KR20110017853A - 전자 패키징 - Google Patents

전자 패키징 Download PDF

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Publication number
KR20110017853A
KR20110017853A KR1020107025422A KR20107025422A KR20110017853A KR 20110017853 A KR20110017853 A KR 20110017853A KR 1020107025422 A KR1020107025422 A KR 1020107025422A KR 20107025422 A KR20107025422 A KR 20107025422A KR 20110017853 A KR20110017853 A KR 20110017853A
Authority
KR
South Korea
Prior art keywords
epoxy
resin composition
weight
epoxy resin
dihydroxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020107025422A
Other languages
English (en)
Korean (ko)
Inventor
뤼디거 노바크
토마스 슈로써
라이너 바르투슈
Original Assignee
에보니크 데구사 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에보니크 데구사 게엠베하 filed Critical 에보니크 데구사 게엠베하
Publication of KR20110017853A publication Critical patent/KR20110017853A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Glass Compositions (AREA)
  • Liquid Crystal Substances (AREA)
KR1020107025422A 2008-05-15 2009-04-14 전자 패키징 Withdrawn KR20110017853A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08156292A EP2119737B1 (en) 2008-05-15 2008-05-15 Electronic packaging
EP08156292.8 2008-05-15

Publications (1)

Publication Number Publication Date
KR20110017853A true KR20110017853A (ko) 2011-02-22

Family

ID=39738214

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107025422A Withdrawn KR20110017853A (ko) 2008-05-15 2009-04-14 전자 패키징

Country Status (11)

Country Link
US (1) US20110163461A1 (https=)
EP (1) EP2119737B1 (https=)
JP (1) JP2011521033A (https=)
KR (1) KR20110017853A (https=)
CN (1) CN102027036A (https=)
AT (1) ATE508154T1 (https=)
DE (1) DE602008006681D1 (https=)
ES (1) ES2364790T3 (https=)
PL (1) PL2119737T3 (https=)
TW (1) TW201004995A (https=)
WO (1) WO2009138301A1 (https=)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101321981B1 (ko) * 2012-10-25 2013-10-28 한국전기연구원 용매제어형 실리카-에폭시 하이브리드 패키징 소재 제조방법
WO2014084555A1 (ko) * 2012-11-30 2014-06-05 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판
KR20140069998A (ko) * 2012-11-30 2014-06-10 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판
KR20140070021A (ko) * 2012-11-30 2014-06-10 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판
WO2014092400A1 (ko) * 2012-12-12 2014-06-19 엘지이노텍 주식회사 에폭시 수지 조성물 및 인쇄 회로 기판
WO2014092401A1 (ko) * 2012-12-12 2014-06-19 엘지이노텍 주식회사 수지 조성물 및 이를 이용한 인쇄 회로 기판
KR20140077557A (ko) * 2012-12-14 2014-06-24 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 인쇄 회로 기판
KR20140139798A (ko) * 2013-05-28 2014-12-08 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판
US9445499B2 (en) 2012-12-12 2016-09-13 Lg Innotek Co., Ltd. Epoxy resin composition, and printed circuit board using same
US9445500B2 (en) 2012-12-14 2016-09-13 Lg Innotek Co., Ltd. Epoxy resin composition and printed circuit board using same
US9468096B2 (en) 2012-12-12 2016-10-11 Lg Innotek Co., Ltd. Epoxy resin composition, and printed circuit board using same
KR20180012343A (ko) * 2011-08-31 2018-02-05 히타치가세이가부시끼가이샤 수지 조성물, 수지 시트, 금속박 구비 수지 시트, 수지 경화물 시트, 구조체, 및 동력용 또는 광원용 반도체 디바이스

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* Cited by examiner, † Cited by third party
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KR20150097359A (ko) * 2014-02-18 2015-08-26 주식회사 엘지화학 봉지 필름 및 이를 포함하는 유기전자장치

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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180012343A (ko) * 2011-08-31 2018-02-05 히타치가세이가부시끼가이샤 수지 조성물, 수지 시트, 금속박 구비 수지 시트, 수지 경화물 시트, 구조체, 및 동력용 또는 광원용 반도체 디바이스
KR20190042109A (ko) * 2011-08-31 2019-04-23 히타치가세이가부시끼가이샤 수지 조성물, 수지 시트, 금속박 구비 수지 시트, 수지 경화물 시트, 구조체, 및 동력용 또는 광원용 반도체 디바이스
KR101321981B1 (ko) * 2012-10-25 2013-10-28 한국전기연구원 용매제어형 실리카-에폭시 하이브리드 패키징 소재 제조방법
KR20140070021A (ko) * 2012-11-30 2014-06-10 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판
KR20140069998A (ko) * 2012-11-30 2014-06-10 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판
WO2014084555A1 (ko) * 2012-11-30 2014-06-05 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판
US9462689B2 (en) 2012-11-30 2016-10-04 Lg Innotek Co., Ltd. Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition
WO2014092400A1 (ko) * 2012-12-12 2014-06-19 엘지이노텍 주식회사 에폭시 수지 조성물 및 인쇄 회로 기판
WO2014092401A1 (ko) * 2012-12-12 2014-06-19 엘지이노텍 주식회사 수지 조성물 및 이를 이용한 인쇄 회로 기판
KR20140076343A (ko) * 2012-12-12 2014-06-20 엘지이노텍 주식회사 에폭시 수지 조성물, 이를 이용한 프리프레그 및 인쇄 회로 기판
KR20140076345A (ko) * 2012-12-12 2014-06-20 엘지이노텍 주식회사 수지 조성물 및 이를 이용한 인쇄 회로 기판
US9504147B2 (en) 2012-12-12 2016-11-22 Lg Innotek Co., Ltd. Resin composition, and printed circuit board using same
US9445498B2 (en) 2012-12-12 2016-09-13 Lg Innotek Co., Ltd. Epoxy resin composition and printed circuit board
US9445499B2 (en) 2012-12-12 2016-09-13 Lg Innotek Co., Ltd. Epoxy resin composition, and printed circuit board using same
US9468096B2 (en) 2012-12-12 2016-10-11 Lg Innotek Co., Ltd. Epoxy resin composition, and printed circuit board using same
KR20140077557A (ko) * 2012-12-14 2014-06-24 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 인쇄 회로 기판
US9445500B2 (en) 2012-12-14 2016-09-13 Lg Innotek Co., Ltd. Epoxy resin composition and printed circuit board using same
KR20140139798A (ko) * 2013-05-28 2014-12-08 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판

Also Published As

Publication number Publication date
JP2011521033A (ja) 2011-07-21
EP2119737A1 (en) 2009-11-18
EP2119737B1 (en) 2011-05-04
ATE508154T1 (de) 2011-05-15
US20110163461A1 (en) 2011-07-07
WO2009138301A1 (en) 2009-11-19
PL2119737T3 (pl) 2011-09-30
DE602008006681D1 (de) 2011-06-16
CN102027036A (zh) 2011-04-20
TW201004995A (en) 2010-02-01
ES2364790T3 (es) 2011-09-14

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