KR920022337A - 한계 개폐장치 - Google Patents
한계 개폐장치 Download PDFInfo
- Publication number
- KR920022337A KR920022337A KR1019920007430A KR920007430A KR920022337A KR 920022337 A KR920022337 A KR 920022337A KR 1019920007430 A KR1019920007430 A KR 1019920007430A KR 920007430 A KR920007430 A KR 920007430A KR 920022337 A KR920022337 A KR 920022337A
- Authority
- KR
- South Korea
- Prior art keywords
- film
- solvent
- ceramic
- derived
- hydrogen silsesquioxane
- Prior art date
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 8
- 239000000919 ceramic Substances 0.000 claims 6
- 238000000034 method Methods 0.000 claims 4
- 229920003209 poly(hydridosilsesquioxane) Polymers 0.000 claims 4
- 239000000377 silicon dioxide Substances 0.000 claims 4
- 239000002904 solvent Substances 0.000 claims 4
- 230000001590 oxidative effect Effects 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 235000012239 silicon dioxide Nutrition 0.000 claims 3
- 238000005524 ceramic coating Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000002243 precursor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 239000012528 membrane Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/06—Physical realisation, i.e. hardware implementation of neural networks, neurons or parts of neurons
- G06N3/063—Physical realisation, i.e. hardware implementation of neural networks, neurons or parts of neurons using electronic means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
- H10B63/82—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays the switching components having a common active material layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/021—Formation of switching materials, e.g. deposition of layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/883—Oxides or nitrides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biomedical Technology (AREA)
- Biophysics (AREA)
- Neurology (AREA)
- Mathematical Physics (AREA)
- Data Mining & Analysis (AREA)
- Evolutionary Computation (AREA)
- General Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computational Linguistics (AREA)
- Software Systems (AREA)
- Artificial Intelligence (AREA)
- Manufacturing & Machinery (AREA)
- Formation Of Insulating Films (AREA)
- Semiconductor Memories (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Silicon Compounds (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 전극(1) 및 (2)가 박막(3)에 의해 분리된, 본 발명의 대표적인 장치의 단면도이고,
제2도는 본 발명의 한계 개폐 거동을 도식적으로 나타낸 것이며,
제3도는 본 발명에 따른 장치의 적용된 전압에 따른 전류의 변화를 도식적으로 나타낸 것이다.
Claims (9)
- 수소 실세스퀴옥산 수질부터 유도된 농밀하지 않은 이산화규소 막을 2개 이상의 전극 사이에 침착시킨 다음, 전극을 통해 한계 전압 이상의 전압을 적용하여 장치를 제조함을 특징으로 하여, 네가티브 차동 저항을 나타내는 한계 개폐장치를 제조하는 방법.
- 제1항에 있어서, 이산화규소 막이, 기질을 용매와 수소 실세스퀴옥산 수지를 포함하는 용액으로 피복하고, 용매를 증발시켜 예비 세라믹 피막을 형성시킨 다음, 예비 세라믹 피막을 열분해시킴을 포함하는 방법에 의해 침착되는 방법.
- 제1항에 있어서, 장치가 비산화 대기중에 배치되는방법.
- 수소 실쉐퀴옥산 수지로부터 유도된 이산화규소와 개질 세라믹 산화물 전구체로부터 유도된 하나 이상의 개질 세라막 산화물을 포함하는 농밀하지 않은 막을 2개 이상의 전극 사이에 침착시킨 다음, 전극을 통해 한계 전압 이상의 전압을 적용하여 장치를 제조함을 특징으로 하여, 네가티브 차동 저항을 나타내는 한계 개폐장치를 제조하는 방법.
- 제4항에 있어서, 막이, 용매, 수소 실세스퀴옥산 수지 및 개질 세라믹 산화물 전구체를 포함하는 용액을 기질에 피복하고, 용매를 증발시켜 에비 세라믹 피막을 형성시킨 다음, 예비 세라믹 피막을 열분해시킴을 포함하는 방법에 의해 침착되는 방법.
- 제4항에 있어서, 장치가 비산화 대기중에 배치되는 방법.
- 수소 실세스퀴옥산으로부터 유도된 실리카를 포함하는 물질과 직접 접촉하는 2개 이상의 리드(lead)를 포함하는 한계 개폐장치.
- 제7항에 있어서, 장치가 비산화 대기중에 배치되는 장치.
- 제7항에 있어서, 물질이 또한 하나 이상의 개질 세라믹 산화물을 포함하는 장치.※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/674721 | 1991-05-02 | ||
US7/694721 | 1991-05-02 | ||
US07/694,721 US5312684A (en) | 1991-05-02 | 1991-05-02 | Threshold switching device |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920022337A true KR920022337A (ko) | 1992-12-19 |
KR100200399B1 KR100200399B1 (ko) | 1999-06-15 |
Family
ID=24790016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920007430A KR100200399B1 (ko) | 1991-05-02 | 1992-05-01 | 한계 개폐장치 및 이의 제조방법 |
Country Status (12)
Country | Link |
---|---|
US (5) | US5312684A (ko) |
EP (1) | EP0512717B1 (ko) |
JP (2) | JP2683782B2 (ko) |
KR (1) | KR100200399B1 (ko) |
CN (1) | CN1029652C (ko) |
AU (1) | AU641092B2 (ko) |
BR (1) | BR9201622A (ko) |
CA (1) | CA2067413A1 (ko) |
DE (1) | DE69202815T2 (ko) |
ES (1) | ES2075620T3 (ko) |
MX (1) | MX9202033A (ko) |
TW (1) | TW230277B (ko) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4882220A (en) * | 1988-02-02 | 1989-11-21 | Kanebo, Ltd. | Fibrous structures having a durable fragrance |
US5422982A (en) * | 1991-05-02 | 1995-06-06 | Dow Corning Corporation | Neural networks containing variable resistors as synapses |
US5339211A (en) * | 1991-05-02 | 1994-08-16 | Dow Corning Corporation | Variable capacitor |
US5312684A (en) * | 1991-05-02 | 1994-05-17 | Dow Corning Corporation | Threshold switching device |
US5320868A (en) * | 1993-09-13 | 1994-06-14 | Dow Corning Corporation | Method of forming SI-O containing coatings |
US5403748A (en) * | 1993-10-04 | 1995-04-04 | Dow Corning Corporation | Detection of reactive gases |
DE69510337T2 (de) * | 1994-12-22 | 1999-12-16 | Koninkl Philips Electronics Nv | Halbleiterspeicheranordnungen und herstellungsverfahren |
US5879955A (en) * | 1995-06-07 | 1999-03-09 | Micron Technology, Inc. | Method for fabricating an array of ultra-small pores for chalcogenide memory cells |
US5869843A (en) * | 1995-06-07 | 1999-02-09 | Micron Technology, Inc. | Memory array having a multi-state element and method for forming such array or cells thereof |
US5831276A (en) | 1995-06-07 | 1998-11-03 | Micron Technology, Inc. | Three-dimensional container diode for use with multi-state material in a non-volatile memory cell |
US6420725B1 (en) * | 1995-06-07 | 2002-07-16 | Micron Technology, Inc. | Method and apparatus for forming an integrated circuit electrode having a reduced contact area |
US5616202A (en) * | 1995-06-26 | 1997-04-01 | Dow Corning Corporation | Enhanced adhesion of H-resin derived silica to gold |
US6653733B1 (en) | 1996-02-23 | 2003-11-25 | Micron Technology, Inc. | Conductors in semiconductor devices |
US6025220A (en) | 1996-06-18 | 2000-02-15 | Micron Technology, Inc. | Method of forming a polysilicon diode and devices incorporating such diode |
US6337266B1 (en) | 1996-07-22 | 2002-01-08 | Micron Technology, Inc. | Small electrode for chalcogenide memories |
US5998244A (en) * | 1996-08-22 | 1999-12-07 | Micron Technology, Inc. | Memory cell incorporating a chalcogenide element and method of making same |
US6015977A (en) | 1997-01-28 | 2000-01-18 | Micron Technology, Inc. | Integrated circuit memory cell having a small active area and method of forming same |
US6743856B1 (en) | 1997-04-21 | 2004-06-01 | Honeywell International Inc. | Synthesis of siloxane resins |
US6015457A (en) * | 1997-04-21 | 2000-01-18 | Alliedsignal Inc. | Stable inorganic polymers |
US6143855A (en) | 1997-04-21 | 2000-11-07 | Alliedsignal Inc. | Organohydridosiloxane resins with high organic content |
US6218497B1 (en) | 1997-04-21 | 2001-04-17 | Alliedsignal Inc. | Organohydridosiloxane resins with low organic content |
US5952671A (en) * | 1997-05-09 | 1999-09-14 | Micron Technology, Inc. | Small electrode for a chalcogenide switching device and method for fabricating same |
US6087689A (en) | 1997-06-16 | 2000-07-11 | Micron Technology, Inc. | Memory cell having a reduced active area and a memory array incorporating the same |
JP3211752B2 (ja) * | 1997-11-10 | 2001-09-25 | 日本電気株式会社 | Mim又はmis電子源の構造及びその製造方法 |
US6218020B1 (en) | 1999-01-07 | 2001-04-17 | Alliedsignal Inc. | Dielectric films from organohydridosiloxane resins with high organic content |
US6177199B1 (en) | 1999-01-07 | 2001-01-23 | Alliedsignal Inc. | Dielectric films from organohydridosiloxane resins with low organic content |
US6472076B1 (en) | 1999-10-18 | 2002-10-29 | Honeywell International Inc. | Deposition of organosilsesquioxane films |
US6440550B1 (en) | 1999-10-18 | 2002-08-27 | Honeywell International Inc. | Deposition of fluorosilsesquioxane films |
US6572974B1 (en) | 1999-12-06 | 2003-06-03 | The Regents Of The University Of Michigan | Modification of infrared reflectivity using silicon dioxide thin films derived from silsesquioxane resins |
US6440837B1 (en) | 2000-07-14 | 2002-08-27 | Micron Technology, Inc. | Method of forming a contact structure in a semiconductor device |
US6563156B2 (en) * | 2001-03-15 | 2003-05-13 | Micron Technology, Inc. | Memory elements and methods for making same |
US7221582B2 (en) * | 2003-08-27 | 2007-05-22 | Hewlett-Packard Development Company, L.P. | Method and system for controlling write current in magnetic memory |
TWI330889B (en) * | 2004-05-31 | 2010-09-21 | Ibm | Quantum device, quantum logic device, method of driving quantum logic device, and logic circuit constituted of quantum logic device |
JP4189395B2 (ja) * | 2004-07-28 | 2008-12-03 | シャープ株式会社 | 不揮発性半導体記憶装置及び読み出し方法 |
KR100734832B1 (ko) * | 2004-12-15 | 2007-07-03 | 한국전자통신연구원 | 금속 산화막의 전류 스위칭을 이용한 정보 저장 장치 |
JP5157448B2 (ja) * | 2005-10-19 | 2013-03-06 | 富士通株式会社 | 抵抗記憶素子及び不揮発性半導体記憶装置 |
US8283198B2 (en) | 2010-05-10 | 2012-10-09 | Micron Technology, Inc. | Resistive memory and methods of processing resistive memory |
US8525146B2 (en) | 2010-12-06 | 2013-09-03 | Hewlett-Packard Development Company, L.P. | Electrical circuit component |
US20140048799A1 (en) * | 2011-02-16 | 2014-02-20 | William Marsh Rice University | Invisible/transparent nonvolatile memory |
TWI522490B (zh) * | 2012-05-10 | 2016-02-21 | 應用材料股份有限公司 | 利用微波電漿化學氣相沈積在基板上沈積膜的方法 |
EP3238252A4 (en) | 2014-12-19 | 2017-12-27 | Hewlett-Packard Enterprise Development LP | Negative differential resistance (ndr) device based on fast diffusive metal atoms |
US10636484B2 (en) * | 2018-09-12 | 2020-04-28 | Winbond Electronics Corporation | Circuit and method for memory operation |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3149398A (en) * | 1961-08-10 | 1964-09-22 | Sprague Electric Co | Silicon dioxide solid capacitor |
US3271591A (en) * | 1963-09-20 | 1966-09-06 | Energy Conversion Devices Inc | Symmetrical current controlling device |
US3644741A (en) * | 1969-05-16 | 1972-02-22 | Energy Conversion Devices Inc | Display screen using variable resistance memory semiconductor |
US3588638A (en) * | 1969-05-27 | 1971-06-28 | Energy Conversion Devices Inc | Current controlling device including v02 |
US3823331A (en) * | 1971-04-30 | 1974-07-09 | Energy Conversion Devices Inc | Bi-directional arrangement of amorphous electronic control devices |
GB1412107A (en) * | 1971-12-18 | 1975-10-29 | Marconi Co Ltd | Semi-conductor memory device arrangements |
US3761896A (en) * | 1972-04-18 | 1973-09-25 | Ibm | Memory array of cells containing bistable switchable resistors |
JPS5311075B2 (ko) * | 1973-02-09 | 1978-04-19 | ||
NL7414775A (nl) * | 1974-11-13 | 1976-05-17 | Philips Nv | Werkwijze voor de vervaardiging van een span- ningsafhankelijke weerstand en daarmede ver- kregen spanningsafhankelijke weerstand. |
US4205387A (en) * | 1976-09-16 | 1980-05-27 | Energy Conversion Devices, Inc. | Data storage and retrieval system |
JPS55146959A (en) * | 1979-05-02 | 1980-11-15 | Agency Of Ind Science & Technol | Semiconductor device having silicon nitride film and integrated circuit using the same |
JPS5760330A (en) * | 1980-09-27 | 1982-04-12 | Fujitsu Ltd | Resin composition |
DE3277665D1 (en) * | 1981-08-07 | 1987-12-17 | British Petroleum Co Plc | Non-volatile electrically programmable memory device |
US4795657A (en) * | 1984-04-13 | 1989-01-03 | Energy Conversion Devices, Inc. | Method of fabricating a programmable array |
FR2580673B1 (fr) * | 1985-04-19 | 1987-09-25 | Haond Michel | Procede de fabrication sur un support isolant d'un film de silicium monocristallin oriente et a defauts localises |
US5246738A (en) * | 1985-04-26 | 1993-09-21 | Sri International | Hydridosiloxanes as precursors to ceramic products |
US4818717A (en) * | 1986-06-27 | 1989-04-04 | Energy Conversion Devices, Inc. | Method for making electronic matrix arrays |
US4756977A (en) * | 1986-12-03 | 1988-07-12 | Dow Corning Corporation | Multilayer ceramics from hydrogen silsesquioxane |
US4753855A (en) * | 1986-12-04 | 1988-06-28 | Dow Corning Corporation | Multilayer ceramic coatings from metal oxides for protection of electronic devices |
US4849296A (en) * | 1987-12-28 | 1989-07-18 | Dow Corning Corporation | Multilayer ceramic coatings from metal oxides and hydrogen silsesquioxane resin ceramified in ammonia |
US4847162A (en) * | 1987-12-28 | 1989-07-11 | Dow Corning Corporation | Multilayer ceramics coatings from the ceramification of hydrogen silsequioxane resin in the presence of ammonia |
GB8816631D0 (en) * | 1988-07-13 | 1988-08-17 | Raychem Ltd | Circuit protection arrangement |
GB8816632D0 (en) * | 1988-07-13 | 1988-08-17 | Raychem Ltd | Electrical device |
US4973526A (en) * | 1990-02-15 | 1990-11-27 | Dow Corning Corporation | Method of forming ceramic coatings and resulting articles |
US5312684A (en) * | 1991-05-02 | 1994-05-17 | Dow Corning Corporation | Threshold switching device |
US5260094A (en) * | 1991-09-30 | 1993-11-09 | Cornell Research Foundation, Inc. | Preparing densified low porosity titania sol-gel forms |
US5219611A (en) * | 1991-09-30 | 1993-06-15 | Cornell Research Foundation, Inc. | Preparing densified low porosity titania sol gel forms |
-
1991
- 1991-05-02 US US07/694,721 patent/US5312684A/en not_active Expired - Lifetime
-
1992
- 1992-04-20 TW TW81103085A patent/TW230277B/zh active
- 1992-04-24 DE DE69202815T patent/DE69202815T2/de not_active Expired - Fee Related
- 1992-04-24 EP EP19920303695 patent/EP0512717B1/en not_active Expired - Lifetime
- 1992-04-24 ES ES92303695T patent/ES2075620T3/es not_active Expired - Lifetime
- 1992-04-28 JP JP4110102A patent/JP2683782B2/ja not_active Expired - Fee Related
- 1992-04-28 CA CA 2067413 patent/CA2067413A1/en not_active Abandoned
- 1992-04-30 BR BR9201622A patent/BR9201622A/pt unknown
- 1992-04-30 AU AU15904/92A patent/AU641092B2/en not_active Ceased
- 1992-04-30 MX MX9202033A patent/MX9202033A/es unknown
- 1992-04-30 CN CN92103131A patent/CN1029652C/zh not_active Expired - Fee Related
- 1992-05-01 KR KR1019920007430A patent/KR100200399B1/ko not_active IP Right Cessation
- 1992-07-20 US US07/915,572 patent/US5283545A/en not_active Expired - Lifetime
- 1992-12-09 US US07/988,046 patent/US5293335A/en not_active Expired - Fee Related
-
1993
- 1993-02-26 JP JP3837993A patent/JPH0793468B2/ja not_active Expired - Fee Related
- 1993-06-28 US US08/082,112 patent/US5348773A/en not_active Expired - Lifetime
-
1994
- 1994-06-06 US US08/257,991 patent/US5401981A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5348773A (en) | 1994-09-20 |
CN1029652C (zh) | 1995-08-30 |
JP2683782B2 (ja) | 1997-12-03 |
EP0512717A2 (en) | 1992-11-11 |
DE69202815T2 (de) | 1996-02-08 |
JPH05347440A (ja) | 1993-12-27 |
KR100200399B1 (ko) | 1999-06-15 |
BR9201622A (pt) | 1992-12-15 |
JPH06291336A (ja) | 1994-10-18 |
EP0512717B1 (en) | 1995-06-07 |
US5312684A (en) | 1994-05-17 |
CN1067765A (zh) | 1993-01-06 |
US5283545A (en) | 1994-02-01 |
ES2075620T3 (es) | 1995-10-01 |
AU641092B2 (en) | 1993-09-09 |
CA2067413A1 (en) | 1992-11-03 |
EP0512717A3 (en) | 1993-06-30 |
AU1590492A (en) | 1992-11-05 |
JPH0793468B2 (ja) | 1995-10-09 |
TW230277B (ko) | 1994-09-11 |
US5293335A (en) | 1994-03-08 |
US5401981A (en) | 1995-03-28 |
DE69202815D1 (de) | 1995-07-13 |
MX9202033A (es) | 1992-11-01 |
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