KR860004370A - Ic카드 - Google Patents

Ic카드 Download PDF

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Publication number
KR860004370A
KR860004370A KR1019850007564A KR850007564A KR860004370A KR 860004370 A KR860004370 A KR 860004370A KR 1019850007564 A KR1019850007564 A KR 1019850007564A KR 850007564 A KR850007564 A KR 850007564A KR 860004370 A KR860004370 A KR 860004370A
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South Korea
Prior art keywords
insulating film
pellet
terminal
pellets
card
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KR1019850007564A
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English (en)
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KR900001698B1 (ko
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가즈야(외 1) 하라
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가시오 가즈오
가시오 게이상기 가부시기가이샤
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Publication of KR860004370A publication Critical patent/KR860004370A/ko
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Publication of KR900001698B1 publication Critical patent/KR900001698B1/ko

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Physics & Mathematics (AREA)
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Abstract

내용 없음

Description

IC카드
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예시의 IC카드의 내부 구조를 표시한 단면도.
제2도는 도면 1의 IC카드의 분해사시도.
제3도는 도면 1의 IC카드의 평면도.

Claims (12)

  1. IC펠렛트의 수납부를 갖는 베이스 시트와, 복수의 전극단자를 구비하며, 상기 수납부내에 수납된 적어도 1개의 IC펠렛트와 단자 접점을 구비하여 상기 IC펠렛트 및 베이스 시트에 접합된 절연 필름과, 상기 전기 단자와 단자 접점과의 사이에 형성된 도전 부재등을 갖는 IC카드.
  2. 상기 제1항에 있어서, 상기 IC펠렛트는 상기 절연 필름의 내측 표면에 접착되며, 도전 부재는 IC펠렛트에 접속된 도전층을 포함하는 IC카드.
  3. 상기 제2항에 있어서, 상기 절연 필름은 상기 도전층에 대응한 곳에 복수의 관통공을 구비하며, 상기 도전층은, 상기 관통공을 통하여 절연 필름의 표면에 연장한 외부 단자와, 상기 전극 단자와 외부단자와의 사이에 형성된 리드 패턴등을 구비한 IC카드.
  4. 상기 제3항에 있어서, 상기 외부단자는 상기 절연필름 표면과 동일면에 형성된 전극 선단을 갖는 IC카드.
  5. 상기 제3항에 있어서, 상기 외부 단자는 상기 절연필름 표면에서 소정 칫수만큼 돌출된 전극 선단을 갖는 IC카드.
  6. 상기 제2항에 있어서, 상기 IC펠렛트의 전극 단자와 절연 필름의 도전층과는 양자의 사이에 설치된 이방 도전성 접착제층에 의하여 서로 접합되어 있는 IC카드.
  7. 상기 제6항에 있어서, 상기 이방 도전성 접착제층은 절연성 필름위에 형성된 인쇄층인 IC카드.
  8. 상기 제2항에 있어서, 상기 IC펠렛트는 상기 절연 필름 위에 고착되어 있는 IC카드.
  9. 상기 제8항에 있어서, 상기 IC펠렛트는 이것과 대체로 같은 면적을 가지며 또 강성을 갖는 금속판을 통하여 절연 필름 위에 고착된 IC카드.
  10. 상기 제2항에 있어서, 상기 IC펠렛트는 EP-ROM을 포함하여 상기 절연 필름은 IC펠렛트 중의 EP-ROM에 대응한 부분에 투명부를 가지며 이 투명부에서 벗겨낼 수 있는 가림수단이 상기 투명부에 접착되는 IC카드.
  11. IC펠렛트는 수납부를 갖는 베이스 시트와, 복수의 전극단자를 구비하며, 상기 수납부내에 수납된 적어도 1개의 IC펠렛트와, 상기 전극 단자에 접한 상태에서 IC펠렛트 위에 적층한 이방 전도성 접착제 층과, 이 이방 도전성 접착제층을 협지한 상태에서 상기 전극단자에 대응한 위치에 형성되며, 외부 접속 단자를 갖는 복수의 도전리드와 이 도전리드 위에 적층된 절연성 외장 필름을 갖는 IC카드.
  12. 상기 제1항에 있어서, 상기 베이스 시트의 IC펠렛트의 수납부의 단연부에서 상기 도전 부재로서 복수의 리드 단자를 형성하며, 이 리드단자는 상기 IC펠렛트의 전극 단자와 절연 필름위에 형성된 외부 접점 사이에 도전적으로 접합된 IC카드.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019850007564A 1984-11-05 1985-10-15 Ic 카드 KR900001698B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP84-232834 1984-11-05
JP59232834A JPS61123990A (ja) 1984-11-05 1984-11-05 Ｉｃカ−ド

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KR860004370A true KR860004370A (ko) 1986-06-20
KR900001698B1 KR900001698B1 (ko) 1990-03-19

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JP (1) JPS61123990A (ko)
KR (1) KR900001698B1 (ko)
DE (1) DE3535791A1 (ko)
FR (1) FR2572826B1 (ko)
GB (2) GB2166589B (ko)

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Also Published As

Publication number Publication date
GB2166589B (en) 1989-04-26
DE3535791A1 (de) 1986-05-07
GB8524271D0 (en) 1985-11-06
KR900001698B1 (ko) 1990-03-19
GB8813471D0 (en) 1988-07-13
GB2204182B (en) 1989-04-19
GB2166589A (en) 1986-05-08
DE3535791C2 (ko) 1989-02-23
GB2204182A (en) 1988-11-02
FR2572826B1 (fr) 1991-02-22
US4719140A (en) 1988-01-12
JPS61123990A (ja) 1986-06-11
FR2572826A1 (fr) 1986-05-09

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