KR960009132A - 반도체 집적회로용 플랫 패키지 - Google Patents
반도체 집적회로용 플랫 패키지 Download PDFInfo
- Publication number
- KR960009132A KR960009132A KR1019950025019A KR19950025019A KR960009132A KR 960009132 A KR960009132 A KR 960009132A KR 1019950025019 A KR1019950025019 A KR 1019950025019A KR 19950025019 A KR19950025019 A KR 19950025019A KR 960009132 A KR960009132 A KR 960009132A
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- Prior art keywords
- semiconductor integrated
- sealing
- flat package
- suspension
- cavity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
- H01L2924/30111—Impedance matching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
반도체 집적회로용 플랫 패키지에 있어서, 기판은 캐비티와 밀봉도 금부 각각을 현수 리드에 접속하는 내부 접지 배선을 포함한다. 현수 리드는 차폐를 목적으로 접지되어 있다. 이러한 구성으로, 패키지는 유효한 리드의 수를 제한하는 접지 전용 리드를 필요로 하지 않는다.
또한, 단일 표준 형태의 IC는 사용자의 요구에 의해 다양한 차폐 구성을 제공할 수 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도는 본 실시예, 특히 성형된 상태의 리드와 현수 리드의 부분사시도.
Claims (4)
- 반도체칩을 장착하기 위한 도금된 캐비티와 밀봉용 금속 캡을 밀봉하는 밀봉도금부를 포함하는 기판과, 쿼드형 프레임과 상기 프레임의 중앙에 상기 기판을 유지하기 위한 상기 프레임의 4모서리에 각각 위치하는 4개의 현수 리드를 포함하는 리드 프레임을 포함하는 플랫 패키지에 있어서, 상기 기판이 상기 캐비티와 상기 밀봉도금부 각각을 상기 현수리드에 접속하는 접지용 제1내부 배선과 접지용 제2내부 배선을 추가로 포함하는 것을 특징으로 하는 반도체 집적회로용 플랫 패키지.
- 제1항에 있어서, 상기 4개의 현수 리드가 상기 접지용 제1내부 배선과 상기 접지용 제2내부 배선에 각각 접속하는 제1현수 리드와 제2현수 리드로 구성된 것을 특징으로 하는 반도체 집적회로용 플랫 패키지.
- 제1항에 있어서, 상기 기판이 도전성 필름을 포함하는 다층기판으로 구성되며, 상기 4개의 현수 리드와 상기 캐비티 또는 밀봉도 금부가 홀을 통해 상기 도전성 필름과 접속되어 있는 것을 특징으로 하는 반도체 집적회로용 플랫 패키지.
- 제1항에 있어서, 상기 4개의 현수 리드중에서 서로 마주보는 2개의 현수 리드가 상기 캐비티에 접속되어 있고 나머지 다른 2개의 현수 리드가 상기 밀봉도금부와 접속된 것을 특징으로 하는 반도체 집적회로용 플랫 패키지.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19261394A JP2594762B2 (ja) | 1994-08-16 | 1994-08-16 | フラットパッケージ |
JP94-192613 | 1994-08-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960009132A true KR960009132A (ko) | 1996-03-22 |
KR0178567B1 KR0178567B1 (ko) | 1999-03-20 |
Family
ID=16294178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950025019A KR0178567B1 (ko) | 1994-08-16 | 1995-08-14 | 반도체 집적회로용 플랫 패키지 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5616954A (ko) |
EP (1) | EP0697731B1 (ko) |
JP (1) | JP2594762B2 (ko) |
KR (1) | KR0178567B1 (ko) |
DE (1) | DE69528869T2 (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5861667A (en) * | 1997-03-11 | 1999-01-19 | Texas Instruments Incorporated | Single end in out arrangement |
JPH10288625A (ja) * | 1997-04-15 | 1998-10-27 | Mitsubishi Electric Corp | 半導体加速度検出装置 |
US6025616A (en) * | 1997-06-25 | 2000-02-15 | Honeywell Inc. | Power distribution system for semiconductor die |
US5903051A (en) * | 1998-04-03 | 1999-05-11 | Motorola, Inc. | Electronic component and method of manufacture |
JP4072505B2 (ja) * | 2003-02-28 | 2008-04-09 | エルピーダメモリ株式会社 | 積層型半導体パッケージ |
US7563646B2 (en) * | 2007-05-31 | 2009-07-21 | Stratedge Corporation | Molded ceramic surface mount package |
TWI405313B (zh) * | 2010-03-31 | 2013-08-11 | Quanta Comp Inc | 具側邊接腳之積體電路封裝元件 |
US8525321B2 (en) | 2011-07-06 | 2013-09-03 | Fairchild Semiconductor Corporation | Conductive chip disposed on lead semiconductor package |
CN102437061A (zh) * | 2011-11-30 | 2012-05-02 | 深圳市威怡电气有限公司 | 电子元件及其封装方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5521110A (en) * | 1978-08-02 | 1980-02-15 | Oki Electric Ind Co Ltd | Package for accommodating semiconductor parts |
JPS6245156A (ja) * | 1985-08-23 | 1987-02-27 | Hitachi Ltd | 気密封止電子装置 |
US4972253A (en) * | 1988-06-27 | 1990-11-20 | Digital Equipment Corporation | Programmable ceramic high performance custom package |
JPH0281459A (ja) * | 1988-09-16 | 1990-03-22 | Sumitomo Electric Ind Ltd | Icパッケージ |
JPH03256351A (ja) * | 1990-03-06 | 1991-11-15 | Nec Corp | 半導体装置 |
US5043534A (en) * | 1990-07-02 | 1991-08-27 | Olin Corporation | Metal electronic package having improved resistance to electromagnetic interference |
US5168344A (en) * | 1990-08-15 | 1992-12-01 | W. R. Grace & Co. Conn. | Ceramic electronic package design |
JPH0498857A (ja) * | 1990-08-16 | 1992-03-31 | Nec Kyushu Ltd | 半導体装置用パッケージ |
JP3009788B2 (ja) * | 1991-11-15 | 2000-02-14 | 日本特殊陶業株式会社 | 集積回路用パッケージ |
EP0547807A3 (en) * | 1991-12-16 | 1993-09-22 | General Electric Company | Packaged electronic system |
JP3105089B2 (ja) * | 1992-09-11 | 2000-10-30 | 株式会社東芝 | 半導体装置 |
JP2912779B2 (ja) * | 1992-11-26 | 1999-06-28 | 京セラ株式会社 | 半導体素子収納用パッケージの製造方法 |
-
1994
- 1994-08-16 JP JP19261394A patent/JP2594762B2/ja not_active Expired - Fee Related
-
1995
- 1995-08-14 KR KR1019950025019A patent/KR0178567B1/ko not_active IP Right Cessation
- 1995-08-16 US US08/515,600 patent/US5616954A/en not_active Expired - Fee Related
- 1995-08-16 EP EP19950112887 patent/EP0697731B1/en not_active Expired - Lifetime
- 1995-08-16 DE DE1995628869 patent/DE69528869T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0697731B1 (en) | 2002-11-20 |
DE69528869D1 (de) | 2003-01-02 |
US5616954A (en) | 1997-04-01 |
JP2594762B2 (ja) | 1997-03-26 |
JPH0855949A (ja) | 1996-02-27 |
DE69528869T2 (de) | 2004-02-26 |
EP0697731A3 (en) | 1997-07-16 |
EP0697731A2 (en) | 1996-02-21 |
KR0178567B1 (ko) | 1999-03-20 |
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