JPS5521110A - Package for accommodating semiconductor parts - Google Patents

Package for accommodating semiconductor parts

Info

Publication number
JPS5521110A
JPS5521110A JP9356178A JP9356178A JPS5521110A JP S5521110 A JPS5521110 A JP S5521110A JP 9356178 A JP9356178 A JP 9356178A JP 9356178 A JP9356178 A JP 9356178A JP S5521110 A JPS5521110 A JP S5521110A
Authority
JP
Japan
Prior art keywords
seal ring
connection
wiring
external leads
metalized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9356178A
Other languages
Japanese (ja)
Inventor
Hiromi Morita
Kazuo Yamaguchi
Keiji Murasawa
Tsutomu Kamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Oki Electric Industry Co Ltd
Original Assignee
Nippon Telegraph and Telephone Corp
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp, Oki Electric Industry Co Ltd filed Critical Nippon Telegraph and Telephone Corp
Priority to JP9356178A priority Critical patent/JPS5521110A/en
Publication of JPS5521110A publication Critical patent/JPS5521110A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To reduce an impedance of a metalized wiring and an inductive noise from the exterior by effecting through a through-hole and seal ring a connection between a wiring metalized pattern and external leads.
CONSTITUTION: A minute wiring metalized pattern 6 is connected to a seal ring 3 through a through hole 10 and the connection from the seal ring 3 to external leads 4 is achieved by an electric resistance reducing metalized pattern 9. According to such a construction, the impedance can be considerably reduced compared with a conventional manner wherein the connection to the external leads was achieved through an intermediate layer 8, because a cap 2 is connected with the earth lead in a low impedance, a shielding effect to the inductive noise from the exterior can be effectively achieved.
COPYRIGHT: (C)1980,JPO&Japio
JP9356178A 1978-08-02 1978-08-02 Package for accommodating semiconductor parts Pending JPS5521110A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9356178A JPS5521110A (en) 1978-08-02 1978-08-02 Package for accommodating semiconductor parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9356178A JPS5521110A (en) 1978-08-02 1978-08-02 Package for accommodating semiconductor parts

Publications (1)

Publication Number Publication Date
JPS5521110A true JPS5521110A (en) 1980-02-15

Family

ID=14085651

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9356178A Pending JPS5521110A (en) 1978-08-02 1978-08-02 Package for accommodating semiconductor parts

Country Status (1)

Country Link
JP (1) JPS5521110A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0697731A3 (en) * 1994-08-16 1997-07-16 Nec Corp Flat package for semiconductor IC
US6879023B1 (en) * 2000-03-22 2005-04-12 Broadcom Corporation Seal ring for integrated circuits

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0697731A3 (en) * 1994-08-16 1997-07-16 Nec Corp Flat package for semiconductor IC
US6879023B1 (en) * 2000-03-22 2005-04-12 Broadcom Corporation Seal ring for integrated circuits
US7087496B2 (en) 2000-03-22 2006-08-08 Broadcom Corporation Seal ring for integrated circuits

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