KR20140136385A - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
- Publication number
- KR20140136385A KR20140136385A KR1020140058561A KR20140058561A KR20140136385A KR 20140136385 A KR20140136385 A KR 20140136385A KR 1020140058561 A KR1020140058561 A KR 1020140058561A KR 20140058561 A KR20140058561 A KR 20140058561A KR 20140136385 A KR20140136385 A KR 20140136385A
- Authority
- KR
- South Korea
- Prior art keywords
- oxide
- layer
- insulating layer
- semiconductor layer
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
- H10D30/6739—Conductor-insulator-semiconductor electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
- H10D88/01—Manufacture or treatment
Landscapes
- Thin Film Transistor (AREA)
- Semiconductor Memories (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2013-106223 | 2013-05-20 | ||
| JPJP-P-2013-106253 | 2013-05-20 | ||
| JP2013106253 | 2013-05-20 | ||
| JP2013106223 | 2013-05-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20140136385A true KR20140136385A (ko) | 2014-11-28 |
Family
ID=51895094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020140058561A Ceased KR20140136385A (ko) | 2013-05-20 | 2014-05-15 | 반도체 장치 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US9202925B2 (https=) |
| JP (8) | JP6408250B2 (https=) |
| KR (1) | KR20140136385A (https=) |
| TW (1) | TWI664731B (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10192995B2 (en) | 2015-04-28 | 2019-01-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140027762A1 (en) * | 2012-07-27 | 2014-01-30 | Semiconductor Energy Laboratory Co. Ltd. | Semiconductor device |
| US9853053B2 (en) | 2012-09-10 | 2017-12-26 | 3B Technologies, Inc. | Three dimension integrated circuits employing thin film transistors |
| CN109860278A (zh) | 2013-05-20 | 2019-06-07 | 株式会社半导体能源研究所 | 半导体装置 |
| US9647125B2 (en) | 2013-05-20 | 2017-05-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP6374221B2 (ja) | 2013-06-05 | 2018-08-15 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US9773915B2 (en) | 2013-06-11 | 2017-09-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| WO2015049818A1 (ja) * | 2013-10-03 | 2015-04-09 | パナソニック株式会社 | 薄膜トランジスタ基板の製造方法 |
| DE102014220672A1 (de) | 2013-10-22 | 2015-05-07 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung |
| TWI666770B (zh) | 2013-12-19 | 2019-07-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| JP6444714B2 (ja) | 2013-12-20 | 2018-12-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP6488124B2 (ja) | 2013-12-27 | 2019-03-20 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2015114476A1 (en) | 2014-01-28 | 2015-08-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2015132697A1 (en) | 2014-03-07 | 2015-09-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR20210039507A (ko) | 2014-11-28 | 2021-04-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 모듈, 및 전자 기기 |
| US9768317B2 (en) | 2014-12-08 | 2017-09-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, manufacturing method of semiconductor device, and electronic device |
| WO2016099580A2 (en) | 2014-12-23 | 2016-06-23 | Lupino James John | Three dimensional integrated circuits employing thin film transistors |
| JP6466180B2 (ja) | 2015-01-15 | 2019-02-06 | 住友重機械工業株式会社 | モータ |
| US9954112B2 (en) * | 2015-01-26 | 2018-04-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| KR102865410B1 (ko) * | 2015-02-06 | 2025-09-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| US9685560B2 (en) * | 2015-03-02 | 2017-06-20 | Semiconductor Energy Laboratory Co., Ltd. | Transistor, method for manufacturing transistor, semiconductor device, and electronic device |
| US10147823B2 (en) | 2015-03-19 | 2018-12-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR102582523B1 (ko) * | 2015-03-19 | 2023-09-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 전자 기기 |
| TWI695513B (zh) * | 2015-03-27 | 2020-06-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置及電子裝置 |
| KR102788207B1 (ko) * | 2015-04-13 | 2025-03-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR102549926B1 (ko) | 2015-05-04 | 2023-06-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 반도체 장치의 제작 방법, 및 전자기기 |
| US10985278B2 (en) * | 2015-07-21 | 2021-04-20 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| TWI741934B (zh) * | 2016-02-12 | 2021-10-01 | 光程研創股份有限公司 | 光學裝置、光學系統、時差測距系統及立體取像系統 |
| US10170569B2 (en) | 2016-02-22 | 2019-01-01 | Applied Materials, Inc. | Thin film transistor fabrication utlizing an interface layer on a metal electrode layer |
| US10411003B2 (en) * | 2016-10-14 | 2019-09-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US10692869B2 (en) | 2016-11-17 | 2020-06-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| JP7118948B2 (ja) | 2017-03-13 | 2022-08-16 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR20200127993A (ko) * | 2018-03-07 | 2020-11-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
| US10388800B1 (en) * | 2018-03-30 | 2019-08-20 | Intel Corporation | Thin film transistor with gate stack on multiple sides |
| CN110626070B (zh) | 2018-09-19 | 2020-08-21 | 精工爱普生株式会社 | 液体喷出装置、液体喷出系统、以及打印头 |
| US11264506B2 (en) * | 2018-10-31 | 2022-03-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and manufacturing method thereof |
| KR102581399B1 (ko) * | 2018-11-02 | 2023-09-22 | 삼성전자주식회사 | 반도체 메모리 소자 |
| KR20220124700A (ko) * | 2020-01-10 | 2022-09-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
| JP2024000354A (ja) * | 2022-06-20 | 2024-01-05 | キオクシア株式会社 | 半導体装置およびその製造方法 |
| WO2025215499A1 (ja) * | 2024-04-12 | 2025-10-16 | 株式会社半導体エネルギー研究所 | 半導体装置 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10192995B2 (en) | 2015-04-28 | 2019-01-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US10950734B2 (en) | 2015-04-28 | 2021-03-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2021177574A (ja) | 2021-11-11 |
| JP6408250B2 (ja) | 2018-10-17 |
| JP2026063026A (ja) | 2026-04-10 |
| JP2020057809A (ja) | 2020-04-09 |
| TWI664731B (zh) | 2019-07-01 |
| US9202925B2 (en) | 2015-12-01 |
| US9755081B2 (en) | 2017-09-05 |
| JP7804116B2 (ja) | 2026-01-21 |
| TW201501316A (zh) | 2015-01-01 |
| JP2019036735A (ja) | 2019-03-07 |
| JP6637560B2 (ja) | 2020-01-29 |
| US20140339546A1 (en) | 2014-11-20 |
| JP2015005733A (ja) | 2015-01-08 |
| JP2024116165A (ja) | 2024-08-27 |
| JP2025094207A (ja) | 2025-06-24 |
| JP7657354B2 (ja) | 2025-04-04 |
| US20160087107A1 (en) | 2016-03-24 |
| JP6923631B2 (ja) | 2021-08-25 |
| JP7495559B2 (ja) | 2024-06-04 |
| JP2023123693A (ja) | 2023-09-05 |
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