JPS5648147A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5648147A
JPS5648147A JP12356679A JP12356679A JPS5648147A JP S5648147 A JPS5648147 A JP S5648147A JP 12356679 A JP12356679 A JP 12356679A JP 12356679 A JP12356679 A JP 12356679A JP S5648147 A JPS5648147 A JP S5648147A
Authority
JP
Japan
Prior art keywords
alumina film
scribe
film
done
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12356679A
Other languages
Japanese (ja)
Inventor
Nobuyuki Yamamichi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12356679A priority Critical patent/JPS5648147A/en
Publication of JPS5648147A publication Critical patent/JPS5648147A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To prevent the occurrence of a short-circuit caused by scribe by a dicer by removing a metal or a positive oxide layer permitting positive oxidation on a scribe region. CONSTITUTION:An oxide film 2 on an Si substrate 1 is opened to evaporate Al3 and thin and porous alumina film is made by positive oxidation. A barrier type alumina film 5 is formed on a scribe line 7 by applying a resist mask. The Al except wiring and a scribe region is positively oxided by consisting the alumina film 5 as a mask and all Al is converted into porous alumina film 6. Finally, a photo etching is done by applying a resist mask to the alumina film 6 to open the subtrate. In this way, good scribe will be done without tearing the Al off to short- circuit with a junction wire or occurring the breaking fault of the alumina film.
JP12356679A 1979-09-26 1979-09-26 Semiconductor device Pending JPS5648147A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12356679A JPS5648147A (en) 1979-09-26 1979-09-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12356679A JPS5648147A (en) 1979-09-26 1979-09-26 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5648147A true JPS5648147A (en) 1981-05-01

Family

ID=14863749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12356679A Pending JPS5648147A (en) 1979-09-26 1979-09-26 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5648147A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5886742A (en) * 1981-11-18 1983-05-24 Nec Corp Manufacture of semiconductor device
EP0580368A2 (en) * 1992-07-21 1994-01-26 Seagate Technology International Studless thin film magnetic head and process for making the same
US5650897A (en) * 1992-07-21 1997-07-22 Seagate Technology, Inc. Thin film magnetic head including lightning arrester and process for making the same

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5886742A (en) * 1981-11-18 1983-05-24 Nec Corp Manufacture of semiconductor device
JPS6242383B2 (en) * 1981-11-18 1987-09-08 Nippon Electric Co
EP0580368A2 (en) * 1992-07-21 1994-01-26 Seagate Technology International Studless thin film magnetic head and process for making the same
EP0580368A3 (en) * 1992-07-21 1996-03-20 Seagate Technology Studless thin film magnetic head and process for making the same
US5650897A (en) * 1992-07-21 1997-07-22 Seagate Technology, Inc. Thin film magnetic head including lightning arrester and process for making the same
US5657192A (en) * 1992-07-21 1997-08-12 Seagate Technology, Inc. Thin film magnetic head including crater for recessed structure and process for making the same
US5659451A (en) * 1992-07-21 1997-08-19 Seagate Technology, Inc. Studless thin film magnetic head and process for making the same
US5820770A (en) * 1992-07-21 1998-10-13 Seagate Technology, Inc. Thin film magnetic head including vias formed in alumina layer and process for making the same
US5835315A (en) * 1992-07-21 1998-11-10 Seagate Technology, Inc. Wafer including scribe line grooves for separating thin film heads and process for making the same
EP0938079A2 (en) * 1992-07-21 1999-08-25 Seagate Technology International Studless thin film magnetic head and process for making the same
EP0938079A3 (en) * 1992-07-21 1999-09-15 Seagate Technology International Studless thin film magnetic head and process for making the same
US6059984A (en) * 1992-07-21 2000-05-09 Seagate Technology, Inc. Process for fabricating thin film magnetic head including crater for recessed structure
US6635184B1 (en) 1992-07-21 2003-10-21 Uri Cohen Method for pattern-etching alumina layers and products

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