DE69203057T2 - Packung mit Wärmesenke. - Google Patents

Packung mit Wärmesenke.

Info

Publication number
DE69203057T2
DE69203057T2 DE69203057T DE69203057T DE69203057T2 DE 69203057 T2 DE69203057 T2 DE 69203057T2 DE 69203057 T DE69203057 T DE 69203057T DE 69203057 T DE69203057 T DE 69203057T DE 69203057 T2 DE69203057 T2 DE 69203057T2
Authority
DE
Germany
Prior art keywords
pack
heat sink
sink
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69203057T
Other languages
English (en)
Other versions
DE69203057D1 (de
Inventor
Sakae Kitajo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE69203057D1 publication Critical patent/DE69203057D1/de
Publication of DE69203057T2 publication Critical patent/DE69203057T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69203057T 1991-09-13 1992-09-11 Packung mit Wärmesenke. Expired - Lifetime DE69203057T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3234813A JP2882116B2 (ja) 1991-09-13 1991-09-13 ヒートシンク付パッケージ

Publications (2)

Publication Number Publication Date
DE69203057D1 DE69203057D1 (de) 1995-07-27
DE69203057T2 true DE69203057T2 (de) 1995-12-21

Family

ID=16976794

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69203057T Expired - Lifetime DE69203057T2 (de) 1991-09-13 1992-09-11 Packung mit Wärmesenke.

Country Status (5)

Country Link
US (1) US5241452A (de)
EP (1) EP0533067B1 (de)
JP (1) JP2882116B2 (de)
KR (1) KR960000222B1 (de)
DE (1) DE69203057T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5419041A (en) * 1992-08-04 1995-05-30 Aqty Co., Ltd. Process for manufacturing a pin type radiating fin
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
JP3236137B2 (ja) * 1993-07-30 2001-12-10 富士通株式会社 半導体素子冷却装置
US5676198A (en) * 1994-11-15 1997-10-14 Sundstrand Corporation Cooling apparatus for an electronic component
US5709263A (en) * 1995-10-19 1998-01-20 Silicon Graphics, Inc. High performance sinusoidal heat sink for heat removal from electronic equipment
US5957194A (en) * 1996-06-27 1999-09-28 Advanced Thermal Solutions, Inc. Plate fin heat exchanger having fluid control means
US6705388B1 (en) 1997-11-10 2004-03-16 Parker-Hannifin Corporation Non-electrically conductive thermal dissipator for electronic components
DE69728153D1 (de) * 1997-12-16 2004-04-22 St Microelectronics Srl Leiterplattenanordnung bestehend aus einem in einem Kunststoffgehäuse verpackten Leistungshalbleiterbauelement, dessen interne Wärmesenke mit einer externen Wärmesenke gelötet ist
US6301779B1 (en) 1998-10-29 2001-10-16 Advanced Thermal Solutions, Inc. Method for fabricating a heat sink having nested extended surfaces
US6308771B1 (en) 1998-10-29 2001-10-30 Advanced Thermal Solutions, Inc. High performance fan tail heat exchanger
CN101516713A (zh) * 2006-09-19 2009-08-26 三菱电机株式会社 移动体用冷却装置
CN102627644B (zh) 2012-04-10 2014-04-16 凯莱英医药集团（天津）股份有限公司 一种通过直接手性合成方法制备二盐酸沙丙蝶呤的方法
CN102633799B (zh) 2012-04-10 2014-06-25 凯莱英医药集团（天津）股份有限公司 一种从消旋体中间体拆分路线合成二盐酸沙丙蝶呤的方法
US9484280B2 (en) * 2014-01-11 2016-11-01 Infineon Technologies Austria Ag Semiconductor device and method of manufacturing a semiconductor device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3303392A (en) * 1963-09-10 1967-02-07 Gen Systems Inc Cooling arrangement for electronic devices
US3798506A (en) * 1972-11-15 1974-03-19 Atmos Corp Power control device with heat transfer means
US4884630A (en) * 1988-07-14 1989-12-05 Microelectronics And Computer Technology Corporation End fed liquid heat exchanger for an electronic component
DE4005333A1 (de) * 1990-02-20 1991-08-22 Rehm Schweisstechnik Gmbh Elektronischer leistungs-schalter

Also Published As

Publication number Publication date
KR930006894A (ko) 1993-04-22
JP2882116B2 (ja) 1999-04-12
US5241452A (en) 1993-08-31
JPH0574990A (ja) 1993-03-26
DE69203057D1 (de) 1995-07-27
KR960000222B1 (ko) 1996-01-03
EP0533067A1 (de) 1993-03-24
EP0533067B1 (de) 1995-06-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition