TW201004995A - Electronic packaging - Google Patents
Electronic packaging Download PDFInfo
- Publication number
- TW201004995A TW201004995A TW098115688A TW98115688A TW201004995A TW 201004995 A TW201004995 A TW 201004995A TW 098115688 A TW098115688 A TW 098115688A TW 98115688 A TW98115688 A TW 98115688A TW 201004995 A TW201004995 A TW 201004995A
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy
- resin composition
- epoxy resin
- weight
- compound
- Prior art date
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- 238000004100 electronic packaging Methods 0.000 title 1
- 239000003822 epoxy resin Substances 0.000 claims abstract description 62
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 62
- 239000004593 Epoxy Substances 0.000 claims abstract description 50
- 150000001875 compounds Chemical class 0.000 claims abstract description 48
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000000203 mixture Substances 0.000 claims abstract description 24
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 14
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 5
- 125000000524 functional group Chemical group 0.000 claims abstract description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 5
- 125000002015 acyclic group Chemical group 0.000 claims abstract description 4
- 125000006165 cyclic alkyl group Chemical group 0.000 claims abstract description 4
- 125000005843 halogen group Chemical group 0.000 claims abstract description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 3
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical group C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 claims abstract 2
- -1 glycidyl ether compound Chemical class 0.000 claims description 34
- 239000011342 resin composition Substances 0.000 claims description 13
- 239000002966 varnish Substances 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000010455 vermiculite Substances 0.000 claims description 7
- 229910052902 vermiculite Inorganic materials 0.000 claims description 7
- 235000019354 vermiculite Nutrition 0.000 claims description 7
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 2
- KDTWXGUXWNBYGS-UHFFFAOYSA-N 1,2,3,3,4,4-hexamethyl-5H-diazepine Chemical group CC1(C(N(N(C=CC1)C)C)(C)C)C KDTWXGUXWNBYGS-UHFFFAOYSA-N 0.000 claims 1
- 125000003710 aryl alkyl group Chemical group 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 20
- 239000002245 particle Substances 0.000 description 19
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 18
- 229920005989 resin Polymers 0.000 description 17
- 239000011347 resin Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 11
- 239000004305 biphenyl Substances 0.000 description 9
- 235000010290 biphenyl Nutrition 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 8
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 7
- 235000021286 stilbenes Nutrition 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 6
- 229930003836 cresol Natural products 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 150000002989 phenols Chemical class 0.000 description 5
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 5
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 4
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 239000001294 propane Substances 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000001299 aldehydes Chemical class 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 2
- STTIGCCTRAFVSP-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-methylphenyl)ethenyl]-2-methylphenol Chemical compound C1=C(O)C(C)=CC(C=CC=2C=C(C)C(O)=CC=2)=C1 STTIGCCTRAFVSP-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- OWEOAOVIPDYHKL-UHFFFAOYSA-N 6-tert-butyl-2-[2-(4-hydroxy-3,5-dimethylphenyl)ethenyl]-3-methylphenol Chemical compound CC1=C(O)C(C)=CC(C=CC=2C(=C(C=CC=2C)C(C)(C)C)O)=C1 OWEOAOVIPDYHKL-UHFFFAOYSA-N 0.000 description 2
- OAOABCKPVCUNKO-UHFFFAOYSA-N 8-methyl Nonanoic acid Chemical compound CC(C)CCCCCCC(O)=O OAOABCKPVCUNKO-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- SVOGQRMBDCQOJU-UHFFFAOYSA-N [dimethyl-(trimethylsilylamino)silyl]methane;dioxosilane Chemical compound O=[Si]=O.C[Si](C)(C)N[Si](C)(C)C SVOGQRMBDCQOJU-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000004002 naphthaldehydes Chemical class 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical group 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- UDPGUMQDCGORJQ-UHFFFAOYSA-N (2-chloroethyl)phosphonic acid Chemical compound OP(O)(=O)CCCl UDPGUMQDCGORJQ-UHFFFAOYSA-N 0.000 description 1
- HIACAHMKXQESOV-UHFFFAOYSA-N 1,2-bis(prop-1-en-2-yl)benzene Chemical compound CC(=C)C1=CC=CC=C1C(C)=C HIACAHMKXQESOV-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical compound C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- PEBXLTUWFWEWGV-UHFFFAOYSA-N 1-methyl-2-(2-phenylethenyl)benzene Chemical compound CC1=CC=CC=C1C=CC1=CC=CC=C1 PEBXLTUWFWEWGV-UHFFFAOYSA-N 0.000 description 1
- YTPFRRRNIYVFFE-UHFFFAOYSA-N 2,2,3,3,5,5-hexamethyl-1,4-dioxane Chemical group CC1(C)COC(C)(C)C(C)(C)O1 YTPFRRRNIYVFFE-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- RLYCRLGLCUXUPO-UHFFFAOYSA-N 2,6-diaminotoluene Chemical compound CC1=C(N)C=CC=C1N RLYCRLGLCUXUPO-UHFFFAOYSA-N 0.000 description 1
- IRGKJPHTQIWQTD-UHFFFAOYSA-N 2,7-dibromopyrene-1,3,6,8-tetrone Chemical compound O=C1C(Br)C(=O)C2=CC=C3C(=O)C(Br)C(=O)C4=CC=C1C2=C43 IRGKJPHTQIWQTD-UHFFFAOYSA-N 0.000 description 1
- XZSLGWCQEPZKBV-UHFFFAOYSA-N 2-[2-(2-hydroxy-3,5-dimethylphenyl)ethenyl]-4,6-dimethylphenol Chemical compound CC1=CC(C)=C(O)C(C=CC=2C(=C(C)C=C(C)C=2)O)=C1 XZSLGWCQEPZKBV-UHFFFAOYSA-N 0.000 description 1
- QUYQIRFCQWSDCO-UHFFFAOYSA-N 2-[2-(2-hydroxyphenyl)-2-methyl-5-propan-2-ylcyclohexyl]phenol Chemical compound C1C(C(C)C)CCC(C)(C=2C(=CC=CC=2)O)C1C1=CC=CC=C1O QUYQIRFCQWSDCO-UHFFFAOYSA-N 0.000 description 1
- VSPACGJZGWGLBV-UHFFFAOYSA-N 2-butyl-6-tert-butyl-4-[2-(4-hydroxy-3-methylphenyl)ethenyl]phenol Chemical compound CC(C)(C)C1=C(O)C(CCCC)=CC(C=CC=2C=C(C)C(O)=CC=2)=C1 VSPACGJZGWGLBV-UHFFFAOYSA-N 0.000 description 1
- XXZQVSMJERUPRN-UHFFFAOYSA-N 2-ethyl-4-[2-(4-hydroxyphenyl)ethenyl]phenol Chemical compound C1=C(O)C(CC)=CC(C=CC=2C=CC(O)=CC=2)=C1 XXZQVSMJERUPRN-UHFFFAOYSA-N 0.000 description 1
- APVOBFYCWRJFCP-UHFFFAOYSA-N 2-hexyl-4-[2-(3-hexyl-4-hydroxyphenyl)ethenyl]phenol Chemical compound C1=C(O)C(CCCCCC)=CC(C=CC=2C=C(CCCCCC)C(O)=CC=2)=C1 APVOBFYCWRJFCP-UHFFFAOYSA-N 0.000 description 1
- NVVSVSWYKWRHED-UHFFFAOYSA-N 2-tert-butyl-4-[2-(3-tert-butyl-4-hydroxy-5-methylphenyl)ethenyl]-6-methylphenol Chemical compound CC(C)(C)C1=C(O)C(C)=CC(C=CC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 NVVSVSWYKWRHED-UHFFFAOYSA-N 0.000 description 1
- RXBMYSARZYCCFQ-UHFFFAOYSA-N 2-tert-butyl-4-[2-(4-hydroxy-3-methylphenyl)ethenyl]-5-methylphenol Chemical compound C1=C(O)C(C)=CC(C=CC=2C(=CC(O)=C(C=2)C(C)(C)C)C)=C1 RXBMYSARZYCCFQ-UHFFFAOYSA-N 0.000 description 1
- ZRBLGHDBCWLKBG-UHFFFAOYSA-N 2-tert-butyl-4-[2-(4-hydroxy-3-methylphenyl)ethenyl]-6-pentylphenol Chemical compound CC(C)(C)C1=C(O)C(CCCCC)=CC(C=CC=2C=C(C)C(O)=CC=2)=C1 ZRBLGHDBCWLKBG-UHFFFAOYSA-N 0.000 description 1
- CQOMONZTZPLOFS-UHFFFAOYSA-N 2-tert-butyl-4-[2-(4-hydroxy-3-methylphenyl)ethenyl]-6-propylphenol Chemical compound CC(C)(C)C1=C(O)C(CCC)=CC(C=CC=2C=C(C)C(O)=CC=2)=C1 CQOMONZTZPLOFS-UHFFFAOYSA-N 0.000 description 1
- MHEPBAWJFVJKKU-UHFFFAOYSA-N 2-tert-butyl-4-[2-(5-tert-butyl-4-hydroxy-2-methylphenyl)ethenyl]-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1C=CC1=CC(C(C)(C)C)=C(O)C=C1C MHEPBAWJFVJKKU-UHFFFAOYSA-N 0.000 description 1
- HEVCNGXJTCKWFX-UHFFFAOYSA-N 2-tert-butyl-6-hexyl-4-[2-(4-hydroxy-3-methylphenyl)ethenyl]phenol Chemical compound CC(C)(C)C1=C(O)C(CCCCCC)=CC(C=CC=2C=C(C)C(O)=CC=2)=C1 HEVCNGXJTCKWFX-UHFFFAOYSA-N 0.000 description 1
- CKOFBUUFHALZGK-UHFFFAOYSA-N 3-[(3-aminophenyl)methyl]aniline Chemical compound NC1=CC=CC(CC=2C=C(N)C=CC=2)=C1 CKOFBUUFHALZGK-UHFFFAOYSA-N 0.000 description 1
- LBPVOEHZEWAJKQ-UHFFFAOYSA-N 3-[4-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 LBPVOEHZEWAJKQ-UHFFFAOYSA-N 0.000 description 1
- 229940018563 3-aminophenol Drugs 0.000 description 1
- UCSYVYFGMFODMY-UHFFFAOYSA-N 3-phenoxyaniline Chemical compound NC1=CC=CC(OC=2C=CC=CC=2)=C1 UCSYVYFGMFODMY-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- CHGAHGVFBSDYEL-UHFFFAOYSA-N 4,6-dimethyl-2-[2-(2-methylphenyl)ethenyl]benzene-1,3-diol Chemical compound OC1=C(C=C(C(=C1C=CC1=CC=CC=C1C)O)C)C CHGAHGVFBSDYEL-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- JPSMTGONABILTP-UHFFFAOYSA-N 4-(4-hydroxy-3,5-dimethylphenyl)sulfanyl-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(SC=2C=C(C)C(O)=C(C)C=2)=C1 JPSMTGONABILTP-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- PMNXCGMIMVLCRP-ZHACJKMWSA-N 4-[(e)-2-(4-hydroxyphenyl)prop-1-enyl]phenol Chemical compound C=1C=C(O)C=CC=1C(/C)=C/C1=CC=C(O)C=C1 PMNXCGMIMVLCRP-ZHACJKMWSA-N 0.000 description 1
- WTWMJYNGYCJIGR-UHFFFAOYSA-N 4-[2-(4-hydroxy-3,5-dimethylphenyl)ethenyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C=CC=2C=C(C)C(O)=C(C)C=2)=C1 WTWMJYNGYCJIGR-UHFFFAOYSA-N 0.000 description 1
- HZNKBLVEKHJQDZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-methylphenyl)ethenyl]-2,6-dimethylphenol Chemical compound C1=C(O)C(C)=CC(C=CC=2C=C(C)C(O)=C(C)C=2)=C1 HZNKBLVEKHJQDZ-UHFFFAOYSA-N 0.000 description 1
- RIRJMZPJXROBNY-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-pentylphenyl)ethenyl]-2-pentylphenol Chemical compound C1=C(O)C(CCCCC)=CC(C=CC=2C=C(CCCCC)C(O)=CC=2)=C1 RIRJMZPJXROBNY-UHFFFAOYSA-N 0.000 description 1
- XIWOCLAUIGPSNG-UHFFFAOYSA-N 4-[2-(5-tert-butyl-4-hydroxy-2-methylphenyl)ethenyl]-2,6-dimethylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1C=CC1=CC(C)=C(O)C(C)=C1 XIWOCLAUIGPSNG-UHFFFAOYSA-N 0.000 description 1
- ATDHLWAEQJXNJF-UHFFFAOYSA-N 4-[2-(5-tert-butyl-4-hydroxy-2-methylphenyl)ethenyl]-2-methyl-6-propylphenol Chemical compound CC1=C(O)C(CCC)=CC(C=CC=2C(=CC(O)=C(C=2)C(C)(C)C)C)=C1 ATDHLWAEQJXNJF-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 description 1
- UUDRHPQBSJNLSJ-UHFFFAOYSA-N 6-tert-butyl-2-[2-(5-tert-butyl-4-hydroxy-2-methylphenyl)ethenyl]-3-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1C=CC1=C(C)C=CC(C(C)(C)C)=C1O UUDRHPQBSJNLSJ-UHFFFAOYSA-N 0.000 description 1
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 description 1
- LTPHTIDRJFCYGF-UHFFFAOYSA-N C(C1CO1)N(C1=CC=CC=C1)CC1CO1.NN Chemical compound C(C1CO1)N(C1=CC=CC=C1)CC1CO1.NN LTPHTIDRJFCYGF-UHFFFAOYSA-N 0.000 description 1
- FYHMNPAXBKEJER-UHFFFAOYSA-N CC1=C(C)C(C)=CC(C=CC=2C=CC=CC=2)=C1C Chemical compound CC1=C(C)C(C)=CC(C=CC=2C=CC=CC=2)=C1C FYHMNPAXBKEJER-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- LBSAALDJLZLSHN-UHFFFAOYSA-N Cc1cc(C)cc(c1)C(O)=C(O)c1cc(C)cc(C)c1 Chemical compound Cc1cc(C)cc(c1)C(O)=C(O)c1cc(C)cc(C)c1 LBSAALDJLZLSHN-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- ZNZYKNKBJPZETN-WELNAUFTSA-N Dialdehyde 11678 Chemical compound N1C2=CC=CC=C2C2=C1[C@H](C[C@H](/C(=C/O)C(=O)OC)[C@@H](C=C)C=O)NCC2 ZNZYKNKBJPZETN-WELNAUFTSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- FMLYEBRADICKTC-UHFFFAOYSA-N OB(O)OC1=CC=CC=C1.N.N Chemical compound OB(O)OC1=CC=CC=C1.N.N FMLYEBRADICKTC-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XZAHJRZBUWYCBM-UHFFFAOYSA-N [1-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1(CN)CCCCC1 XZAHJRZBUWYCBM-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000000010 aprotic solvent Substances 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- KXHPPCXNWTUNSB-UHFFFAOYSA-M benzyl(trimethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1=CC=CC=C1 KXHPPCXNWTUNSB-UHFFFAOYSA-M 0.000 description 1
- NDKBVBUGCNGSJJ-UHFFFAOYSA-M benzyltrimethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)CC1=CC=CC=C1 NDKBVBUGCNGSJJ-UHFFFAOYSA-M 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000031709 bromination Effects 0.000 description 1
- 238000005893 bromination reaction Methods 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- BULLHNJGPPOUOX-UHFFFAOYSA-N chloroacetone Chemical compound CC(=O)CCl BULLHNJGPPOUOX-UHFFFAOYSA-N 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Substances OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004690 coupled electron pair approximation Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000006266 etherification reaction Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000005189 flocculation Methods 0.000 description 1
- 230000016615 flocculation Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- VPNCNWDKIRHNKD-UHFFFAOYSA-N hexane;methanamine Chemical compound NC.NC.CCCCCC VPNCNWDKIRHNKD-UHFFFAOYSA-N 0.000 description 1
- 235000012907 honey Nutrition 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate Chemical compound [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Chemical class 0.000 description 1
- 239000002184 metal Chemical class 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000011987 methylation Effects 0.000 description 1
- 238000007069 methylation reaction Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- OOHAUGDGCWURIT-UHFFFAOYSA-N n,n-dipentylpentan-1-amine Chemical compound CCCCCN(CCCCC)CCCCC OOHAUGDGCWURIT-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 150000004780 naphthols Chemical class 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- 150000002927 oxygen compounds Chemical class 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- DOXFBSZBACYHFY-UHFFFAOYSA-N phenol;stilbene Chemical compound OC1=CC=CC=C1.C=1C=CC=CC=1C=CC1=CC=CC=C1 DOXFBSZBACYHFY-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- RMZAYIKUYWXQPB-UHFFFAOYSA-N trioctylphosphane Chemical compound CCCCCCCCP(CCCCCCCC)CCCCCCCC RMZAYIKUYWXQPB-UHFFFAOYSA-N 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
- Glass Compositions (AREA)
- Liquid Crystal Substances (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP08156292A EP2119737B1 (en) | 2008-05-15 | 2008-05-15 | Electronic packaging |
Publications (1)
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|---|---|
| TW201004995A true TW201004995A (en) | 2010-02-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098115688A TW201004995A (en) | 2008-05-15 | 2009-05-12 | Electronic packaging |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20110163461A1 (https=) |
| EP (1) | EP2119737B1 (https=) |
| JP (1) | JP2011521033A (https=) |
| KR (1) | KR20110017853A (https=) |
| CN (1) | CN102027036A (https=) |
| AT (1) | ATE508154T1 (https=) |
| DE (1) | DE602008006681D1 (https=) |
| ES (1) | ES2364790T3 (https=) |
| PL (1) | PL2119737T3 (https=) |
| TW (1) | TW201004995A (https=) |
| WO (1) | WO2009138301A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106030846B (zh) * | 2014-02-18 | 2018-09-04 | 株式会社Lg化学 | 封装膜及包括该封装膜的有机电子装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103764713B (zh) * | 2011-08-31 | 2016-08-24 | 日立化成株式会社 | 树脂组合物、树脂片、带金属箔的树脂片、树脂固化物片、结构体、以及动力用或光源用半导体装置 |
| KR101321981B1 (ko) * | 2012-10-25 | 2013-10-28 | 한국전기연구원 | 용매제어형 실리카-에폭시 하이브리드 패키징 소재 제조방법 |
| KR101985255B1 (ko) * | 2012-11-30 | 2019-06-03 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판 |
| US9462689B2 (en) | 2012-11-30 | 2016-10-04 | Lg Innotek Co., Ltd. | Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition |
| KR101985256B1 (ko) * | 2012-11-30 | 2019-06-03 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판 |
| KR101984791B1 (ko) * | 2012-12-12 | 2019-09-03 | 엘지이노텍 주식회사 | 에폭시 수지 조성물, 이를 이용한 프리프레그 및 인쇄 회로 기판 |
| KR101973686B1 (ko) | 2012-12-12 | 2019-08-26 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 인쇄 회로 기판 |
| KR102012311B1 (ko) * | 2012-12-12 | 2019-08-20 | 엘지이노텍 주식회사 | 수지 조성물 및 이를 이용한 인쇄 회로 기판 |
| KR101973685B1 (ko) | 2012-12-12 | 2019-08-26 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 인쇄 회로 기판 |
| KR101952356B1 (ko) * | 2012-12-14 | 2019-02-26 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 인쇄 회로 기판 |
| KR102034228B1 (ko) | 2012-12-14 | 2019-10-18 | 엘지이노텍 주식회사 | 에폭시 수지 조성물, 이를 이용한 프리프레그 및 인쇄 회로 기판 |
| KR102022430B1 (ko) * | 2013-05-28 | 2019-09-18 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판 |
Family Cites Families (54)
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|---|---|---|---|---|
| US3333776A (en) * | 1965-04-05 | 1967-08-01 | Dow Corning | Hydrophobic silica as a grinding aid |
| US4043969A (en) * | 1973-04-23 | 1977-08-23 | National Semiconductor Corporation | Casting compound for semiconductor devices |
| JPS6031517A (ja) | 1983-07-29 | 1985-02-18 | Sumitomo Chem Co Ltd | エポキシ樹脂の製造法 |
| JP2501804B2 (ja) * | 1986-11-20 | 1996-05-29 | 松下電工株式会社 | エポキシ樹脂組成物 |
| EP0289632A1 (en) * | 1987-05-04 | 1988-11-09 | American Cyanamid Company | High green strength induction curable adhesives |
| JPH01297453A (ja) * | 1988-05-24 | 1989-11-30 | Matsushita Electric Works Ltd | 一液性エポキシ樹脂組成物 |
| DE4119332A1 (de) * | 1991-06-12 | 1992-12-17 | Huels Chemische Werke Ag | Verfahren zur herstellung von methylidengruppen enthaltenden (alpha), (omega) -ungesaettigten oligomeren aus (alpha), (omega) -diolefinen in gegenwart von aluminiumorganischen verbindungen als katalysator |
| DE4233021A1 (de) * | 1992-10-01 | 1994-04-07 | Huels Chemische Werke Ag | Organosilanpolykondensate |
| US6193795B1 (en) * | 1993-08-02 | 2001-02-27 | Degussa Corporation | Low structure pyrogenic hydrophilic and hydrophobic metallic oxides, production and use |
| DE19508088A1 (de) * | 1995-03-08 | 1996-09-12 | Huels Chemische Werke Ag | Verfahren zur Herstellung eines Oligomer-Gemisches aus alpha,omega-Diolefinen |
| JP3508289B2 (ja) * | 1995-05-02 | 2004-03-22 | 住友化学工業株式会社 | エポキシ樹脂組成物および樹脂封止型半導体装置 |
| EP0739877B1 (en) * | 1995-04-27 | 1999-08-04 | Sumitomo Chemical Company Limited | Epoxy resin, resin composition, and resin-encapsulated semiconductor device |
| US5959005A (en) | 1996-04-26 | 1999-09-28 | Degussa-Huls Aktiengesellschaft | Silanized silica |
| DE19616781A1 (de) * | 1996-04-26 | 1997-11-06 | Degussa | Silanisierte Kieselsäure |
| DE19624032A1 (de) * | 1996-06-17 | 1997-12-18 | Huels Chemische Werke Ag | Oligomerengemisch kondensierter Alkylalkoxysilane |
| DE19639782A1 (de) * | 1996-09-27 | 1998-04-02 | Huels Chemische Werke Ag | Glycidether-, Acryl- und/oder Methacryl-funktionelle Organopolysiloxan-haltige Zusammensetzungen auf Wasser-Basis, Verfahren zu deren Herstellung sowie deren Verwendung |
| JPH10298170A (ja) * | 1997-02-28 | 1998-11-10 | Sumitomo Chem Co Ltd | エポキシ化合物、その製造法、その精製方法、エポキシ樹脂組成物および樹脂封止型半導体装置 |
| TW593528B (en) * | 1997-03-31 | 2004-06-21 | Sumitomo Chemical Co | Epoxy resin composition |
| DE19818924A1 (de) * | 1998-04-28 | 1999-11-04 | Degussa | Oberflächenmodifizierte Füllstoffe, Verfahren zu deren Herstellung sowie deren Verwendung |
| JP2000044773A (ja) * | 1998-07-28 | 2000-02-15 | Konishi Co Ltd | １液湿気硬化型組成物 |
| DE19834990B4 (de) * | 1998-08-03 | 2005-09-15 | Degussa Ag | Acryloxypropyl- oder Methacryloxypropyl-Gruppen enthaltende Siloxan-Oligomere, Verfahren zu ihrer Herstellung sowie deren Verwendung |
| DE19848351A1 (de) * | 1998-10-21 | 2000-04-27 | Degussa | Vernetzbare Polymere, Verfahren zu deren Herstellung und Formkörper aus vernetzten Polymeren |
| DE19849308A1 (de) * | 1998-10-27 | 2000-05-04 | Degussa | Aminopropyl-funktionelle Siloxan-Oligomere |
| DE19904132C2 (de) * | 1999-02-03 | 2002-11-28 | Degussa | Zusammensetzung fluororganofunktioneller Silane und Siloxane, Verfahren zu ihrer Herstellung und ihre Verwendung |
| DE19929021A1 (de) * | 1999-06-25 | 2000-12-28 | Degussa | Funktionelle Organylorganyloxysilane auf Trägerstoffen in Kabelcompounds |
| DE19961972A1 (de) * | 1999-12-22 | 2001-06-28 | Degussa | Organosilan- und/oder Organosiloxan-haltige Mittel für gefülltes Polyamid |
| EP1195417B1 (de) * | 2000-10-05 | 2009-10-14 | Evonik Degussa GmbH | Siliciumorganische Nanokapseln |
| EP1195416A3 (de) * | 2000-10-05 | 2005-12-28 | Degussa AG | Polymerisierbare siliciumorganische Nanokapseln |
| DE10056344A1 (de) * | 2000-11-14 | 2002-05-16 | Degussa | n-Propylethoxysiloxane, Verfahren zu deren Herstellung und deren Verwendung |
| DE10100384A1 (de) * | 2001-01-05 | 2002-07-11 | Degussa | Verfahren zur Modifizierung der Funktionalität von organofunktionellen Substratoberflächen |
| EP1245627B1 (de) * | 2001-03-30 | 2007-07-04 | Degussa GmbH | Siliciumorganische Nano-Mikrohybridsysteme oder Mikrohybridsysteme enthaltende Zusammensetzung für kratz- und abriebfeste Beschichtungen |
| EP1249470A3 (de) * | 2001-03-30 | 2005-12-28 | Degussa AG | Hochgefüllte pastöse siliciumorganische Nano- und/oder Mikrohybridkapseln enthaltende Zusammensetzung für kratz- und/oder abriebfeste Beschichtungen |
| DE10132942A1 (de) * | 2001-07-06 | 2003-01-23 | Degussa | Siloxan-Oligomere, Verfahren zu deren Herstellung und deren Verwendung |
| DE10141687A1 (de) * | 2001-08-25 | 2003-03-06 | Degussa | Siliciumverbindungen enthaltendes Mittel zur Beschichtung von Oberflächen |
| DE10142555A1 (de) * | 2001-08-30 | 2003-03-20 | Degussa | Mittel für die Verbesserung der Scorch-Bedingungen bei der Herstellung gepfropfter und/oder vernetzter Polymere sowie gefüllter Kunststoffe |
| DE10159952A1 (de) * | 2001-12-06 | 2003-06-18 | Degussa | Verwendung flüssiger oder auf Trägermaterial aufgebrachter ungestättigter Organosilan/-mischungen zur Herstellung von feuchtigkeitsvernetzten und gefüllten Kabelcompounds |
| DE10212523A1 (de) * | 2002-03-21 | 2003-10-02 | Degussa | Lufttrocknende, silanhaltige Beschichtungsmittel |
| DE10238369A1 (de) * | 2002-08-22 | 2004-03-04 | Degussa Ag | Mittel als Haftvermittler für gefüllte und peroxidisch zu vernetzende Gummicompounds |
| DE10327624B3 (de) * | 2003-06-20 | 2004-12-30 | Degussa Ag | Organosiliciumverbindungen, Verfahren zu ihrer Herstellung, sowie ihre Verwendung |
| DE10362060B4 (de) * | 2003-10-21 | 2009-07-09 | Altana Coatings & Sealants Gmbh | Verpackungsmaterial mit einer Barriereschicht für Gase |
| DE102004007456A1 (de) * | 2004-02-13 | 2005-09-01 | Degussa Ag | Hochgefüllte Polyolefin-Compounds |
| KR100846547B1 (ko) * | 2004-07-13 | 2008-07-15 | 히다치 가세고교 가부시끼가이샤 | 밀봉용 에폭시 수지 성형 재료 및 전자 부품 장치 |
| JP4977973B2 (ja) * | 2004-07-13 | 2012-07-18 | 日立化成工業株式会社 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
| DE102004037043A1 (de) * | 2004-07-29 | 2006-03-23 | Degussa Ag | Blockkondensate organofunktioneller Siloxane, deren Herstellung, Verwendung sowie deren Eigenschaften |
| DE102004049427A1 (de) * | 2004-10-08 | 2006-04-13 | Degussa Ag | Polyetherfunktionelle Siloxane, polyethersiloxanhaltige Zusammensetzungen, Verfahren zu deren Herstellung und deren Verwendung |
| DE102005004872A1 (de) * | 2005-02-03 | 2006-08-10 | Degussa Ag | Wässrige Emulsionen von funktionellen Alkoxysilanen und deren kondensierten Oligomeren, deren Herstellung und Verwendung zur Oberflächenbehandlung |
| DE102005004871A1 (de) * | 2005-02-03 | 2006-08-10 | Degussa Ag | Hochviskose wässrige Emulsionen von funktionellen Alkoxysilanen, deren kondensierten Oligomeren, Organopolysiloxanen, deren Herstellung und Verwendung zur Oerflächenbehandlung von anorganischen Materialien |
| DE102006013090A1 (de) * | 2006-03-20 | 2007-09-27 | Georg-August-Universität Göttingen | Kompositwerkstoff aus Holz und thermoplastischem Kunststoff |
| DE102006033310A1 (de) * | 2006-07-17 | 2008-01-31 | Evonik Degussa Gmbh | Gemische aus siliciumhaltigen Kopplungsreagentien |
| DK1982964T3 (da) * | 2007-04-20 | 2019-05-20 | Evonik Degussa Gmbh | Blanding indeholdende organosiliciumforbindelse og anvendelse heraf |
| DE102007038314A1 (de) * | 2007-08-14 | 2009-04-16 | Evonik Degussa Gmbh | Verfahren zur kontrollierten Hydrolyse und Kondensation von Epoxy-funktionellen Organosilanen sowie deren Condensation mit weiteren organofunktionellen Alkoxysilanen |
| DE102007045186A1 (de) * | 2007-09-21 | 2009-04-09 | Continental Teves Ag & Co. Ohg | Rückstandsfreies, schichtbildendes, wässriges Versiegelungssystem für metallische Oberflächen auf Silan-Basis |
| DE102008001808A1 (de) * | 2008-05-15 | 2009-11-19 | Evonik Degussa Gmbh | Beschichtungszusammensetzung |
| DE102008001855A1 (de) * | 2008-05-19 | 2009-11-26 | Evonik Degussa Gmbh | Zweikomponenten-Zusammensetzung zur Herstellung von flexiblen Polyurethan-Gelcoats |
-
2008
- 2008-05-15 ES ES08156292T patent/ES2364790T3/es active Active
- 2008-05-15 EP EP08156292A patent/EP2119737B1/en not_active Not-in-force
- 2008-05-15 AT AT08156292T patent/ATE508154T1/de not_active IP Right Cessation
- 2008-05-15 DE DE602008006681T patent/DE602008006681D1/de active Active
- 2008-05-15 PL PL08156292T patent/PL2119737T3/pl unknown
-
2009
- 2009-04-14 KR KR1020107025422A patent/KR20110017853A/ko not_active Withdrawn
- 2009-04-14 WO PCT/EP2009/054393 patent/WO2009138301A1/en not_active Ceased
- 2009-04-14 CN CN2009801174440A patent/CN102027036A/zh active Pending
- 2009-04-14 JP JP2011508855A patent/JP2011521033A/ja active Pending
- 2009-04-14 US US12/992,684 patent/US20110163461A1/en not_active Abandoned
- 2009-05-12 TW TW098115688A patent/TW201004995A/zh unknown
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106030846B (zh) * | 2014-02-18 | 2018-09-04 | 株式会社Lg化学 | 封装膜及包括该封装膜的有机电子装置 |
| US10096797B2 (en) | 2014-02-18 | 2018-10-09 | Lg Chem, Ltd. | Encapsulation film and organic electronic device comprising the same |
| US10135022B2 (en) | 2014-02-18 | 2018-11-20 | Lg Chem, Ltd. | Encapsulation film with light absorbing material |
| TWI647102B (zh) * | 2014-02-18 | 2019-01-11 | Ｌｇ化學股份有限公司 | 封裝膜及包含彼之有機電子裝置 |
| US10181577B1 (en) | 2014-02-18 | 2019-01-15 | Lg Chem, Ltd. | Encapsulation film and organic electronic device comprising the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011521033A (ja) | 2011-07-21 |
| EP2119737A1 (en) | 2009-11-18 |
| EP2119737B1 (en) | 2011-05-04 |
| ATE508154T1 (de) | 2011-05-15 |
| KR20110017853A (ko) | 2011-02-22 |
| US20110163461A1 (en) | 2011-07-07 |
| WO2009138301A1 (en) | 2009-11-19 |
| PL2119737T3 (pl) | 2011-09-30 |
| DE602008006681D1 (de) | 2011-06-16 |
| CN102027036A (zh) | 2011-04-20 |
| ES2364790T3 (es) | 2011-09-14 |
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