CN115353849A - 一种封装材料、显示面板及其封装方法 - Google Patents
一种封装材料、显示面板及其封装方法 Download PDFInfo
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- CN115353849A CN115353849A CN202210938827.1A CN202210938827A CN115353849A CN 115353849 A CN115353849 A CN 115353849A CN 202210938827 A CN202210938827 A CN 202210938827A CN 115353849 A CN115353849 A CN 115353849A
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- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical compound [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 description 2
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Abstract
本申请实施例公开了一种封装材料、显示面板及其封装方法,所述封装材料按质量百分比包括:主体树脂,20%‑50%;稀释单体,20%‑50%;稳定剂,0.01%‑2%;微凝胶,1%‑10%;链连转移剂,0.01%‑5%;以及引发剂,余量。封装材料可以在UV光的作用下固化形成一封装层,该封装层的抗老化性能得以提高,同时韧性增强,减少翘曲。该封装层为具有高官能度、微凝胶结构的UV层。其中,采用微凝胶结构,以增强封装层的韧性,使其具有极好的抗腐蚀性;采用酯活化乙烯基磺酸盐作为链转移剂,使得聚合物网络中平均链长较短,降低固化过程中出现收缩裂缝的危险性,增强固化后封装层的韧性。
Description
技术领域
本申请涉及显示技术领域,具体涉及一种封装材料、显示面板及其封装方法。
背景技术
随着科学技术的发展,生活水平的提高,人们追求于高分辨率、轻薄、高色域、高亮度的显示装置。在此背景下,柔性、自发光等技术逐渐取代传统的刚性液晶显示(LiquidCrystal Display,LCD)技术。现有自发光技术主要分为无机半导体自发光(micro/miniLED)和有机半导体自发光(Organic Light Emitting Diode,OLED)技术两类,其中micro/mini LED技术因结构简单,稳定性和发光效率高而成为了研究热点。然而,micro/mini LED要实现精细化、大型化和低成本化显示,需与LCD和OLED一样在玻璃或塑料等可大尺寸化批量生产的基板上进行TFT驱动显示,基于此,TFT+micro/mini LED将是量产化的重要方向。
目前所采用的薄膜晶体管(Thin Film Transistor,TFT)基板驱动Mini LED的技术方案,由于不需要将MOS管与LED灯封装在一起,器件的尺寸也可以缩小,在实现更小的像素间距方面也有优势。因此,采用TFT基板驱动Mini LED的拼接屏技术具有更大的优点。其中,TFT技术一般包括氢化非晶硅TFT技术(a-Si:HTFT)、非晶氧化物(amorphous oxide)TFT技术以及低温多晶体TFT技术。氢化非晶硅TFT技术,由于载流子迁移率较低,难以满足MiniLED驱动的要求。与非晶氧化物TFT技术相比,低温多晶硅TFT技术的制作工艺复杂且世代线较低,成本较高。
因此,采用非晶氧化物TFT驱动Mini LED的拼接屏已成为主流。但是,由于MiniLED显示面板仅在LED灯固晶后涂布封胶,而封胶对水氧的阻隔能力较差,无法满足非晶氧化物TFT的封装需求,从而导致非晶氧化物材料容易吸附环境中水氧,进而导致器件的封装失效,影响器件的性能。
发明内容
为实现上述目的,本发明提供一种封装材料、显示面板及其封装方法,以解决现有显示面板的封装效果较差,难以满足氧化物TFT的封装需求的技术问题。
为实现上述目的,本发明提供一种封装材料,按质量百分比包括:主体树脂,20%-50%;稀释单体,20%-50%;稳定剂,0.01%-2%;微凝胶,1%-10%;链连转移剂,0.01%-5%;以及引发剂,余量。
进一步地,所述主体树脂包括环氧丙烯酸酯、聚氨酯丙烯酸酯、纯丙烯酸酯、聚酯类丙烯酸酯中的至少一种。
进一步地,所述稀释单体包括单官能度单体、双官能度单体、多官能度单体中的至少一种;其中,所述单官能度单体、所述双官能度单体以及所述多官能度单体的官能度大于或等于3;所述单官能度单体包括苯乙烯、甲基丙烯酸甲酯;所述双官能度单体包括1,6-己二酯丙烯酸酯;所述多官能度单体包括三羟甲基三丙烯酸酯、季戊四醇四丙烯酸酯。
进一步地,所述稳定剂包括有机锡稳定剂、钙锌稳定剂、有机螯合物、UV稳定剂中的至少一种。
进一步地,所述微凝胶包括苯乙烯-二乙二醇二丙烯酸酯、苯乙烯-三羟甲基丙烷三丙烯酸酯中的至少一种。
进一步地,所述链连转移剂包括酯活化乙烯基磺酸盐。
进一步地,所述引发剂包括夺氢型自由基光引发剂、大分子光引发剂中的至少一种。
为实现上述目的,本发明还提供一种显示面板,包括:基板;薄膜晶体管层,其设置于所述基板的一侧表面;发光层,其设置于所述薄膜晶体管层的远离所述基板的一侧表面,所述发光层包括至少两个间隔设置的发光单元;以及第一封装层,其设置于所述发光层上,且填充于两个相邻设置的发光单元之间的间隙;所述第一封装层由前文所述的封装材料制成。
进一步地,所述的显示面板还包括:第二封装层,其设置于所述第一封装层的远离所述基板的一侧表面;其中,所述第二封装层包括:粘合层,其设置于所述第一封装层的远离所述基板的一侧表面;第一阻隔层,其设置于所述粘合层的远离所述基板的一侧表面;以及第二阻隔层,其设置于所述第一阻隔层的远离所述基板的一侧表面。
进一步地,所述粘合层所采用的材质为压敏胶;所述第一阻隔层所采用的材质为聚对苯二甲酸乙二醇酯或者聚酰亚胺;所述第二阻隔层所采用的材质为环氧树脂、聚氨酯、聚酯、丙烯酸中的至少一种。
为实现上述目的,本发明还提供一种显示面板的封装方法,包括如下步骤:制备一显示面板,所述显示面板包括基板、薄膜晶体管层以及发光层,所述薄膜晶体管形成于所述基板上;所述发光层形成于所述薄膜晶体管层上,且所述发光层包括至少两个间隔设置的发光单元;形成第一封装层于所述发光层上,且填充于两个相邻设置的发光单元之间的间隙;所述第一封装层由以下质量百分比组分组成:主体树脂,20%-50%;稀释单体,20%-50%;稳定剂,0.01%-2%;微凝胶,1%-10%;链连转移剂,0.01%-5%;以及引发剂,余量。
上述技术方案中的任一个,具有如下优点或有益效果:提供一种封装材料、显示面板及其封装方法,封装材料可以在UV光的作用下固化形成一封装层,该封装层的抗老化性能得以提高,同时韧性增强,减少翘曲。该封装层为具有高官能度、微凝胶结构的UV层。其中,采用微凝胶结构,以增强封装层的韧性,使其具有极好的抗腐蚀性;采用酯活化乙烯基磺酸盐作为链转移剂,使得聚合物网络中平均链长较短,降低固化过程中出现收缩裂缝的危险性,增强固化后封装层的韧性。
进一步地,显示面板采用双层封装层,其通过粘合层可以将所述第一封装层与所述第二封装层牢牢地贴合在一起,因此,当显示面板受到水氧的入侵时,设置在发光层最外围的第二封装层因具有双层阻隔层,可以有效的阻隔水氧入侵,设置在发光层与第二封装层之间的第一封装层因具有较高的抗老化性能,韧性较强,并且翘曲度较小,从而可以进一步地减少环境中水氧对显示面板的影响,提高水氧隔绝能力,满足氧化物TFT的封装需求,进而可以提高显示面板稳定性及抗老化性能。
附图说明
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的显示面板的结构示意图。
图2为本申请实施例提供的显示面板的封装方法的流程图。
图3为本申请实施例提供的第二封装层形成步骤的流程图。
附图标记说明:
100、显示面板; 1、基板;
2、薄膜晶体管层; 3、发光层;
31、发光单元; 4、第一封装层;
5、第二封装层; 51、粘合层;
52、第一阻隔层; 53、第二阻隔层。
具体实施方式
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。
在本申请中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。
本实施例提供一种封装材料,按质量百分比包括:主体树脂,20%-50%;稀释单体,20%-50%;稳定剂,0.01%-2%;微凝胶,1%-10%;链连转移剂,0.01%-5%;以及引发剂,余量。其中,在采用该封装材料形成封装层的过程中,可以根据用户的实际需要合理地选择上述各组分的质量份。
具体的,所述主体树脂包括环氧丙烯酸酯、聚氨酯丙烯酸酯、纯丙烯酸酯、聚酯类丙烯酸酯中的至少一种,具有良好的粘结性、韧性、耐腐蚀性。
所述稀释单体包括单官能度单体、双官能度单体、多官能度单体中的至少一种,这些单体在体系中主要起到稀释的作用。其中,所述单官能度单体、所述双官能度单体以及所述多官能度单体的官能度大于或等于3。所述单官能度单体包括苯乙烯、甲基丙烯酸甲酯;所述双官能度单体包括1,6-己二酯丙烯酸酯;所述多官能度单体包括三羟甲基三丙烯酸酯、季戊四醇四丙烯酸酯。
所述稳定剂包括有机锡稳定剂、钙锌稳定剂、有机螯合物(如二茂铁)、UV稳定剂(如UV-P、UV-O等)中的至少一种。所述稳定剂具有耐高温及耐紫外线辐射(Ultra Violet,UV)老化的效果。
所述微凝胶包括苯乙烯-二乙二醇二丙烯酸酯、苯乙烯-三羟甲基丙烷三丙烯酸酯中的至少一种。所述微凝胶可以使得封装材料具有微凝胶结构,使得形成的聚合物(即封装材料)韧性增强,并且该封装层具有极好的抗腐蚀性。
所述链连转移剂包括酯活化乙烯基磺酸盐,其分子结构式为:
本实施例中,采用酯活化乙烯基磺酸盐作为所述链转移剂,可以使得聚合物(即封装材料)网络中平均链长较短,封装材料在固化形成封装层的过程中,降低收缩裂缝的危险性,增强韧性,避免发生翘曲的现象。
所述引发剂为采用裂解型自由基光引发剂,其包括夺氢型自由基光引发剂、大分子光引发剂中的至少一种。若按照所述引发剂的分类,所述引发剂的类别可以为754,184,1173等。
本实施例所提供的封装材料,该封装材料可以在UV光的作用下固化形成一封装层,该封装层的抗老化性能得以提高,同时韧性增强,减少翘曲。该封装层为具有高官能度、微凝胶结构的UV层。其中,采用微凝胶结构,以增强封装层的韧性,使其具有极好的抗腐蚀性;采用酯活化乙烯基磺酸盐作为链转移剂,使得聚合物网络中平均链长较短,降低固化过程中出现收缩裂缝的危险性,增强固化后封装层的韧性。
如图1所示,本实施例还提供一种显示面板100,其包括基板1、薄膜晶体管层2、发光层3、第一封装层4以及第二封装层5。
基板1可以为柔性基板或者刚性基板,在此不做特别的限定。
薄膜晶体管层2设置于所述基板1的上表面。所述薄膜晶体管层2包括多个薄膜晶体管TFT(图未示),每一薄膜晶体管包括有源层、栅极、源极、漏极等部件,其中有源层所采用的材质为非晶氧化物,如IGZO(氧化铟镓锌),载流子迁移率是非晶硅的20~30倍,可以大大提高TFT对像素电极的充放电速率,提高像素的响应速度,实现更快的刷新率,同时更快的响应也大大提高了像素的行扫描速率,使得超高分辨率在TFT-LCD中成为可能。另外,由于晶体管数量减少和提高了每个像素的透光率,IGZO显示面板具有更高的能效水平,而且效率更高。
发光层3设置于所述薄膜晶体管层2的上表面,所述发光层3包括至少两个间隔设置的发光单元31。本实施例中,多个发光单元31阵列排布于所述薄膜晶体管层2上。所述发光单元31可以为Mini LED芯片或者micro LED芯片。
第一封装层4设置于所述发光层3上,且填充于两个相邻设置的发光单元31之间的间隙。所述第一封装层4由前文所述的封装材料制成。在形成第一封装层4的过程中,将封装材料涂布于所述发光单元31上,且填满两个相邻设置的发光单元31之间的间隙,然后在UV光的作用下使得封装材料固化形成所述第一封装层4。其中,所述第一封装层4为具有高官能度、微凝胶结构的UV层。所述第一封装层4采用微凝胶结构,以增强封装层的韧性,使其具有极好的抗腐蚀性;采用酯活化乙烯基磺酸盐作为链转移剂,使得聚合物网络中平均链长较短,降低固化过程中出现收缩裂缝的危险性,增强固化后封装层的韧性,从而可以防止水氧入侵至所述发光层3,避免出现封装失效的问题,以提高显示面板100的封装良率。
第二封装层5设置于所述第一封装层4的上表面。所述第二封装层5包括粘合层51、第一阻隔层52以及第二阻隔层53。
具体的,粘合层51设置于所述第一封装层4的上表面。所述粘合层51所采用的材质为压敏胶,起到粘接的作用。
第一阻隔层52设置于所述粘合层51的上表面。所述第一阻隔层52所采用的材质为聚对苯二甲酸乙二醇酯或者聚酰亚胺,可以起到阻隔水氧的效果。
第二阻隔层53设置于所述第一阻隔层52,且远离所述基板1的一侧表面。所述第二阻隔层53所采用的材质为环氧树脂(如SiO2改性的环氧树脂)、聚氨酯、聚酯、丙烯酸中的至少一种,可以进一步起到阻隔水氧的效果。
本实施例所提供的显示面板100,采用双层封装层,其通过粘合层51可以将所述第一封装层4与所述第二封装层5牢牢地贴合在一起,因此,当显示面板100受到水氧的入侵时,设置在发光层3最外围的第二封装层5因具有双层阻隔层,可以有效的阻隔水氧入侵,设置在发光层3与第二封装层5之间的第一封装层4因具有较高的抗老化性能,韧性较强,并且翘曲度较小,从而可以进一步地减少环境中水氧对显示面板100的影响,提高水氧隔绝能力,可以满足氧化物TFT的封装需求,进而可以提高显示面板100稳定性及抗老化性能。
如图2所示,本实施例还提供一种显示面板的封装方法,包括如下步骤S1)-S3)。
S1)制备一显示面板,所述显示面板包括基板1、薄膜晶体管层2以及发光层3,所述薄膜晶体管2形成于所述基板1上;所述发光层3形成于所述薄膜晶体管层2上,且所述发光层包括至少两个间隔设置的发光单元,参照图1。
S2)形成第一封装层4于所述发光层3上,参照图1,且填充于两个相邻设置的发光单元31之间的间隙;所述第一封装层4由以下质量百分比组分组成:主体树脂,20%-50%;稀释单体,20%-50%;稳定剂,0.01%-2%;微凝胶,1%-10%;链连转移剂,0.01%-5%;以及引发剂,余量。
所述主体树脂包括环氧丙烯酸酯、聚氨酯丙烯酸酯、纯丙烯酸酯、聚酯类丙烯酸酯中的至少一种,具有良好的粘结性、韧性、耐腐蚀性。
所述稀释单体包括单官能度单体、双官能度单体、多官能度单体中的至少一种,这些单体在体系中主要起到稀释的作用。其中,所述单官能度单体、所述双官能度单体以及所述多官能度单体的官能度大于或等于3。所述单官能度单体包括苯乙烯、甲基丙烯酸甲酯;所述双官能度单体包括1,6-己二酯丙烯酸酯;所述多官能度单体包括三羟甲基三丙烯酸酯、季戊四醇四丙烯酸酯。
所述稳定剂包括有机锡稳定剂、钙锌稳定剂、有机螯合物(如二茂铁)、UV稳定剂(如UV-P、UV-O等)中的至少一种。所述稳定剂具有耐高温及耐紫外线辐射(Ultra Violet,UV)老化的效果。
所述微凝胶包括苯乙烯-二乙二醇二丙烯酸酯、苯乙烯-三羟甲基丙烷三丙烯酸酯中的至少一种。所述微凝胶可以使得封装材料具有微凝胶结构,使得形成的聚合物(即封装材料)韧性增强,并且该封装层具有极好的抗腐蚀性。
所述链连转移剂包括酯活化乙烯基磺酸盐,其分子结构式为:
本实施例中,采用酯活化乙烯基磺酸盐作为所述链转移剂,可以使得聚合物(即封装材料)网络中平均链长较短,封装材料在固化形成封装层的过程中,降低收缩裂缝的危险性,增强韧性,避免发生翘曲的现象。
所述引发剂为采用裂解型自由基光引发剂,其包括夺氢型自由基光引发剂、大分子光引发剂中的至少一种。若按照所述引发剂的分类,所述引发剂的类别可以为754,184,1173等。
S3)形成第二封装层5于所述第一封装层4上,参照图1。
如图3所示,所述第二封装层的形成步骤包括S31)-S33)。
S31)形成粘合层51于所述第一封装层4上,参照图1,所述粘合层51所采用的材质为压敏胶,起到粘接的作用。
S32)形成第一阻隔层52于所述粘合层51上,参照图1,所述第一阻隔层52所采用的材质为聚对苯二甲酸乙二醇酯或者聚酰亚胺,可以起到阻隔水氧的效果。
S33)形成第二阻隔层53于所述第一阻隔层52上,参照图1,述第二阻隔层53所采用的材质为环氧树脂(如SiO2改性的环氧树脂)、聚氨酯、聚酯、丙烯酸中的至少一种,可以进一步起到阻隔水氧的效果。
本实施例所提供的显示面板的封装方法,采用双层封装层,其通过粘合层可以将所述第一封装层与所述第二封装层牢牢地贴合在一起,因此,当显示面板受到水氧的入侵时,设置在发光层最外围的第二封装层因具有双层阻隔层,可以有效的阻隔水氧入侵,设置在发光层与第二封装层之间的第一封装层因具有较高的抗老化性能,韧性较强,并且翘曲度较小,从而可以进一步地减少环境中水氧对显示面板的影响,提高水氧隔绝能力,可以满足氧化物TFT的封装需求,进而可以提高显示面板稳定性及抗老化性能。
进一步地,本实施例还提供一种拼接屏,其由多个前文所述的显示面板拼接成一个大尺寸的显示屏,即拼接屏,该拼接屏因具有双层封装层,可以有效地减少环境中的水氧对发光层(micro/mini LED芯片)的影响,从而提高拼接屏的稳定性以及可以避免拼接屏老化。
以上对本申请实施例所提供的一种封装材料、显示面板及其封装方法进行了详细介绍,本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请的方法及其核心思想;同时,对于本领域的技术人员,依据本申请的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本申请的限制。
Claims (11)
1.一种封装材料,其特征在于,按质量百分比包括:
主体树脂,20%-50%;
稀释单体,20%-50%;
稳定剂,0.01%-2%;
微凝胶,1%-10%;
链连转移剂,0.01%-5%;以及
引发剂,余量。
2.根据权利要求1所述的封装材料,其特征在于,
所述主体树脂包括环氧丙烯酸酯、聚氨酯丙烯酸酯、纯丙烯酸酯、聚酯类丙烯酸酯中的至少一种。
3.根据权利要求1所述的封装材料,其特征在于,
所述稀释单体包括单官能度单体、双官能度单体、多官能度单体中的至少一种;
其中,所述单官能度单体、所述双官能度单体以及所述多官能度单体的官能度大于或等于3;
所述单官能度单体包括苯乙烯、甲基丙烯酸甲酯;
所述双官能度单体包括1,6-己二酯丙烯酸酯;
所述多官能度单体包括三羟甲基三丙烯酸酯、季戊四醇四丙烯酸酯。
4.根据权利要求1所述的封装材料,其特征在于,
所述稳定剂包括有机锡稳定剂、钙锌稳定剂、有机螯合物、UV稳定剂中的至少一种。
5.根据权利要求1所述的封装材料,其特征在于,
所述微凝胶包括苯乙烯-二乙二醇二丙烯酸酯、苯乙烯-三羟甲基丙烷三丙烯酸酯中的至少一种。
6.根据权利要求1所述的封装材料,其特征在于,
所述链连转移剂包括酯活化乙烯基磺酸盐。
7.根据权利要求1所述的封装材料,其特征在于,
所述引发剂包括夺氢型自由基光引发剂、大分子光引发剂中的至少一种。
8.一种显示面板,其特征在于,包括:
基板;
薄膜晶体管层,其设置于所述基板的一侧表面;
发光层,其设置于所述薄膜晶体管层的远离所述基板的一侧表面,所述发光层包括至少两个间隔设置的发光单元;以及
第一封装层,其设置于所述发光层上,且填充于两个相邻设置的发光单元之间的间隙;所述第一封装层由如权利要求1-7中任意一项所述的封装材料制成。
9.根据权利要求8所述的显示面板,其特征在于,还包括:
第二封装层,其设置于所述第一封装层,且远离所述基板的一侧表面;
其中,所述第二封装层包括:
粘合层,其设置于所述第一封装层的远离所述基板的一侧表面;
第一阻隔层,其设置于所述粘合层的远离所述基板的一侧表面;以及
第二阻隔层,其设置于所述第一阻隔层的远离所述基板的一侧表面。
10.根据权利要求9所述的显示面板,其特征在于,
所述粘合层所采用的材质为压敏胶;
所述第一阻隔层所采用的材质为聚对苯二甲酸乙二醇酯或者聚酰亚胺;
所述第二阻隔层所采用的材质为环氧树脂、聚氨酯、聚酯、丙烯酸中的至少一种。
11.一种显示面板的封装方法,其特征在于,包括如下步骤:
制备一显示面板,所述显示面板包括基板、薄膜晶体管层以及发光层,所述薄膜晶体管形成于所述基板上;所述发光层形成于所述薄膜晶体管层上,且所述发光层包括至少两个间隔设置的发光单元;
形成第一封装层于所述发光层上,且填充于两个相邻设置的发光单元之间的间隙;所述第一封装层由以下质量百分比组分组成:
主体树脂,20%-50%;
稀释单体,20%-50%;
稳定剂,0.01%-2%;
微凝胶,1%-10%;
链连转移剂,0.01%-5%;以及
引发剂,余量。
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN87100720A (zh) * | 1986-01-22 | 1987-08-26 | 纳幕尔杜邦公司 | 含微粒凝胶的光敏组合物 |
CN101970590A (zh) * | 2007-12-28 | 2011-02-09 | E.I.内穆尔杜邦公司 | 可光化固化的粘合剂组合物 |
CN107452891A (zh) * | 2017-05-22 | 2017-12-08 | 茆胜 | 兼具柔性和耐磨性能的oled封装结构及封装方法 |
CN112368344A (zh) * | 2018-07-25 | 2021-02-12 | 捷德货币技术有限责任公司 | 通过辐射可固化的涂料组合物的用途、制造微光学或纳光学结构的方法、微光学或纳光学结构和数据载体 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN87100720A (zh) * | 1986-01-22 | 1987-08-26 | 纳幕尔杜邦公司 | 含微粒凝胶的光敏组合物 |
CN101970590A (zh) * | 2007-12-28 | 2011-02-09 | E.I.内穆尔杜邦公司 | 可光化固化的粘合剂组合物 |
CN107452891A (zh) * | 2017-05-22 | 2017-12-08 | 茆胜 | 兼具柔性和耐磨性能的oled封装结构及封装方法 |
CN112368344A (zh) * | 2018-07-25 | 2021-02-12 | 捷德货币技术有限责任公司 | 通过辐射可固化的涂料组合物的用途、制造微光学或纳光学结构的方法、微光学或纳光学结构和数据载体 |
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