JP2011521033A - 電子パッケージング - Google Patents
電子パッケージング Download PDFInfo
- Publication number
- JP2011521033A JP2011521033A JP2011508855A JP2011508855A JP2011521033A JP 2011521033 A JP2011521033 A JP 2011521033A JP 2011508855 A JP2011508855 A JP 2011508855A JP 2011508855 A JP2011508855 A JP 2011508855A JP 2011521033 A JP2011521033 A JP 2011521033A
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- Prior art keywords
- epoxy
- resin composition
- epoxy resin
- mass
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004100 electronic packaging Methods 0.000 title 1
- 239000003822 epoxy resin Substances 0.000 claims abstract description 62
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 62
- 239000004593 Epoxy Substances 0.000 claims abstract description 49
- 150000001875 compounds Chemical class 0.000 claims abstract description 43
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000000203 mixture Substances 0.000 claims abstract description 24
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 125000000524 functional group Chemical group 0.000 claims abstract description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 5
- 125000002015 acyclic group Chemical group 0.000 claims abstract description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 4
- 125000006165 cyclic alkyl group Chemical group 0.000 claims abstract description 4
- 229910021485 fumed silica Inorganic materials 0.000 claims abstract description 4
- 125000005843 halogen group Chemical group 0.000 claims abstract description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 4
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical group C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 claims abstract description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 3
- -1 glycidyl ether compound Chemical class 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 239000011342 resin composition Substances 0.000 claims description 14
- 229920003986 novolac Polymers 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000011256 inorganic filler Substances 0.000 claims description 5
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 5
- 239000002245 particle Substances 0.000 description 21
- 239000000843 powder Substances 0.000 description 20
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 239000000945 filler Substances 0.000 description 12
- 150000002989 phenols Chemical class 0.000 description 12
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 10
- 238000002156 mixing Methods 0.000 description 10
- 239000004305 biphenyl Substances 0.000 description 8
- 235000010290 biphenyl Nutrition 0.000 description 8
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 8
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 5
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 4
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 4
- 229930003836 cresol Natural products 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 235000021286 stilbenes Nutrition 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- WTWMJYNGYCJIGR-UHFFFAOYSA-N 4-[2-(4-hydroxy-3,5-dimethylphenyl)ethenyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C=CC=2C=C(C)C(O)=C(C)C=2)=C1 WTWMJYNGYCJIGR-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- XZSLGWCQEPZKBV-UHFFFAOYSA-N 2-[2-(2-hydroxy-3,5-dimethylphenyl)ethenyl]-4,6-dimethylphenol Chemical compound CC1=CC(C)=C(O)C(C=CC=2C(=C(C)C=C(C)C=2)O)=C1 XZSLGWCQEPZKBV-UHFFFAOYSA-N 0.000 description 2
- NVVSVSWYKWRHED-UHFFFAOYSA-N 2-tert-butyl-4-[2-(3-tert-butyl-4-hydroxy-5-methylphenyl)ethenyl]-6-methylphenol Chemical compound CC(C)(C)C1=C(O)C(C)=CC(C=CC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 NVVSVSWYKWRHED-UHFFFAOYSA-N 0.000 description 2
- MHEPBAWJFVJKKU-UHFFFAOYSA-N 2-tert-butyl-4-[2-(5-tert-butyl-4-hydroxy-2-methylphenyl)ethenyl]-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1C=CC1=CC(C(C)(C)C)=C(O)C=C1C MHEPBAWJFVJKKU-UHFFFAOYSA-N 0.000 description 2
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 2
- HZNKBLVEKHJQDZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-methylphenyl)ethenyl]-2,6-dimethylphenol Chemical compound C1=C(O)C(C)=CC(C=CC=2C=C(C)C(O)=C(C)C=2)=C1 HZNKBLVEKHJQDZ-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 150000003003 phosphines Chemical class 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- XLAIWHIOIFKLEO-UHFFFAOYSA-N (E)-4-<2-(4-hydroxyphenyl)ethenyl>phenol Natural products C1=CC(O)=CC=C1C=CC1=CC=C(O)C=C1 XLAIWHIOIFKLEO-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- SDRZFSPCVYEJTP-UHFFFAOYSA-N 1-ethenylcyclohexene Chemical compound C=CC1=CCCCC1 SDRZFSPCVYEJTP-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- RLYCRLGLCUXUPO-UHFFFAOYSA-N 2,6-diaminotoluene Chemical compound CC1=C(N)C=CC=C1N RLYCRLGLCUXUPO-UHFFFAOYSA-N 0.000 description 1
- AWUDLXWGQXPWFF-UHFFFAOYSA-N 2,6-ditert-butyl-4-[2-(3,5-ditert-butyl-4-hydroxyphenyl)ethenyl]phenol Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(C=CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 AWUDLXWGQXPWFF-UHFFFAOYSA-N 0.000 description 1
- TYJBGRITOIMGRY-UHFFFAOYSA-N 2-[[4-[2-[4-(oxiran-2-ylmethyl)cyclohexyl]propan-2-yl]cyclohexyl]methyl]oxirane Chemical compound C1CC(CC2OC2)CCC1C(C)(C)C(CC1)CCC1CC1CO1 TYJBGRITOIMGRY-UHFFFAOYSA-N 0.000 description 1
- HCPJEHJGFKWRFM-UHFFFAOYSA-N 2-amino-5-methylphenol Chemical compound CC1=CC=C(N)C(O)=C1 HCPJEHJGFKWRFM-UHFFFAOYSA-N 0.000 description 1
- VSPACGJZGWGLBV-UHFFFAOYSA-N 2-butyl-6-tert-butyl-4-[2-(4-hydroxy-3-methylphenyl)ethenyl]phenol Chemical compound CC(C)(C)C1=C(O)C(CCCC)=CC(C=CC=2C=C(C)C(O)=CC=2)=C1 VSPACGJZGWGLBV-UHFFFAOYSA-N 0.000 description 1
- BUJNYGHLOJAANG-UHFFFAOYSA-N 2-cyclohexyl-4-[2-(3-cyclohexyl-4-hydroxyphenyl)ethenyl]phenol Chemical compound C1=C(C2CCCCC2)C(O)=CC=C1C=CC(C=1)=CC=C(O)C=1C1CCCCC1 BUJNYGHLOJAANG-UHFFFAOYSA-N 0.000 description 1
- ZPEVKIJTEPEFKM-UHFFFAOYSA-N 2-ethyl-4-[2-(3-ethyl-4-hydroxyphenyl)ethenyl]phenol Chemical compound C1=C(O)C(CC)=CC(C=CC=2C=C(CC)C(O)=CC=2)=C1 ZPEVKIJTEPEFKM-UHFFFAOYSA-N 0.000 description 1
- XXZQVSMJERUPRN-UHFFFAOYSA-N 2-ethyl-4-[2-(4-hydroxyphenyl)ethenyl]phenol Chemical compound C1=C(O)C(CC)=CC(C=CC=2C=CC(O)=CC=2)=C1 XXZQVSMJERUPRN-UHFFFAOYSA-N 0.000 description 1
- CGUGUEODIDAHRI-UHFFFAOYSA-N 2-hexyl-4-[2-(4-hydroxyphenyl)ethenyl]phenol Chemical compound C1=C(O)C(CCCCCC)=CC(C=CC=2C=CC(O)=CC=2)=C1 CGUGUEODIDAHRI-UHFFFAOYSA-N 0.000 description 1
- IYOJSNCIVRKWKJ-UHFFFAOYSA-N 2-tert-butyl-4-[2-(3-tert-butyl-4-hydroxyphenyl)ethenyl]phenol Chemical compound C1=C(O)C(C(C)(C)C)=CC(C=CC=2C=C(C(O)=CC=2)C(C)(C)C)=C1 IYOJSNCIVRKWKJ-UHFFFAOYSA-N 0.000 description 1
- RXBMYSARZYCCFQ-UHFFFAOYSA-N 2-tert-butyl-4-[2-(4-hydroxy-3-methylphenyl)ethenyl]-5-methylphenol Chemical compound C1=C(O)C(C)=CC(C=CC=2C(=CC(O)=C(C=2)C(C)(C)C)C)=C1 RXBMYSARZYCCFQ-UHFFFAOYSA-N 0.000 description 1
- QYTSPNXTMDPFOI-UHFFFAOYSA-N 2-tert-butyl-4-[2-(4-hydroxy-3-methylphenyl)ethenyl]-6-methylphenol Chemical compound C1=C(O)C(C)=CC(C=CC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QYTSPNXTMDPFOI-UHFFFAOYSA-N 0.000 description 1
- ZRBLGHDBCWLKBG-UHFFFAOYSA-N 2-tert-butyl-4-[2-(4-hydroxy-3-methylphenyl)ethenyl]-6-pentylphenol Chemical compound CC(C)(C)C1=C(O)C(CCCCC)=CC(C=CC=2C=C(C)C(O)=CC=2)=C1 ZRBLGHDBCWLKBG-UHFFFAOYSA-N 0.000 description 1
- CQOMONZTZPLOFS-UHFFFAOYSA-N 2-tert-butyl-4-[2-(4-hydroxy-3-methylphenyl)ethenyl]-6-propylphenol Chemical compound CC(C)(C)C1=C(O)C(CCC)=CC(C=CC=2C=C(C)C(O)=CC=2)=C1 CQOMONZTZPLOFS-UHFFFAOYSA-N 0.000 description 1
- HEVCNGXJTCKWFX-UHFFFAOYSA-N 2-tert-butyl-6-hexyl-4-[2-(4-hydroxy-3-methylphenyl)ethenyl]phenol Chemical compound CC(C)(C)C1=C(O)C(CCCCCC)=CC(C=CC=2C=C(C)C(O)=CC=2)=C1 HEVCNGXJTCKWFX-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- CKOFBUUFHALZGK-UHFFFAOYSA-N 3-[(3-aminophenyl)methyl]aniline Chemical compound NC1=CC=CC(CC=2C=C(N)C=CC=2)=C1 CKOFBUUFHALZGK-UHFFFAOYSA-N 0.000 description 1
- LBPVOEHZEWAJKQ-UHFFFAOYSA-N 3-[4-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 LBPVOEHZEWAJKQ-UHFFFAOYSA-N 0.000 description 1
- 229940018563 3-aminophenol Drugs 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
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- QIRPHBPKRGXMJD-UHFFFAOYSA-N 4-[2-(3-tert-butyl-4-hydroxy-5-methylphenyl)ethenyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C=CC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QIRPHBPKRGXMJD-UHFFFAOYSA-N 0.000 description 1
- QTPDQPULQUGUEM-UHFFFAOYSA-N 4-[2-(3-tert-butyl-4-hydroxy-5-methylphenyl)ethenyl]-2-methyl-6-propylphenol Chemical compound CC1=C(O)C(CCC)=CC(C=CC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QTPDQPULQUGUEM-UHFFFAOYSA-N 0.000 description 1
- HKALGQXQBBJFEJ-UHFFFAOYSA-N 4-[2-(3-tert-butyl-4-hydroxyphenyl)ethenyl]-2-methylphenol Chemical compound C1=C(O)C(C)=CC(C=CC=2C=C(C(O)=CC=2)C(C)(C)C)=C1 HKALGQXQBBJFEJ-UHFFFAOYSA-N 0.000 description 1
- WFXYKWPPEAQBCY-UHFFFAOYSA-N 4-[2-(4-hydroxy-2,6-dimethylphenyl)ethenyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C=CC=2C(=CC(O)=CC=2C)C)=C1 WFXYKWPPEAQBCY-UHFFFAOYSA-N 0.000 description 1
- ZAMAJLCANKMHTA-UHFFFAOYSA-N 4-[2-(4-hydroxy-2-methylphenyl)ethenyl]-2-methylphenol Chemical compound C1=C(O)C(C)=CC(C=CC=2C(=CC(O)=CC=2)C)=C1 ZAMAJLCANKMHTA-UHFFFAOYSA-N 0.000 description 1
- YMPGSTUQJBNKJU-UHFFFAOYSA-N 4-[2-(4-hydroxy-3,5-dimethylphenyl)prop-1-enyl]-2,6-dimethylphenol Chemical compound C=1C(C)=C(O)C(C)=CC=1C(C)=CC1=CC(C)=C(O)C(C)=C1 YMPGSTUQJBNKJU-UHFFFAOYSA-N 0.000 description 1
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- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- CFJYNSNXFXLKNS-UHFFFAOYSA-N p-menthane Chemical compound CC(C)C1CCC(C)CC1 CFJYNSNXFXLKNS-UHFFFAOYSA-N 0.000 description 1
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- 239000012188 paraffin wax Substances 0.000 description 1
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- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- OVZXISBUYCEVEV-UHFFFAOYSA-N trans-alpha-methylstilbene Natural products C=1C=CC=CC=1C(C)=CC1=CC=CC=C1 OVZXISBUYCEVEV-UHFFFAOYSA-N 0.000 description 1
- XLAIWHIOIFKLEO-OWOJBTEDSA-N trans-stilbene-4,4'-diol Chemical compound C1=CC(O)=CC=C1\C=C\C1=CC=C(O)C=C1 XLAIWHIOIFKLEO-OWOJBTEDSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
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- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
- Glass Compositions (AREA)
- Liquid Crystal Substances (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP08156292A EP2119737B1 (en) | 2008-05-15 | 2008-05-15 | Electronic packaging |
| EP08156292.8 | 2008-05-15 | ||
| PCT/EP2009/054393 WO2009138301A1 (en) | 2008-05-15 | 2009-04-14 | Electronic packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011521033A true JP2011521033A (ja) | 2011-07-21 |
| JP2011521033A5 JP2011521033A5 (https=) | 2012-05-31 |
Family
ID=39738214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011508855A Pending JP2011521033A (ja) | 2008-05-15 | 2009-04-14 | 電子パッケージング |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20110163461A1 (https=) |
| EP (1) | EP2119737B1 (https=) |
| JP (1) | JP2011521033A (https=) |
| KR (1) | KR20110017853A (https=) |
| CN (1) | CN102027036A (https=) |
| AT (1) | ATE508154T1 (https=) |
| DE (1) | DE602008006681D1 (https=) |
| ES (1) | ES2364790T3 (https=) |
| PL (1) | PL2119737T3 (https=) |
| TW (1) | TW201004995A (https=) |
| WO (1) | WO2009138301A1 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103764713B (zh) * | 2011-08-31 | 2016-08-24 | 日立化成株式会社 | 树脂组合物、树脂片、带金属箔的树脂片、树脂固化物片、结构体、以及动力用或光源用半导体装置 |
| KR101321981B1 (ko) * | 2012-10-25 | 2013-10-28 | 한국전기연구원 | 용매제어형 실리카-에폭시 하이브리드 패키징 소재 제조방법 |
| KR101985255B1 (ko) * | 2012-11-30 | 2019-06-03 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판 |
| US9462689B2 (en) | 2012-11-30 | 2016-10-04 | Lg Innotek Co., Ltd. | Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition |
| KR101985256B1 (ko) * | 2012-11-30 | 2019-06-03 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판 |
| KR101984791B1 (ko) * | 2012-12-12 | 2019-09-03 | 엘지이노텍 주식회사 | 에폭시 수지 조성물, 이를 이용한 프리프레그 및 인쇄 회로 기판 |
| KR101973686B1 (ko) | 2012-12-12 | 2019-08-26 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 인쇄 회로 기판 |
| KR102012311B1 (ko) * | 2012-12-12 | 2019-08-20 | 엘지이노텍 주식회사 | 수지 조성물 및 이를 이용한 인쇄 회로 기판 |
| KR101973685B1 (ko) | 2012-12-12 | 2019-08-26 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 인쇄 회로 기판 |
| KR101952356B1 (ko) * | 2012-12-14 | 2019-02-26 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 인쇄 회로 기판 |
| KR102034228B1 (ko) | 2012-12-14 | 2019-10-18 | 엘지이노텍 주식회사 | 에폭시 수지 조성물, 이를 이용한 프리프레그 및 인쇄 회로 기판 |
| KR102022430B1 (ko) * | 2013-05-28 | 2019-09-18 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판 |
| KR20150097359A (ko) * | 2014-02-18 | 2015-08-26 | 주식회사 엘지화학 | 봉지 필름 및 이를 포함하는 유기전자장치 |
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2008
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- 2008-05-15 AT AT08156292T patent/ATE508154T1/de not_active IP Right Cessation
- 2008-05-15 DE DE602008006681T patent/DE602008006681D1/de active Active
- 2008-05-15 PL PL08156292T patent/PL2119737T3/pl unknown
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2009
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Also Published As
| Publication number | Publication date |
|---|---|
| EP2119737A1 (en) | 2009-11-18 |
| EP2119737B1 (en) | 2011-05-04 |
| ATE508154T1 (de) | 2011-05-15 |
| KR20110017853A (ko) | 2011-02-22 |
| US20110163461A1 (en) | 2011-07-07 |
| WO2009138301A1 (en) | 2009-11-19 |
| PL2119737T3 (pl) | 2011-09-30 |
| DE602008006681D1 (de) | 2011-06-16 |
| CN102027036A (zh) | 2011-04-20 |
| TW201004995A (en) | 2010-02-01 |
| ES2364790T3 (es) | 2011-09-14 |
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