KR20100112149A - 열 및 화학선 경화성 접착제 조성물 - Google Patents

열 및 화학선 경화성 접착제 조성물 Download PDF

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Publication number
KR20100112149A
KR20100112149A KR1020107016828A KR20107016828A KR20100112149A KR 20100112149 A KR20100112149 A KR 20100112149A KR 1020107016828 A KR1020107016828 A KR 1020107016828A KR 20107016828 A KR20107016828 A KR 20107016828A KR 20100112149 A KR20100112149 A KR 20100112149A
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KR
South Korea
Prior art keywords
adhesive composition
curable adhesive
thermal
actinic radiation
chain transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020107016828A
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English (en)
Korean (ko)
Inventor
윌리엄 칼 스무더스
로버트 폴 헬드
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
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Application filed by 이 아이 듀폰 디 네모아 앤드 캄파니 filed Critical 이 아이 듀폰 디 네모아 앤드 캄파니
Publication of KR20100112149A publication Critical patent/KR20100112149A/ko
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020107016828A 2007-12-28 2008-12-29 열 및 화학선 경화성 접착제 조성물 Withdrawn KR20100112149A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US941107P 2007-12-28 2007-12-28
US61/009,411 2007-12-28

Publications (1)

Publication Number Publication Date
KR20100112149A true KR20100112149A (ko) 2010-10-18

Family

ID=40433927

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107016828A Withdrawn KR20100112149A (ko) 2007-12-28 2008-12-29 열 및 화학선 경화성 접착제 조성물

Country Status (6)

Country Link
US (1) US20110021655A1 (https=)
JP (1) JP2011508814A (https=)
KR (1) KR20100112149A (https=)
CN (1) CN101939391A (https=)
TW (1) TW200940671A (https=)
WO (1) WO2009086492A1 (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8816021B2 (en) * 2010-09-10 2014-08-26 Designer Molecules, Inc. Curable composition with rubber-like properties
KR20120133890A (ko) * 2011-06-01 2012-12-11 동우 화인켐 주식회사 유리 접합용 접착제 조성물, 이를 이용한 유리 접합체 및 화상표시장치
CN102896869B (zh) * 2011-07-25 2016-03-02 汉高股份有限公司 利用紫外辐照固化-氧化还原固化粘合剂体系粘结基底的方法
CN102925062A (zh) * 2011-08-12 2013-02-13 汉高股份有限公司 光学透明的双固化粘合剂
CN103305178B (zh) * 2012-03-06 2014-11-26 上海佑威新材料科技有限公司 低模量光学胶粘剂组合物
JP6231980B2 (ja) * 2012-03-22 2017-11-15 株式会社クラレ 高分子化合物並びにその製造方法および成形品
WO2013173976A1 (en) 2012-05-22 2013-11-28 Henkel (China) Company Limited Liquid optically clear photo-curable adhesive
WO2013181030A1 (en) 2012-05-29 2013-12-05 3M Innovative Properties Company Liquid optical adhesive compositions
TWI454548B (zh) * 2012-08-01 2014-10-01 Eternal Materials Co Ltd 雙固化黏著組合物
JP6113451B2 (ja) 2012-10-02 2017-04-12 株式会社オートネットワーク技術研究所 （メタ）アクリレート組成物
KR20150095746A (ko) 2012-12-10 2015-08-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 액체 광학 접착제 조성물
CN105916899B (zh) 2013-11-21 2019-01-18 3M创新有限公司 液体光学粘合剂组合物
US10035334B2 (en) 2013-11-21 2018-07-31 3M Innovative Properties Company Liquid optical adhesive compositions
US20170029677A1 (en) * 2014-04-07 2017-02-02 Bridgestone Corporation Composition, manufacturing method of adhesive sheet, adhesive sheet, manufacturing method of layered body, and layered body
ES2835550T3 (es) 2014-07-17 2021-06-22 Henkel Ag & Co Kgaa Composición adhesiva liquida ópticamente clara fotocurable y uso de la misma
JP6420480B2 (ja) 2014-11-18 2018-11-07 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 光硬化性接着剤組成物、その調製およびその使用
JP6649964B2 (ja) 2015-05-26 2020-02-19 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 光硬化性接着剤組成物、その調製およびその使用
TWI668285B (zh) * 2015-12-31 2019-08-11 長興材料工業股份有限公司 可熱聚合之組合物、由此形成之組成液及其用途
JP6703848B2 (ja) * 2016-02-12 2020-06-03 株式会社ディスコ 樹脂組成物および板状物の固定方法
JP6502295B2 (ja) 2016-08-10 2019-04-17 株式会社有沢製作所 Ｕｖ硬化型樹脂組成物
CN106243297B (zh) * 2016-08-26 2019-10-18 长兴材料工业股份有限公司 可热聚合的组成物以及由此形成的组成液
CN107312492B (zh) * 2017-06-30 2020-12-01 张家港康得新光电材料有限公司 一种双固化粘合剂及胶带
CN111479693B (zh) 2017-12-13 2023-06-16 3M创新有限公司 含有三烷基硼烷络合物引发剂和光酸的光学透明粘合剂
JP7064857B2 (ja) * 2017-12-14 2022-05-11 三星エスディアイ株式会社 粘着剤組成物、その溶液、粘着剤層および表面保護フィルム
EP3776081A4 (en) * 2018-03-28 2022-03-09 Benjamin Lund THIOL ACRYLATE POLYMERS, METHOD OF SYNTHESIS THEREOF AND USE IN ADDITIONAL MANUFACTURING TECHNOLOGIES
KR102210259B1 (ko) * 2018-07-11 2021-02-01 삼성에스디아이 주식회사 점착 필름, 이를 위한 점착제 조성물 및 이를 포함하는 디스플레이 부재
TWI739136B (zh) * 2018-07-27 2021-09-11 南韓商Ｌｇ化學股份有限公司 紅外線反射膜
CN109370505A (zh) * 2018-09-21 2019-02-22 苏州吉格邦新材料科技有限公司 一种uv-化学双固化双组份胶水及其制备方法
JP7387400B2 (ja) * 2019-11-15 2023-11-28 ヘンケルジャパン株式会社 Ｕｖ熱硬化型接着剤組成物
KR102278154B1 (ko) * 2019-12-03 2021-07-16 주식회사 한솔케미칼 이중 경화형 접착제 조성물

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2606569A1 (de) * 1976-02-19 1977-08-25 Degussa Verfahren zur herstellung von beschussfesten verbund(glas)scheiben
JPS595226B2 (ja) * 1979-03-22 1984-02-03 松下電器産業株式会社 部品の取付方法
US4410621A (en) * 1981-04-03 1983-10-18 Toyo Boseki Kabushiki Kaisha Photosensitive resin containing a combination of diphenyl-imiazolyl dimer and a heterocyclic mercaptan
JPS5956403A (ja) * 1982-09-27 1984-03-31 Mitsubishi Chem Ind Ltd 光重合性組成物
JPS63260971A (ja) * 1987-04-20 1988-10-27 Hitachi Chem Co Ltd 放射線硬化型粘着剤組成物
JPH01156387A (ja) * 1987-12-14 1989-06-19 Cemedine Co Ltd 耐水性を有する光硬化型接着剤組成物
JPH0778202B2 (ja) * 1988-10-18 1995-08-23 積水化学工業株式会社 アクリル系粘着テープもしくはシートの製造方法
DE59209143D1 (de) * 1991-03-27 1998-02-26 Ciba Geigy Ag Photoempfindliches Gemisch auf Basis von Acrylaten
US5426166A (en) * 1994-01-26 1995-06-20 Caschem, Inc. Urethane adhesive compositions
US5747551A (en) * 1994-12-05 1998-05-05 Acheson Industries, Inc. UV curable pressure sensitive adhesive composition
JP3797628B2 (ja) * 1995-11-08 2006-07-19 日東電工株式会社 感圧接着剤及びその接着シート
JP3177149B2 (ja) * 1996-03-15 2001-06-18 リンテック株式会社 粘着テープ用基材、該基材を用いた粘着テープ、および該基材の製造方法
BR9708589A (pt) * 1996-04-05 1999-08-03 Minnesota Mining & Mfg Composição polimerizável por luz visível e processos para revestir um substrato com um revestimento protetor e para reparar um defeito em um substrato revestido
JPH09291258A (ja) * 1996-04-26 1997-11-11 Lintec Corp 粘着剤組成物およびこれを用いた粘着シート
US5962190A (en) * 1997-08-27 1999-10-05 E. I. Du Pont De Nemours And Company Photopolymerizable compositions having improved sidewall geometry and development latitude
JP3384324B2 (ja) * 1998-05-11 2003-03-10 株式会社スリーボンド ハードディスクドライブの磁気ヘッドの製造用接着剤組成物
JP3484985B2 (ja) * 1998-08-17 2004-01-06 東亞合成株式会社 光硬化型接着剤組成物
JP2000345111A (ja) * 1999-06-07 2000-12-12 Three M Innovative Properties Co 接着剤組成物及びそれを用いた光ディスク
US6617371B2 (en) * 2001-06-08 2003-09-09 Addison Clear Wave, Llc Single component room temperature stable heat-curable acrylate resin adhesive
US20060154169A1 (en) * 2003-06-11 2006-07-13 Hans-Joachim Timpe Radiation-sensitive compositions comprising a 1,4-dihydropyridine sensitizer and imageable elements based thereon
JP2005058288A (ja) * 2003-08-19 2005-03-10 Three M Innovative Properties Co 医療用粘着テープのための粘着剤組成物及び粘着テープ
WO2005049756A1 (en) * 2003-11-24 2005-06-02 Samsung Electronics Co., Ltd Uv-hardenable adhesive composition, optical reading head using said composition and optical recording/reproducing device comprising said reading head
JP4433181B2 (ja) * 2004-09-22 2010-03-17 株式会社スリーボンド 放射線硬化型マイクロカプセル含有組成物及びそれを用いたマイクロカプセル含有被覆層の形成方法。
WO2006117156A1 (en) * 2005-05-02 2006-11-09 Cytec Surface Specialties, S.A. Radiation curable urethane (meth)acrylate polymer and adhesives formulated with them
US7348132B2 (en) * 2006-01-21 2008-03-25 Gary Ganghui Teng Laser sensitive lithographic printing plate having specific photopolymer composition

Also Published As

Publication number Publication date
JP2011508814A (ja) 2011-03-17
TW200940671A (en) 2009-10-01
WO2009086492A1 (en) 2009-07-09
CN101939391A (zh) 2011-01-05
US20110021655A1 (en) 2011-01-27

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Date Code Title Description
PA0105 International application

Patent event date: 20100727

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid