KR930006894A - 히트-싱크를 갖춘 반도체 패키지 - Google Patents

히트-싱크를 갖춘 반도체 패키지 Download PDF

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Publication number
KR930006894A
KR930006894A KR1019920016543A KR920016543A KR930006894A KR 930006894 A KR930006894 A KR 930006894A KR 1019920016543 A KR1019920016543 A KR 1019920016543A KR 920016543 A KR920016543 A KR 920016543A KR 930006894 A KR930006894 A KR 930006894A
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KR
South Korea
Prior art keywords
heat
sink
chip
package
plates
Prior art date
Application number
KR1019920016543A
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English (en)
Other versions
KR960000222B1 (ko
Inventor
사까에 기따조
Original Assignee
세끼모또 다다히로
니뽄 덴끼 가부시끼가이샤
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Application filed by 세끼모또 다다히로, 니뽄 덴끼 가부시끼가이샤 filed Critical 세끼모또 다다히로
Publication of KR930006894A publication Critical patent/KR930006894A/ko
Application granted granted Critical
Publication of KR960000222B1 publication Critical patent/KR960000222B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

설명된 것은 히트-싱크를 갖춘 패키지인데, 상기 패키지의 히트 싱크는 일렬로 배열된 다수의 평평한 판을 가지며, 양 끝판은 사각형 형태를 가지며, 상기 양 끝판은 사각형 형태를 가지며, 상기 양 끝판에 위치된 판은 윗쪽보다 더 짧은 아래쪽을 가진 역사다리 꼴이다. 상기 히트 싱크의 상기 구조는 상기 판의 바닥부를 통해 공기가 쉽게 흐르게 한다. 그러므로, 상기 차가운 공기는 외부로 더 적게 누설되고, 상기 판간의 공간을 통해 통과되며, 상기 히트 싱크의 냉각 성능을 향상시키고 상기 패키지의 냉각 효율을 개선시킨다.

Description

히트-싱크를 갖춘 반도체 패키지
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명의 한 실시예에 따른 히트-싱크를 갖춘 패키지의 투시도,
제4도는 상기 실시예에 따른 히트-싱크를 갖춘 패키지의 수직 단면도.

Claims (1)

  1. 칩을 수용하는 케이스와, 히트 싱크와, 상기 칩을 보유하는 공동과, 칩-장착판 및, 캡을 포함하는데, 상기 공동은 상기 칩 장착판 및 상기 캡에 의하며 밀페되며, 상기 칩은 상기 칩-장착판의 바닥면에 단단히 부착되며, 상기 히트-싱크는 상기 칩-장착판상에 병렬로 고착되고 배열된 다수의 판으로 구성되며, 상기 판중 최외각 판이 사각형 형태르리 가진 양 끝에 위치하며, 동시에 양 끝간에 위치한 각각의 상기판은 윗쪽보다 더 짧은 아랫쪽을 가진 사다리꼴 형태인 것을 특징으로 하는 히트-싱크를 갖춘 반도체 패키지.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920016543A 1991-09-13 1992-09-09 히트-싱크를 갖춘 반도체 패키지 KR960000222B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3234813A JP2882116B2 (ja) 1991-09-13 1991-09-13 ヒートシンク付パッケージ
JP91-234813 1991-09-13

Publications (2)

Publication Number Publication Date
KR930006894A true KR930006894A (ko) 1993-04-22
KR960000222B1 KR960000222B1 (ko) 1996-01-03

Family

ID=16976794

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920016543A KR960000222B1 (ko) 1991-09-13 1992-09-09 히트-싱크를 갖춘 반도체 패키지

Country Status (5)

Country Link
US (1) US5241452A (ko)
EP (1) EP0533067B1 (ko)
JP (1) JP2882116B2 (ko)
KR (1) KR960000222B1 (ko)
DE (1) DE69203057T2 (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5419041A (en) * 1992-08-04 1995-05-30 Aqty Co., Ltd. Process for manufacturing a pin type radiating fin
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
JP3236137B2 (ja) * 1993-07-30 2001-12-10 富士通株式会社 半導体素子冷却装置
US5676198A (en) * 1994-11-15 1997-10-14 Sundstrand Corporation Cooling apparatus for an electronic component
US5709263A (en) * 1995-10-19 1998-01-20 Silicon Graphics, Inc. High performance sinusoidal heat sink for heat removal from electronic equipment
US5957194A (en) * 1996-06-27 1999-09-28 Advanced Thermal Solutions, Inc. Plate fin heat exchanger having fluid control means
US6705388B1 (en) 1997-11-10 2004-03-16 Parker-Hannifin Corporation Non-electrically conductive thermal dissipator for electronic components
DE69728153D1 (de) * 1997-12-16 2004-04-22 St Microelectronics Srl Leiterplattenanordnung bestehend aus einem in einem Kunststoffgehäuse verpackten Leistungshalbleiterbauelement, dessen interne Wärmesenke mit einer externen Wärmesenke gelötet ist
US6308771B1 (en) 1998-10-29 2001-10-30 Advanced Thermal Solutions, Inc. High performance fan tail heat exchanger
US6301779B1 (en) 1998-10-29 2001-10-16 Advanced Thermal Solutions, Inc. Method for fabricating a heat sink having nested extended surfaces
WO2008035452A1 (en) * 2006-09-19 2008-03-27 Mitsubishi Electric Corporation Cooling device for mobile body
CN102627644B (zh) 2012-04-10 2014-04-16 凯莱英医药集团（天津）股份有限公司 一种通过直接手性合成方法制备二盐酸沙丙蝶呤的方法
CN102633799B (zh) 2012-04-10 2014-06-25 凯莱英医药集团（天津）股份有限公司 一种从消旋体中间体拆分路线合成二盐酸沙丙蝶呤的方法
US9484280B2 (en) * 2014-01-11 2016-11-01 Infineon Technologies Austria Ag Semiconductor device and method of manufacturing a semiconductor device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3303392A (en) * 1963-09-10 1967-02-07 Gen Systems Inc Cooling arrangement for electronic devices
US3798506A (en) * 1972-11-15 1974-03-19 Atmos Corp Power control device with heat transfer means
US4884630A (en) * 1988-07-14 1989-12-05 Microelectronics And Computer Technology Corporation End fed liquid heat exchanger for an electronic component
DE4005333A1 (de) * 1990-02-20 1991-08-22 Rehm Schweisstechnik Gmbh Elektronischer leistungs-schalter

Also Published As

Publication number Publication date
EP0533067A1 (en) 1993-03-24
EP0533067B1 (en) 1995-06-21
US5241452A (en) 1993-08-31
JP2882116B2 (ja) 1999-04-12
JPH0574990A (ja) 1993-03-26
KR960000222B1 (ko) 1996-01-03
DE69203057T2 (de) 1995-12-21
DE69203057D1 (de) 1995-07-27

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