KR20120096003A - 반도체 패키징 응용에 유용한 인터포저 필름, 및 그 관련 방법 - Google Patents

반도체 패키징 응용에 유용한 인터포저 필름, 및 그 관련 방법 Download PDF

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KR20120096003A
KR20120096003A KR20127015838A KR20127015838A KR20120096003A KR 20120096003 A KR20120096003 A KR 20120096003A KR 20127015838 A KR20127015838 A KR 20127015838A KR 20127015838 A KR20127015838 A KR 20127015838A KR 20120096003 A KR20120096003 A KR 20120096003A
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South Korea
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film
dianhydride
polyimide
rigid rod
interposer
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Korean (ko)
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브라이언 씨. 오만
메러디쓰 엘. 던바
타오 헤
코스탄티노스 코울타키스
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이 아이 듀폰 디 네모아 앤드 캄파니
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Publication of KR20120096003A publication Critical patent/KR20120096003A/ko
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
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    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
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    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
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    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
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    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
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    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Thin Film Transistor (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Organic Insulating Materials (AREA)
  • Insulating Bodies (AREA)
  • Inorganic Insulating Materials (AREA)
  • Photovoltaic Devices (AREA)
  • Wire Bonding (AREA)
KR20127015838A 2009-11-20 2010-11-19 반도체 패키징 응용에 유용한 인터포저 필름, 및 그 관련 방법 Withdrawn KR20120096003A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US26326609P 2009-11-20 2009-11-20
US61/263,266 2009-11-20

Publications (1)

Publication Number Publication Date
KR20120096003A true KR20120096003A (ko) 2012-08-29

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Family Applications (6)

Application Number Title Priority Date Filing Date
KR20127015838A Withdrawn KR20120096003A (ko) 2009-11-20 2010-11-19 반도체 패키징 응용에 유용한 인터포저 필름, 및 그 관련 방법
KR20127015825A Withdrawn KR20120096000A (ko) 2009-11-20 2010-11-19 와이어 랩 구조체 및 그 관련 방법
KR20127015826A Withdrawn KR20120096001A (ko) 2009-11-20 2010-11-19 커버레이 구조체 및 그 관련 방법
KR1020127015829A Withdrawn KR20120101459A (ko) 2009-11-20 2010-11-19 폴리이미드 필름 및 전극을 포함하는 조립체, 및 그 관련 방법
KR20127015831A Withdrawn KR20120096002A (ko) 2009-11-20 2010-11-19 열적으로 그리고 치수적으로 안정된 폴리이미드 필름 및 그 관련 방법
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EP4531093A1 (en) 2023-09-27 2025-04-02 Absolics Inc. Packaging substrate and manufacturing method of the same

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