KR890005563A - 포지티브 감광성내식막용 노볼락 수지 - Google Patents
포지티브 감광성내식막용 노볼락 수지 Download PDFInfo
- Publication number
- KR890005563A KR890005563A KR870012598A KR870012598A KR890005563A KR 890005563 A KR890005563 A KR 890005563A KR 870012598 A KR870012598 A KR 870012598A KR 870012598 A KR870012598 A KR 870012598A KR 890005563 A KR890005563 A KR 890005563A
- Authority
- KR
- South Korea
- Prior art keywords
- cresol
- region
- positive photoresist
- polystyrene
- novolak resin
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
- G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명에서 정의한 특정 노볼락수지의 대표적인 GPC패턴을 나타낸다.
제 2 도는 통상적으로 공지된 노볼락수지의 대표적인 GPC패턴을 나타낸다.
Claims (5)
- 페놀과 포름알데히드를 부가 축합 반응시켜 제조되고 겔 투와 크로마토그라피 패턴(GPC 패턴) [UV(254nm)검출기를 사용하여 측정] 의 면적비가 폴리스티렌으로 계산한 분자량이 150 내지 500미만(페놀과 미반응 단량제를 포함하지 않음)인 범위(이후 A영역으로 칭함)가 8-35%, 폴리스티렌으로 계산한 분자량이 500내지 5000미만인 범위(이후 B영역으로 칭함)가 0-30% 그리고 폴리스티렌으로 계산한 분자량이 5000을 초과하는 범위(이후 C영역으로 칭함)가 35-92%이고, 그밖에, A영역에 대한 B영역의 비가 2.50이하인 것을 특징으로 하는 포지티브 감광성 내식막용 노볼락 수지.
- 제1항에 있어서, 폴리스티렌으로 계산한 노볼락 수지의 중량 평균분자량이 3000-35000인것을 특징으로 하는 포지타브 감광성내식막용 노볼락수지.
- 제1항에 있어서, 페놀로서 크레솔을 사용하는 것을 특징으로하는 포지티브 감광성내식막용 노볼락수지.
- 제3항에 있어서, 크레솔이 m-크레솔과 p-크레솔로 이루어진것을 특징으로 하는 포지티브 감광성 내식막용 노볼락수지.
- 제4항에 있어서, A영역에 해당하는 노볼락수지에 함유된 m-크레솔과 p-크레솔의 비가 10:0-2:8이고, 그밖에, C영역에 해당하는 노볼락수지에 함유된 m-크레솔과 p-크레솔의 비가 10:0-4:6인 것을 특징으로하는 포지티브 감광성 내식막용 노볼락 수지.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26640286 | 1986-11-08 | ||
JP86-266402 | 1986-11-08 | ||
JP61-266402 | 1986-11-08 | ||
JP062-220664 | 1987-09-02 | ||
JP62220664A JP2590342B2 (ja) | 1986-11-08 | 1987-09-02 | ポジ型フォトレジスト用ノボラック樹脂及びそれを含有するポジ型フォトレジスト組成物 |
JP87-220664 | 1987-09-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890005563A true KR890005563A (ko) | 1989-05-15 |
KR960006405B1 KR960006405B1 (ko) | 1996-05-15 |
Family
ID=26523847
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019870012598A KR960006405B1 (ko) | 1986-11-08 | 1987-11-09 | 포지티브 감광성 내식막용 노볼락수지 |
Country Status (6)
Country | Link |
---|---|
US (1) | US4812551A (ko) |
EP (1) | EP0271199B1 (ko) |
JP (1) | JP2590342B2 (ko) |
KR (1) | KR960006405B1 (ko) |
CA (1) | CA1287438C (ko) |
DE (1) | DE3781650T2 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100709520B1 (ko) * | 2000-02-29 | 2007-04-20 | 도오꾜오까고오교 가부시끼가이샤 | 페놀 노볼락 수지, 그것의 합성 방법, 및 이것을 사용한포지티브형 포토레지스트 조성물 |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1279430C (en) * | 1985-12-06 | 1991-01-22 | Takashi Kubota | High-molecular-weight soluble novolak resin and process for preparation thereof |
JP2552891B2 (ja) * | 1988-01-26 | 1996-11-13 | 富士写真フイルム株式会社 | ポジ型フオトレジスト組成物 |
DE3810631A1 (de) * | 1988-03-29 | 1989-10-12 | Hoechst Ag | Positiv arbeitendes lichtempfindliches gemisch und daraus hergestelltes aufzeichnungsmaterial mit hohem waermestand |
US5861229A (en) * | 1988-07-07 | 1999-01-19 | Sumitomo Chemical Company, Limited | Radiation-sensitive positive resist composition comprising a 1,2-quinone diazide compound, an alkali-soluble resin and a polyphenol compound |
US5456995A (en) * | 1988-07-07 | 1995-10-10 | Sumitomo Chemical Company, Limited | Radiation-sensitive positive resist composition |
JP2636348B2 (ja) * | 1988-07-20 | 1997-07-30 | 住友化学工業株式会社 | ポジ型レジスト用組成物 |
DE3901930A1 (de) * | 1989-01-24 | 1990-07-26 | Hoechst Ag | Verfahren zur herstellung von novolaken und deren verwendung |
CA2023791A1 (en) * | 1989-08-24 | 1991-02-25 | Ayako Ida | Radiation-sensitive positive resist composition |
US5288587A (en) * | 1989-09-05 | 1994-02-22 | Sumitomo Chemical Co., Ltd. | Radiation-sensitive positive resist composition comprising an o-quinone diazide, an alkali-soluble resin and a polyphenol compound |
US5324620A (en) * | 1989-09-08 | 1994-06-28 | Ocg Microeletronic Materials, Inc. | Radiation-sensitive compositions containing novolak polymers made from four phenolic derivatives and an aldehyde |
DE69032873T2 (de) * | 1989-09-08 | 1999-07-29 | Olin Microelectronic Chemicals, Inc., Norwalk, Conn. | Vollständig substituierte Novalak-Polymere enthaltende Strahlungsempfindliche Zusammensetzungen |
US5151339A (en) * | 1989-09-08 | 1992-09-29 | Ocg Microelectronic Materials, Inc. | Photoresist composition containing diazoquinone photosensitizer and novalak resin characterized by the complete and selective removal of dimeric species from the novolak resin |
US5132376A (en) * | 1989-09-08 | 1992-07-21 | Ocg Microelectronic Materials, Inc. | Process for selective removal of dimeric species from phenolic polymers |
JP2559145B2 (ja) * | 1989-10-09 | 1996-12-04 | 三菱電機株式会社 | フォトレジスト塗布組成物 |
JP3063148B2 (ja) * | 1989-12-27 | 2000-07-12 | 住友化学工業株式会社 | ポジ型レジスト組成物 |
JP2566169B2 (ja) * | 1989-12-28 | 1996-12-25 | 日本ゼオン株式会社 | ポジ型レジスト組成物 |
TW202504B (ko) * | 1990-02-23 | 1993-03-21 | Sumitomo Chemical Co | |
JPH03294861A (ja) * | 1990-04-13 | 1991-12-26 | Mitsubishi Petrochem Co Ltd | ポジ型フォトレジスト組成物 |
US5145763A (en) * | 1990-06-29 | 1992-09-08 | Ocg Microelectronic Materials, Inc. | Positive photoresist composition |
JP2711590B2 (ja) † | 1990-09-13 | 1998-02-10 | 富士写真フイルム株式会社 | ポジ型フオトレジスト組成物 |
JPH05204144A (ja) * | 1991-08-21 | 1993-08-13 | Sumitomo Chem Co Ltd | ポジ型レジスト組成物 |
US5346799A (en) * | 1991-12-23 | 1994-09-13 | Ocg Microelectronic Materials, Inc. | Novolak resins and their use in radiation-sensitive compositions wherein the novolak resins are made by condensing 2,6-dimethylphenol, 2,3-dimethylphenol, a para-substituted phenol and an aldehyde |
US5374693A (en) * | 1992-12-29 | 1994-12-20 | Hoechst Celanese Corporation | Novolak resin blends for photoresist applications |
EP0720052A1 (en) * | 1994-12-27 | 1996-07-03 | Mitsubishi Chemical Corporation | Photosensitive composition and photosensitive lithographic printing plate |
JPH0990622A (ja) * | 1995-09-22 | 1997-04-04 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
US6001949A (en) * | 1995-12-13 | 1999-12-14 | Gun Ei Chemical Industry Co., Ltd. | Novolak type phenolic resins and methods of manufacturing thereof |
JPH09124756A (ja) | 1995-10-30 | 1997-05-13 | Gun Ei Chem Ind Co Ltd | ノボラック型フェノール樹脂及びその製造方法 |
TW442710B (en) * | 1995-12-07 | 2001-06-23 | Clariant Finance Bvi Ltd | Isolation of novolak resin without high temperature distillation and photoresist composition therefrom |
JP3562673B2 (ja) | 1996-01-22 | 2004-09-08 | 富士写真フイルム株式会社 | ポジ型フォトレジスト組成物 |
TW475099B (en) * | 1996-12-18 | 2002-02-01 | Hoechst Celanese Corp | Isolation of novolak resin without high temperature distillation and photoresist composition therefrom |
US5853954A (en) * | 1996-12-18 | 1998-12-29 | Clariant Finance (Bvi) Limited | Fractionated novolak resin and photoresist composition therefrom |
US6045966A (en) * | 1997-12-15 | 2000-04-04 | Clariant Finance (Bvi) Limited | Fractionated novolak resin and photoresist composition therefrom |
US6027853A (en) * | 1998-01-16 | 2000-02-22 | Olin Microelectronic Chemicals, Inc. | Process for preparing a radiation-sensitive composition |
CN1306337C (zh) | 1998-12-10 | 2007-03-21 | Az电子材料日本株式会社 | 正性敏射线的树脂组合物 |
JP4068260B2 (ja) * | 1999-04-02 | 2008-03-26 | Azエレクトロニックマテリアルズ株式会社 | 感放射線性樹脂組成物 |
WO2001025853A1 (fr) | 1999-10-07 | 2001-04-12 | Clariant International Ltd. | Composition photosensible |
JP4213366B2 (ja) * | 2001-06-12 | 2009-01-21 | Azエレクトロニックマテリアルズ株式会社 | 厚膜レジストパターンの形成方法 |
JP4237430B2 (ja) * | 2001-09-13 | 2009-03-11 | Azエレクトロニックマテリアルズ株式会社 | エッチング方法及びエッチング保護層形成用組成物 |
JP4235466B2 (ja) * | 2003-02-24 | 2009-03-11 | Azエレクトロニックマテリアルズ株式会社 | 水溶性樹脂組成物、パターン形成方法及びレジストパターンの検査方法 |
JP4012480B2 (ja) * | 2003-03-28 | 2007-11-21 | Azエレクトロニックマテリアルズ株式会社 | 微細パターン形成補助剤及びその製造法 |
ES2426498T3 (es) * | 2005-01-25 | 2013-10-23 | Hodogaya Chemical Co., Ltd. | Resina de resorcinol-formalina modificada con cetona |
US7923200B2 (en) * | 2007-04-09 | 2011-04-12 | Az Electronic Materials Usa Corp. | Composition for coating over a photoresist pattern comprising a lactam |
JP5069494B2 (ja) * | 2007-05-01 | 2012-11-07 | AzエレクトロニックマテリアルズIp株式会社 | 微細化パターン形成用水溶性樹脂組成物およびこれを用いた微細パターン形成方法 |
US7745077B2 (en) * | 2008-06-18 | 2010-06-29 | Az Electronic Materials Usa Corp. | Composition for coating over a photoresist pattern |
KR101340283B1 (ko) * | 2010-02-03 | 2013-12-10 | 디아이씨 가부시끼가이샤 | 페놀 수지 조성물, 경화성 수지 조성물, 그 경화물, 및 프린트 배선 기판 |
KR101400186B1 (ko) | 2010-12-31 | 2014-05-27 | 제일모직 주식회사 | 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자 |
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US3666473A (en) * | 1970-10-06 | 1972-05-30 | Ibm | Positive photoresists for projection exposure |
US4173470A (en) * | 1977-11-09 | 1979-11-06 | Bell Telephone Laboratories, Incorporated | Novolak photoresist composition and preparation thereof |
DE3344202A1 (de) * | 1983-12-07 | 1985-06-20 | Merck Patent Gmbh, 6100 Darmstadt | Positiv-fotoresistzusammensetzungen |
JPS60189739A (ja) * | 1984-03-09 | 1985-09-27 | Japan Synthetic Rubber Co Ltd | ポジ型感光性樹脂組成物 |
JPS61185741A (ja) * | 1985-02-13 | 1986-08-19 | Mitsubishi Chem Ind Ltd | ポジ型フオトレジスト組成物 |
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JPS6273255A (ja) * | 1985-09-26 | 1987-04-03 | Konishiroku Photo Ind Co Ltd | 感光性組成物 |
JPS62143045A (ja) * | 1985-11-29 | 1987-06-26 | Mitsubishi Chem Ind Ltd | ポジ型感光性平版印刷版 |
EP0239423B1 (en) * | 1986-03-28 | 1996-03-20 | Japan Synthetic Rubber Co., Ltd. | Positive type radiation-sensitive resin composition |
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-
1987
- 1987-09-02 JP JP62220664A patent/JP2590342B2/ja not_active Expired - Fee Related
- 1987-10-30 EP EP87309646A patent/EP0271199B1/en not_active Expired - Lifetime
- 1987-10-30 DE DE8787309646T patent/DE3781650T2/de not_active Expired - Fee Related
- 1987-11-06 CA CA000551269A patent/CA1287438C/en not_active Expired - Fee Related
- 1987-11-09 KR KR1019870012598A patent/KR960006405B1/ko not_active IP Right Cessation
- 1987-11-09 US US07/118,041 patent/US4812551A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100709520B1 (ko) * | 2000-02-29 | 2007-04-20 | 도오꾜오까고오교 가부시끼가이샤 | 페놀 노볼락 수지, 그것의 합성 방법, 및 이것을 사용한포지티브형 포토레지스트 조성물 |
Also Published As
Publication number | Publication date |
---|---|
EP0271199B1 (en) | 1992-09-09 |
JPH01105243A (ja) | 1989-04-21 |
EP0271199A3 (en) | 1989-10-18 |
CA1287438C (en) | 1991-08-06 |
DE3781650T2 (de) | 1993-04-15 |
US4812551A (en) | 1989-03-14 |
DE3781650D1 (de) | 1992-10-15 |
EP0271199A2 (en) | 1988-06-15 |
JP2590342B2 (ja) | 1997-03-12 |
KR960006405B1 (ko) | 1996-05-15 |
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