JPS5521110A - Package for accommodating semiconductor parts - Google Patents
Package for accommodating semiconductor partsInfo
- Publication number
- JPS5521110A JPS5521110A JP9356178A JP9356178A JPS5521110A JP S5521110 A JPS5521110 A JP S5521110A JP 9356178 A JP9356178 A JP 9356178A JP 9356178 A JP9356178 A JP 9356178A JP S5521110 A JPS5521110 A JP S5521110A
- Authority
- JP
- Japan
- Prior art keywords
- seal ring
- connection
- wiring
- external leads
- metalized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To reduce an impedance of a metalized wiring and an inductive noise from the exterior by effecting through a through-hole and seal ring a connection between a wiring metalized pattern and external leads.
CONSTITUTION: A minute wiring metalized pattern 6 is connected to a seal ring 3 through a through hole 10 and the connection from the seal ring 3 to external leads 4 is achieved by an electric resistance reducing metalized pattern 9. According to such a construction, the impedance can be considerably reduced compared with a conventional manner wherein the connection to the external leads was achieved through an intermediate layer 8, because a cap 2 is connected with the earth lead in a low impedance, a shielding effect to the inductive noise from the exterior can be effectively achieved.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9356178A JPS5521110A (en) | 1978-08-02 | 1978-08-02 | Package for accommodating semiconductor parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9356178A JPS5521110A (en) | 1978-08-02 | 1978-08-02 | Package for accommodating semiconductor parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5521110A true JPS5521110A (en) | 1980-02-15 |
Family
ID=14085651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9356178A Pending JPS5521110A (en) | 1978-08-02 | 1978-08-02 | Package for accommodating semiconductor parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5521110A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0697731A3 (en) * | 1994-08-16 | 1997-07-16 | Nec Corp | Flat package for semiconductor IC |
US6879023B1 (en) * | 2000-03-22 | 2005-04-12 | Broadcom Corporation | Seal ring for integrated circuits |
-
1978
- 1978-08-02 JP JP9356178A patent/JPS5521110A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0697731A3 (en) * | 1994-08-16 | 1997-07-16 | Nec Corp | Flat package for semiconductor IC |
US6879023B1 (en) * | 2000-03-22 | 2005-04-12 | Broadcom Corporation | Seal ring for integrated circuits |
US7087496B2 (en) | 2000-03-22 | 2006-08-08 | Broadcom Corporation | Seal ring for integrated circuits |
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