KR900012331A - 반도체장치의 제조방법 - Google Patents

반도체장치의 제조방법

Info

Publication number
KR900012331A
KR900012331A KR1019890019285A KR890019285A KR900012331A KR 900012331 A KR900012331 A KR 900012331A KR 1019890019285 A KR1019890019285 A KR 1019890019285A KR 890019285 A KR890019285 A KR 890019285A KR 900012331 A KR900012331 A KR 900012331A
Authority
KR
South Korea
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Application number
KR1019890019285A
Other languages
English (en)
Other versions
KR930004117B1 (ko
Inventor
세이치 모리
Original Assignee
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 도시바 filed Critical 가부시키가이샤 도시바
Publication of KR900012331A publication Critical patent/KR900012331A/ko
Application granted granted Critical
Publication of KR930004117B1 publication Critical patent/KR930004117B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66568—Lateral single gate silicon transistors
    • H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/4916—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen
    • H01L29/4925—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen with a multiple layer structure, e.g. several silicon layers with different crystal structure or grain arrangement
    • H01L29/4933—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen with a multiple layer structure, e.g. several silicon layers with different crystal structure or grain arrangement with a silicide layer contacting the silicon layer, e.g. Polycide gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/92—Capacitors having potential barriers
    • H01L29/94—Metal-insulator-semiconductors, e.g. MOS
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/019—Contacts of silicides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/147—Silicides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/91—Controlling charging state at semiconductor-insulator interface

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
KR1019890019285A 1989-01-20 1989-12-22 반도체장치의 제조방법 KR930004117B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP89-11624 1989-01-20
JP1011624A JPH0724261B2 (ja) 1989-01-20 1989-01-20 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR900012331A true KR900012331A (ko) 1990-08-03
KR930004117B1 KR930004117B1 (ko) 1993-05-20

Family

ID=11783081

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890019285A KR930004117B1 (ko) 1989-01-20 1989-12-22 반도체장치의 제조방법

Country Status (5)

Country Link
US (1) US5049514A (ko)
EP (1) EP0379024B1 (ko)
JP (1) JPH0724261B2 (ko)
KR (1) KR930004117B1 (ko)
DE (1) DE69031712T2 (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2892421B2 (ja) * 1990-02-27 1999-05-17 沖電気工業株式会社 半導体素子の製造方法
EP0575280A3 (en) * 1992-06-18 1995-10-04 Ibm Cmos transistor with two-layer inverse-t tungsten gate structure
US5326713A (en) * 1992-09-04 1994-07-05 Taiwan Semiconductor Manufacturies Company Buried contact process
US5272099A (en) * 1992-11-27 1993-12-21 Etron Technology Inc. Fabrication of transistor contacts
GB9225906D0 (en) * 1992-12-11 1993-02-03 Philips Electronics Uk Ltd Electronic device manufacture using ion implantation
US5393687A (en) * 1993-12-16 1995-02-28 Taiwan Semiconductor Manufacturing Company Method of making buried contact module with multiple poly si layers
JP2924622B2 (ja) * 1993-12-28 1999-07-26 日本電気株式会社 半導体装置の製造方法
US5767006A (en) * 1996-09-27 1998-06-16 Taiwan Semiconductor Manufacturating Company, Ltd. Method for eliminating charge damage during etching of conducting layers
US5866482A (en) * 1996-09-27 1999-02-02 Taiwan Semiconductor Manufacturing Company, Ltd. Method for masking conducting layers to abate charge damage during plasma etching
JP3221369B2 (ja) 1997-09-19 2001-10-22 日本電気株式会社 不揮発性半導体記憶装置及びその製造方法
US6020237A (en) * 1998-02-04 2000-02-01 Alliance Semiconductor Corporation Method of reducing dielectric damage due to charging in the fabrication of stacked gate structures
DE10201058A1 (de) * 2002-01-14 2003-07-31 Infineon Technologies Ag Verfahren zur Herstellung einer dielektrischen Schicht
JP3481233B1 (ja) 2002-05-27 2003-12-22 沖電気工業株式会社 キャパシタ構造の製造方法及びキャパシタ素子の製造方法
JP4683817B2 (ja) * 2002-09-27 2011-05-18 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4454921B2 (ja) * 2002-09-27 2010-04-21 株式会社半導体エネルギー研究所 半導体装置の作製方法
US7118959B2 (en) * 2005-03-10 2006-10-10 Texas Instruments Incorporated Integrated circuit capacitor having antireflective dielectric
RU2751983C1 (ru) * 2020-11-20 2021-07-21 Федеральное государственное бюджетное образовательное учреждение высшего образования "Кабардино-Балкарский государственный университет им. Х.М. Бербекова" (КБГУ) Способ изготовления силицида титана

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4224733A (en) * 1977-10-11 1980-09-30 Fujitsu Limited Ion implantation method
JPS57100768A (en) * 1980-12-16 1982-06-23 Nec Corp Manufacture of field effect semiconductor device
US4551908A (en) * 1981-06-15 1985-11-12 Nippon Electric Co., Ltd. Process of forming electrodes and interconnections on silicon semiconductor devices
US4558507A (en) * 1982-11-12 1985-12-17 Nec Corporation Method of manufacturing semiconductor device
US4740479A (en) * 1985-07-05 1988-04-26 Siemens Aktiengesellschaft Method for the manufacture of cross-couplings between n-channel and p-channel CMOS field effect transistors of static write-read memories
EP0231206A1 (en) * 1985-08-08 1987-08-12 Motorola, Inc. Dielectric breakdown prevention technique
US4788160A (en) * 1987-03-31 1988-11-29 Texas Instruments Incorporated Process for formation of shallow silicided junctions
US4859278A (en) * 1988-08-11 1989-08-22 Xerox Corporation Fabrication of high resistive loads utilizing a single level polycide process

Also Published As

Publication number Publication date
JPH0724261B2 (ja) 1995-03-15
JPH02192723A (ja) 1990-07-30
DE69031712T2 (de) 1998-04-09
EP0379024A3 (en) 1990-08-29
KR930004117B1 (ko) 1993-05-20
EP0379024B1 (en) 1997-11-19
US5049514A (en) 1991-09-17
DE69031712D1 (de) 1998-01-02
EP0379024A2 (en) 1990-07-25

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