DE69728153D1 - Leiterplattenanordnung bestehend aus einem in einem Kunststoffgehäuse verpackten Leistungshalbleiterbauelement, dessen interne Wärmesenke mit einer externen Wärmesenke gelötet ist - Google Patents

Leiterplattenanordnung bestehend aus einem in einem Kunststoffgehäuse verpackten Leistungshalbleiterbauelement, dessen interne Wärmesenke mit einer externen Wärmesenke gelötet ist

Info

Publication number
DE69728153D1
DE69728153D1 DE69728153T DE69728153T DE69728153D1 DE 69728153 D1 DE69728153 D1 DE 69728153D1 DE 69728153 T DE69728153 T DE 69728153T DE 69728153 T DE69728153 T DE 69728153T DE 69728153 D1 DE69728153 D1 DE 69728153D1
Authority
DE
Germany
Prior art keywords
heat sink
soldered
circuit board
printed circuit
power semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69728153T
Other languages
English (en)
Inventor
Roberto Tiziani
Roberto Rossi
Claudio Maria Villa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
STMicroelectronics SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SRL filed Critical STMicroelectronics SRL
Application granted granted Critical
Publication of DE69728153D1 publication Critical patent/DE69728153D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69728153T 1997-12-16 1997-12-16 Leiterplattenanordnung bestehend aus einem in einem Kunststoffgehäuse verpackten Leistungshalbleiterbauelement, dessen interne Wärmesenke mit einer externen Wärmesenke gelötet ist Expired - Lifetime DE69728153D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP97830677A EP0926733B1 (de) 1997-12-16 1997-12-16 Leiterplattenanordnung bestehend aus einem in einem Kunststoffgehäuse verpackten Leistungshalbleiterbauelement, dessen interne Wärmesenke mit einer externen Wärmesenke gelötet ist

Publications (1)

Publication Number Publication Date
DE69728153D1 true DE69728153D1 (de) 2004-04-22

Family

ID=8230898

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69728153T Expired - Lifetime DE69728153D1 (de) 1997-12-16 1997-12-16 Leiterplattenanordnung bestehend aus einem in einem Kunststoffgehäuse verpackten Leistungshalbleiterbauelement, dessen interne Wärmesenke mit einer externen Wärmesenke gelötet ist

Country Status (4)

Country Link
US (1) US6195256B1 (de)
EP (1) EP0926733B1 (de)
JP (1) JPH11312769A (de)
DE (1) DE69728153D1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE357742T1 (de) * 1999-12-30 2007-04-15 Texas Instruments Inc Oberflächenmontierter leistungstransistor mit kühlkörper
EP1268253B1 (de) 2000-04-06 2006-08-30 ThyssenKrupp Presta Aktiengesellschaft Lagerungskasten für die lagerung einer lenkwelle
AT409954B (de) * 2000-04-06 2002-12-27 Thyssenkrupp Presta Ag Mehrteiliges mantelrohr für eine lenkwelle
US6483706B2 (en) * 2000-12-22 2002-11-19 Vlt Corporation Heat dissipation for electronic components
US20030168730A1 (en) * 2002-03-08 2003-09-11 Howard Davidson Carbon foam heat exchanger for integrated circuit
CN101448382A (zh) * 2003-06-06 2009-06-03 霍尼韦尔国际公司 热互连系统及其制造和使用的方法
US6987317B2 (en) * 2003-09-30 2006-01-17 Intel Corporation Power delivery using an integrated heat spreader
US7345364B2 (en) * 2004-02-04 2008-03-18 Agere Systems Inc. Structure and method for improved heat conduction for semiconductor devices
US7233497B2 (en) * 2004-10-06 2007-06-19 Hewlett-Packard Development Company, L.P. Surface mount heat sink
DE102006009812B4 (de) * 2006-03-01 2008-09-04 Beru Ag Montageanordnung für mehrere Leistungshalbleiter und Schaltung mit einer solchen Montageanordnung
US20090323288A1 (en) * 2008-06-30 2009-12-31 Bernard Marc R Heat sink slack storage and adaptive operation
CN103563073B (zh) * 2011-05-03 2017-06-09 韦沙戴尔电子公司 用于电子元件的散热器
CN102299127B (zh) * 2011-07-13 2013-12-11 台达电子企业管理（上海）有限公司 用于封装元件的双向散热器及其组装方法
US9484280B2 (en) * 2014-01-11 2016-11-01 Infineon Technologies Austria Ag Semiconductor device and method of manufacturing a semiconductor device
JP7042738B2 (ja) 2015-08-07 2022-03-28 ヴィシェイ デール エレクトロニクス エルエルシー 成形体、および高電圧用途を対象とする、成形体を有する電気装置
US10123460B2 (en) * 2015-11-13 2018-11-06 Covidien LLP System and method for thermal management of electronic devices
DE102019206523A1 (de) * 2019-05-07 2020-11-12 Zf Friedrichshafen Ag Leistungsmodul mit gehäusten Leistungshalbleitern zur steuerbaren elektrischen Leistungsversorgung eines Verbrauchers
CN110729546A (zh) * 2019-10-18 2020-01-24 大连大学 一种5g天线散热器
US11908771B2 (en) 2021-11-12 2024-02-20 Infineon Technologies Ag Power semiconductor device with dual heat dissipation structures

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5471572A (en) * 1977-11-18 1979-06-08 Fujitsu Ltd Semiconductor device
JPS57117263A (en) * 1981-01-12 1982-07-21 Mitsubishi Electric Corp Cooler for dual-in-line package type integrated circuit element
JPS5947750A (ja) * 1982-09-10 1984-03-17 Hitachi Ltd 面取付型半導体装置
JPS6292347A (ja) * 1985-10-17 1987-04-27 Mitsubishi Electric Corp 半導体装置用放熱フイン
FR2625038B1 (fr) * 1987-12-22 1990-08-17 Cit Alcatel Procede et dispositif de refroidissement d'un boitier de circuit integre
US4914551A (en) * 1988-07-13 1990-04-03 International Business Machines Corporation Electronic package with heat spreader member
US5216283A (en) * 1990-05-03 1993-06-01 Motorola, Inc. Semiconductor device having an insertable heat sink and method for mounting the same
JP2882116B2 (ja) * 1991-09-13 1999-04-12 日本電気株式会社 ヒートシンク付パッケージ
JP3086340B2 (ja) * 1992-08-04 2000-09-11 ローム株式会社 ヒートシンク付き電子部品のプリント基板への半田実装方法
US5272599A (en) * 1993-03-19 1993-12-21 Compaq Computer Corporation Microprocessor heat dissipation apparatus for a printed circuit board

Also Published As

Publication number Publication date
US6195256B1 (en) 2001-02-27
EP0926733A1 (de) 1999-06-30
JPH11312769A (ja) 1999-11-09
EP0926733B1 (de) 2004-03-17

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