KR950004502A - 방열판을 구비한 플라스틱 패키지 - Google Patents

방열판을 구비한 플라스틱 패키지 Download PDF

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Publication number
KR950004502A
KR950004502A KR1019930013664A KR930013664A KR950004502A KR 950004502 A KR950004502 A KR 950004502A KR 1019930013664 A KR1019930013664 A KR 1019930013664A KR 930013664 A KR930013664 A KR 930013664A KR 950004502 A KR950004502 A KR 950004502A
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KR
South Korea
Prior art keywords
heat sink
metal plate
plastic package
heat
paddle
Prior art date
Application number
KR1019930013664A
Other languages
English (en)
Other versions
KR960000705B1 (ko
Inventor
전흥섭
Original Assignee
문정환
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, 금성일렉트론 주식회사 filed Critical 문정환
Priority to KR1019930013664A priority Critical patent/KR960000705B1/ko
Publication of KR950004502A publication Critical patent/KR950004502A/ko
Application granted granted Critical
Publication of KR960000705B1 publication Critical patent/KR960000705B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

본 발명은 방열판을 구비한 플라스틱 패키지에 관한 것으로 방열판 재질의 선택폭을 넓히면서도 방열효과를 극대화 시키기 위하여 반도체칩(1)이 부착고정되는 패들(2a)의 하면에 칩(1)에서 발생되는 열을 리드(2b)를 통하여 방출시키기 위한 절연부재로 이루어지는 방열판(5)이 부착된 방열판을 구비한 플라스틱 패키지를 구성함에 있어서, 상기 방열판(5)의 상, 하부에 열전달을 촉진시키기 위한 금속판(10)(10′)을 각각 부착하여 구성한 것을 특징으로 하고 있으며, 상기 상부 금속판(10)을 패들부(10-1)와 리드부(10-2)로 각각 분할 형성되고, 패들부 금속판(10-1)과 하부 금속판(10′)은 수개의 비어홀(10a)에 의해 상호 연결되어 있다.

Description

방열판을 구비한 플라스틱 패키지
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명에 의한 방열판을 구비한 플라스틱 패키지의 구조를 보인 종단면도.

Claims (2)

  1. 반도체 칩(1)이 부착 고정되는 패들(2a)의 하면에 칩(1)에서 발생되는 열을 리드(2b)를 통하여 방출시키기 위한 절연부재로 이루어지는 방열판(5)이 부착된 방열판을 구비한 플라스틱 패키지를 구성함에 있어서, 상기 방열판(5)의 상, 하부에열전달을 촉진시키기 위한 금속판(10)(10')을 각각 부착하여 구성한 것을 특징으로 하는 방열판을 구비한 플라스틱 패키지.
  2. 제1항에 있어서, 상기 상부 금속판(10)은 패들부(10-1)와 리드부(10-2)로 각각 분할 형성되고, 패들부 금속판(10-1)과 하부금속판(10')은 수개의 비어홀(10a)에 의해 상호 연결된 것을 특징으로 하는 방열판을 구비한 플라스틱 패키지.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930013664A 1993-07-20 1993-07-20 방열판을 구비한 플라스틱 패키지 KR960000705B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019930013664A KR960000705B1 (ko) 1993-07-20 1993-07-20 방열판을 구비한 플라스틱 패키지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019930013664A KR960000705B1 (ko) 1993-07-20 1993-07-20 방열판을 구비한 플라스틱 패키지

Publications (2)

Publication Number Publication Date
KR950004502A true KR950004502A (ko) 1995-02-18
KR960000705B1 KR960000705B1 (ko) 1996-01-11

Family

ID=19359596

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930013664A KR960000705B1 (ko) 1993-07-20 1993-07-20 방열판을 구비한 플라스틱 패키지

Country Status (1)

Country Link
KR (1) KR960000705B1 (ko)

Also Published As

Publication number Publication date
KR960000705B1 (ko) 1996-01-11

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