KR910007138A - 반도체장치의 제조방법 - Google Patents
반도체장치의 제조방법Info
- Publication number
- KR910007138A KR910007138A KR1019900013910A KR900013910A KR910007138A KR 910007138 A KR910007138 A KR 910007138A KR 1019900013910 A KR1019900013910 A KR 1019900013910A KR 900013910 A KR900013910 A KR 900013910A KR 910007138 A KR910007138 A KR 910007138A
- Authority
- KR
- South Korea
- Prior art keywords
- manufacturing
- semiconductor device
- semiconductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B20/00—Read-only memory [ROM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B20/00—Read-only memory [ROM] devices
- H10B20/27—ROM only
- H10B20/30—ROM only having the source region and the drain region on the same level, e.g. lateral transistors
- H10B20/38—Doping programmed, e.g. mask ROM
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1-227477 | 1989-09-04 | ||
JP1227477A JP2509707B2 (ja) | 1989-09-04 | 1989-09-04 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910007138A true KR910007138A (ko) | 1991-04-30 |
KR940002838B1 KR940002838B1 (ko) | 1994-04-04 |
Family
ID=16861495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900013910A KR940002838B1 (ko) | 1989-09-04 | 1990-09-04 | 반도체장치의 제조방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5094971A (ko) |
EP (1) | EP0441973B1 (ko) |
JP (1) | JP2509707B2 (ko) |
KR (1) | KR940002838B1 (ko) |
DE (1) | DE69007961T2 (ko) |
WO (1) | WO1991003837A1 (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05121701A (ja) * | 1991-10-25 | 1993-05-18 | Rohm Co Ltd | Nand構造の半導体装置の製造方法 |
FR2683078A1 (fr) * | 1991-10-29 | 1993-04-30 | Samsung Electronics Co Ltd | Memoire morte a masque de type non-et. |
JPH05304277A (ja) * | 1992-04-28 | 1993-11-16 | Rohm Co Ltd | 半導体装置の製法 |
KR0140691B1 (ko) * | 1992-08-20 | 1998-06-01 | 문정환 | 반도체 장치의 마스크롬 제조방법 |
US5429967A (en) * | 1994-04-08 | 1995-07-04 | United Microelectronics Corporation | Process for producing a very high density mask ROM |
US5380676A (en) * | 1994-05-23 | 1995-01-10 | United Microelectronics Corporation | Method of manufacturing a high density ROM |
US5516713A (en) * | 1994-09-06 | 1996-05-14 | United Microelectronics Corporation | Method of making high coupling ratio NAND type flash memory |
US6159800A (en) * | 1997-04-11 | 2000-12-12 | Programmable Silicon Solutions | Method of forming a memory cell |
US6057193A (en) * | 1998-04-16 | 2000-05-02 | Advanced Micro Devices, Inc. | Elimination of poly cap for easy poly1 contact for NAND product |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4052229A (en) * | 1976-06-25 | 1977-10-04 | Intel Corporation | Process for preparing a substrate for mos devices of different thresholds |
GB2102623B (en) * | 1981-06-30 | 1985-04-11 | Tokyo Shibaura Electric Co | Method of manufacturing a semiconductors memory device |
US4506436A (en) * | 1981-12-21 | 1985-03-26 | International Business Machines Corporation | Method for increasing the radiation resistance of charge storage semiconductor devices |
JPS58148448A (ja) * | 1982-03-01 | 1983-09-03 | Nippon Denso Co Ltd | 半導体romの製造方法 |
JPS58154259A (ja) * | 1982-03-10 | 1983-09-13 | Nippon Denso Co Ltd | 半導体romの製造方法 |
JPH0797606B2 (ja) * | 1986-10-22 | 1995-10-18 | 株式会社日立製作所 | 半導体集積回路装置の製造方法 |
JPS63215063A (ja) * | 1987-03-04 | 1988-09-07 | Matsushita Electronics Corp | 半導体装置の製造方法 |
JPS649763A (en) * | 1987-07-02 | 1989-01-13 | Minolta Camera Kk | Printer |
JPS6411358A (en) * | 1987-07-06 | 1989-01-13 | Toshiba Corp | Semiconductor device and manufacture thereof |
JPS6437867A (en) * | 1987-08-04 | 1989-02-08 | Seiko Epson Corp | Semiconductor device |
JP2607551B2 (ja) * | 1987-10-23 | 1997-05-07 | 株式会社日立製作所 | 半導体記憶装置及びその製造方法 |
JPH01111358A (ja) * | 1987-10-26 | 1989-04-28 | Nec Corp | 半導体装置用容器 |
JP2555103B2 (ja) * | 1987-11-13 | 1996-11-20 | 株式会社日立製作所 | 半導体集積回路装置の製造方法 |
JPH01128565A (ja) * | 1987-11-13 | 1989-05-22 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
JP2509706B2 (ja) * | 1989-08-18 | 1996-06-26 | 株式会社東芝 | マスクromの製造方法 |
-
1989
- 1989-09-04 JP JP1227477A patent/JP2509707B2/ja not_active Expired - Fee Related
-
1990
- 1990-09-04 KR KR1019900013910A patent/KR940002838B1/ko not_active IP Right Cessation
- 1990-09-04 EP EP90912937A patent/EP0441973B1/en not_active Expired - Lifetime
- 1990-09-04 WO PCT/JP1990/001126 patent/WO1991003837A1/ja active IP Right Grant
- 1990-09-04 US US07/684,938 patent/US5094971A/en not_active Expired - Lifetime
- 1990-09-04 DE DE69007961T patent/DE69007961T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2509707B2 (ja) | 1996-06-26 |
EP0441973A1 (en) | 1991-08-21 |
DE69007961T2 (de) | 1994-08-18 |
JPH0391262A (ja) | 1991-04-16 |
WO1991003837A1 (en) | 1991-03-21 |
DE69007961D1 (de) | 1994-05-11 |
EP0441973A4 (en) | 1991-10-02 |
US5094971A (en) | 1992-03-10 |
KR940002838B1 (ko) | 1994-04-04 |
EP0441973B1 (en) | 1994-04-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20060331 Year of fee payment: 13 |
|
LAPS | Lapse due to unpaid annual fee |