DE69300853T3 - Verfahren zum Montieren von Bauteilen und Vorrichtung dafür. - Google Patents

Verfahren zum Montieren von Bauteilen und Vorrichtung dafür.

Info

Publication number
DE69300853T3
DE69300853T3 DE69300853T DE69300853T DE69300853T3 DE 69300853 T3 DE69300853 T3 DE 69300853T3 DE 69300853 T DE69300853 T DE 69300853T DE 69300853 T DE69300853 T DE 69300853T DE 69300853 T3 DE69300853 T3 DE 69300853T3
Authority
DE
Germany
Prior art keywords
device therefor
assembling components
assembling
components
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69300853T
Other languages
English (en)
Other versions
DE69300853D1 (de
DE69300853T2 (de
Inventor
Hiroyuki Ohta
Kenichi Indo
Hiroshi Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26495978&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69300853(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP4174328A external-priority patent/JP2528418B2/ja
Priority claimed from JP4208284A external-priority patent/JP2554424B2/ja
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Publication of DE69300853D1 publication Critical patent/DE69300853D1/de
Publication of DE69300853T2 publication Critical patent/DE69300853T2/de
Application granted granted Critical
Publication of DE69300853T3 publication Critical patent/DE69300853T3/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53252—Means to simultaneously fasten three or more parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE69300853T 1992-07-01 1993-07-01 Verfahren zum Montieren von Bauteilen und Vorrichtung dafür. Expired - Lifetime DE69300853T3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4174328A JP2528418B2 (ja) 1992-07-01 1992-07-01 部品装着方法及び装置
JP4208284A JP2554424B2 (ja) 1992-08-04 1992-08-04 部品装着装置

Publications (3)

Publication Number Publication Date
DE69300853D1 DE69300853D1 (de) 1996-01-04
DE69300853T2 DE69300853T2 (de) 1996-03-28
DE69300853T3 true DE69300853T3 (de) 1999-05-12

Family

ID=26495978

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69300853T Expired - Lifetime DE69300853T3 (de) 1992-07-01 1993-07-01 Verfahren zum Montieren von Bauteilen und Vorrichtung dafür.

Country Status (3)

Country Link
US (1) US5660519A (de)
EP (1) EP0582086B2 (de)
DE (1) DE69300853T3 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6435808B1 (en) * 1993-10-06 2002-08-20 Tdk Corporation Chip-type circuit element mounting apparatus
WO1996005477A1 (en) * 1994-08-11 1996-02-22 Cyberoptics Corporation High precision semiconductor component alignment systems
JPH08139499A (ja) * 1994-11-11 1996-05-31 Yamaha Motor Co Ltd 円筒状部品の認識方法
US6400459B1 (en) 1995-02-24 2002-06-04 Cyberoptics Corp. Methods and apparatus for using optical sensors in component replacement heads
US6230393B1 (en) * 1997-07-07 2001-05-15 Matsushita Electric Industrial Co., Ltd. Method and device for mounting electronic component
WO1999016010A1 (en) * 1997-09-22 1999-04-01 Intelligent Reasoning Systems, Inc. Automated visual inspection system and process for detecting and classifying defects
US6538750B1 (en) 1998-05-22 2003-03-25 Cyberoptics Corporation Rotary sensor system with a single detector
US6292261B1 (en) 1998-05-22 2001-09-18 Cyberoptics Corporation Rotary sensor system with at least two detectors
GB2347741A (en) 1998-11-05 2000-09-13 Cyberoptics Corp Electronics assembly apparatus with improved imaging system
KR100718202B1 (ko) * 1999-08-11 2007-05-15 지멘스 악티엔게젤샤프트 조립장치
EP1076357A1 (de) * 1999-08-11 2001-02-14 SiMoTec GmbH Montagevorrichtung zur Herstellung microsystemtechnischer Produkte
US6538244B1 (en) 1999-11-03 2003-03-25 Cyberoptics Corporation Pick and place machine with improved vision system including a linescan sensor
US6535291B1 (en) * 2000-06-07 2003-03-18 Cyberoptics Corporation Calibration methods for placement machines incorporating on-head linescan sensing
US6996440B2 (en) * 2000-08-04 2006-02-07 Matsushita Electric Industrial Co., Ltd. Method for optimization of an order of component mounting, apparatus using the same, and mounter
US7813559B2 (en) 2001-11-13 2010-10-12 Cyberoptics Corporation Image analysis for pick and place machines with in situ component placement inspection
US7555831B2 (en) * 2001-11-13 2009-07-07 Cyberoptics Corporation Method of validating component feeder exchanges
US7239399B2 (en) * 2001-11-13 2007-07-03 Cyberoptics Corporation Pick and place machine with component placement inspection
US7559134B2 (en) * 2003-11-04 2009-07-14 Cyberoptics Corporation Pick and place machine with improved component placement inspection
US7706595B2 (en) * 2003-11-07 2010-04-27 Cyberoptics Corporation Pick and place machine with workpiece motion inspection
US20050125993A1 (en) * 2003-11-07 2005-06-16 Madsen David D. Pick and place machine with improved setup and operation procedure
US20060016066A1 (en) * 2004-07-21 2006-01-26 Cyberoptics Corporation Pick and place machine with improved inspection
US20060075631A1 (en) * 2004-10-05 2006-04-13 Case Steven K Pick and place machine with improved component pick up inspection
US20070003126A1 (en) * 2005-05-19 2007-01-04 Case Steven K Method and apparatus for evaluating a component pick action in an electronics assembly machine
JP4896136B2 (ja) * 2005-09-14 2012-03-14 サイバーオプティクス コーポレーション 改善された構成部品ピックイメージ処理を備えたピックアンドプレース機
WO2007053557A1 (en) * 2005-10-31 2007-05-10 Cyberoptics Corporation Electronics assembly machine with embedded solder paste inspection
US20070276867A1 (en) * 2006-05-23 2007-11-29 David Fishbaine Embedded inspection image archival for electronics assembly machines
US7746481B2 (en) 2007-03-20 2010-06-29 Cyberoptics Corporation Method for measuring center of rotation of a nozzle of a pick and place machine using a collimated laser beam
WO2008153885A1 (en) * 2007-06-05 2008-12-18 Cyberoptics Corporation Component sensor for pick and place machine using improved shadow imaging
USD772426S1 (en) 2014-01-13 2016-11-22 Gilson, Inc. Pipette system cartridge
CN105496093B (zh) * 2016-01-19 2021-05-07 苏州復朗特精密电子科技有限公司 可自动夹取展示物的展示装置
JP6528133B2 (ja) * 2016-03-04 2019-06-12 パナソニックＩｐマネジメント株式会社 部品実装装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4305130A (en) * 1979-05-29 1981-12-08 University Of Rhode Island Apparatus and method to enable a robot with vision to acquire, orient and transport workpieces
DE3474750D1 (en) * 1983-11-05 1988-11-24 Zevatech Ag Method and device positioning elements on a work piece
US4910859A (en) * 1984-04-06 1990-03-27 Holcomb Gregory W Circuit assembly system
US4598456A (en) * 1984-10-19 1986-07-08 Westinghouse Electric Corp. Assembly system for electronic circuit boards
US4727471A (en) * 1985-08-29 1988-02-23 The Board Of Governors For Higher Education, State Of Rhode Island And Providence Miniature lightweight digital camera for robotic vision system applications
US4762578A (en) * 1987-04-28 1988-08-09 Universal Instruments Corporation Non-contact sensing and controlling of spacing between a depositing tip and each selected depositing location on a substrate
DE3823836A1 (de) * 1988-07-14 1990-01-18 Fraunhofer Ges Forschung Verfahren zum vermessen von der bestueckung von leiterplatten dienenden bauelementen und einrichtung zur durchfuehrung des verfahrens
US4893183A (en) * 1988-08-11 1990-01-09 Carnegie-Mellon University Robotic vision system
JPH02165699A (ja) * 1988-12-20 1990-06-26 Matsushita Electric Ind Co Ltd 産業用ロボットによるフラットパッケージ型ｉｃの装着方法
JP2620646B2 (ja) * 1989-06-07 1997-06-18 三洋電機株式会社 電子部品自動装着装置
JPH0810795B2 (ja) * 1989-09-06 1996-01-31 松下電器産業株式会社 電子部品の実装装置及び実装方法
JPH0494600A (ja) * 1990-08-11 1992-03-26 Tdk Corp 電子部品装着方法及び装置
US5154316A (en) * 1990-11-14 1992-10-13 Gregory W. Holcomb Horizontal oscillatory feeder
US5105528A (en) * 1991-01-22 1992-04-21 Universal Instruments Corporation Method and apparatus for supplying and changing tips of a pick and place vacuum spindle
US5278634A (en) * 1991-02-22 1994-01-11 Cyberoptics Corporation High precision component alignment sensor system

Also Published As

Publication number Publication date
EP0582086A1 (de) 1994-02-09
DE69300853D1 (de) 1996-01-04
US5660519A (en) 1997-08-26
DE69300853T2 (de) 1996-03-28
EP0582086B2 (de) 1999-01-13
EP0582086B1 (de) 1995-11-22

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8366 Restricted maintained after opposition proceedings