 있어서, 각각 리드 프레임으로 형성된 복수의 단자들을 더 포함하며, 상기 제2방열기 판은 리드 프레임에 형성된 섬인 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960013381A 1995-04-26 1996-04-24 반도체 장치 KR100231934B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-102236 1995-04-26
JP7102236A JP3054576B2 (ja) 1995-04-26 1995-04-26 半導体装置

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KR960039306A true KR960039306A (ko) 1996-11-25
KR100231934B1 KR100231934B1 (ko) 1999-12-01

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US5757075A (en) 1998-05-26

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