KR20100112148A - 화학선 경화성 접착제 조성물 - Google Patents

화학선 경화성 접착제 조성물 Download PDF

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Publication number
KR20100112148A
KR20100112148A KR1020107016826A KR20107016826A KR20100112148A KR 20100112148 A KR20100112148 A KR 20100112148A KR 1020107016826 A KR1020107016826 A KR 1020107016826A KR 20107016826 A KR20107016826 A KR 20107016826A KR 20100112148 A KR20100112148 A KR 20100112148A
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KR
South Korea
Prior art keywords
adhesive composition
curable adhesive
actinic
chain transfer
transfer agent
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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KR1020107016826A
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English (en)
Korean (ko)
Inventor
로버트 폴 헬드
하싼 모하메드 파라
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
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Application filed by 이 아이 듀폰 디 네모아 앤드 캄파니 filed Critical 이 아이 듀폰 디 네모아 앤드 캄파니
Publication of KR20100112148A publication Critical patent/KR20100112148A/ko
Withdrawn legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020107016826A 2007-12-28 2008-12-29 화학선 경화성 접착제 조성물 Withdrawn KR20100112148A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US940607P 2007-12-28 2007-12-28
US61/009,406 2007-12-28

Publications (1)

Publication Number Publication Date
KR20100112148A true KR20100112148A (ko) 2010-10-18

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107016826A Withdrawn KR20100112148A (ko) 2007-12-28 2008-12-29 화학선 경화성 접착제 조성물

Country Status (6)

Country Link
US (1) US20110201717A1 (enExample)
JP (1) JP5735279B2 (enExample)
KR (1) KR20100112148A (enExample)
CN (1) CN101970590A (enExample)
TW (1) TW200942562A (enExample)
WO (1) WO2009086491A1 (enExample)

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KR20130129841A (ko) * 2012-05-21 2013-11-29 주식회사 동진쎄미켐 광경화형 광투명 점,접착제 조성물 및 이를 포함하는 점,접착 시트
KR101390693B1 (ko) * 2010-12-31 2014-04-30 이터널 케미칼 컴퍼니 리미티드 광경화성 접착제 조성물
KR20150035542A (ko) * 2012-05-22 2015-04-06 헨켈 유에스 아이피 엘엘씨 액체 광학 투명성 광-경화성 접착제에 의한 기판 결합 방법

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KR101362869B1 (ko) * 2010-12-29 2014-02-14 제일모직주식회사 광학 점착제 조성물
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CN102898956A (zh) * 2011-07-25 2013-01-30 汉高股份有限公司 光固化的粘合剂组合物及其用途
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JPWO2013084503A1 (ja) * 2011-12-08 2015-04-27 日本化薬株式会社 光学部材、紫外線硬化型樹脂組成物及び硬化物
KR20140145933A (ko) * 2012-01-25 2014-12-24 데쿠세리아루즈 가부시키가이샤 화상 표시 장치의 제조 방법
WO2013176436A1 (ko) * 2012-05-21 2013-11-28 주식회사 동진쎄미켐 광경화형 광투명 점,접착제 조성물 및 이를 포함하는 점,접착 시트
ES2871913T3 (es) 2012-05-22 2021-11-02 Henkel IP & Holding GmbH Adhesivo líquido fotocurable ópticamente transparente
KR101642635B1 (ko) 2012-05-29 2016-07-25 쓰리엠 이노베이티브 프로퍼티즈 컴파니 액체 광학 접착제 조성물
CN102703020B (zh) * 2012-06-12 2013-10-23 烟台德邦科技有限公司 一种具有耐冲击性能的液态光学透明胶及其制备方法
WO2014028024A1 (en) * 2012-08-16 2014-02-20 E. I. Du Pont De Nemours And Company Actinically curable adhesive composition and bonding method using same
WO2014029062A1 (en) * 2012-08-20 2014-02-27 Henkel (China) Company Limited Liquid optically clear photo-curable adhesive for display application
CN104837938A (zh) 2012-12-10 2015-08-12 3M创新有限公司 液体光学粘合剂组合物
WO2014093141A1 (en) * 2012-12-14 2014-06-19 3M Innovative Properties Company Method of making packaged viscoelastic compositions by polymerizing ethylenically-unsaturated materials using ionizing radiation
CN103484051A (zh) * 2013-09-29 2014-01-01 苏州华周胶带有限公司 一种热封胶带黏合剂
CN105764930B (zh) * 2013-11-27 2018-11-16 电化株式会社 组合物
WO2015079728A1 (ja) * 2013-11-29 2015-06-04 Dic株式会社 光硬化性光学接着剤組成物、その硬化物、及び液晶表示装置
WO2016077984A1 (en) * 2014-11-18 2016-05-26 Henkel (China) Company Limited Photo-curable adhesive composition, preparation and use thereof
KR102257987B1 (ko) 2014-12-16 2021-05-31 삼성디스플레이 주식회사 광학용 투명 점착 조성물 및 이를 포함하는 표시장치
JP6797112B2 (ja) * 2015-05-26 2020-12-09 デンカ株式会社 組成物
JP6649964B2 (ja) * 2015-05-26 2020-02-19 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co. KGaA 光硬化性接着剤組成物、その調製およびその使用
US10712483B2 (en) * 2015-08-24 2020-07-14 Samsung Electronics Co., Ltd. Photosensitive compositions, quantum dot polymer composite pattern prepared therefrom, and electronic devices including the same
KR102527764B1 (ko) 2015-12-17 2023-05-02 삼성전자주식회사 감광성 조성물, 이를 제조하기 위한 방법, 및 이로부터 제조된 양자점-폴리머 복합체 패턴
KR102359125B1 (ko) 2016-03-15 2022-02-08 더 보드 오브 리젠츠 오브 더 유니버시티 오브 텍사스 시스템 티오우레탄 중합체, 이의 제조 방법, 및 적층 제조 기술에서의 용도
KR20210030895A (ko) * 2018-03-28 2021-03-18 벤자민 룬드 티올-아크릴레이트 중합체, 이의 합성 방법 및 적층식 제조 기술에서의 용도
US11739177B2 (en) 2018-04-20 2023-08-29 Adaptive 3D Technologies Sealed isocyanates
EP3781375A4 (en) 2018-04-20 2021-09-29 Benjamin Lund BLOCKED ISOCYANATES
US11911956B2 (en) 2018-11-21 2024-02-27 Adaptive 3D Technologies Using occluding fluids to augment additive manufacturing processes
US12054654B2 (en) 2019-05-15 2024-08-06 Hewlett-Packard Development Company, L.P. Re-workable adhesives for electronic devices
AU2020314047A1 (en) * 2019-07-12 2022-02-17 Mondofix Inc. Thiol-based adhesive formulations for repairing windshields
JP7513029B2 (ja) * 2019-07-29 2024-07-09 株式会社レゾナック 粘着シート
CN115353849A (zh) * 2022-08-05 2022-11-18 Tcl华星光电技术有限公司 一种封装材料、显示面板及其封装方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101390693B1 (ko) * 2010-12-31 2014-04-30 이터널 케미칼 컴퍼니 리미티드 광경화성 접착제 조성물
KR20130129841A (ko) * 2012-05-21 2013-11-29 주식회사 동진쎄미켐 광경화형 광투명 점,접착제 조성물 및 이를 포함하는 점,접착 시트
KR20150035542A (ko) * 2012-05-22 2015-04-06 헨켈 유에스 아이피 엘엘씨 액체 광학 투명성 광-경화성 접착제에 의한 기판 결합 방법

Also Published As

Publication number Publication date
CN101970590A (zh) 2011-02-09
JP2011511851A (ja) 2011-04-14
WO2009086491A1 (en) 2009-07-09
US20110201717A1 (en) 2011-08-18
TW200942562A (en) 2009-10-16
JP5735279B2 (ja) 2015-06-17

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PA0105 International application

Patent event date: 20100727

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid