KR20080025318A - 적층 세라믹 콘덴서 - Google Patents
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Abstract
Description
유전체 재료 | 주성분 | BT입자 사이즈(㎛) | 첨가물(㏖) | 소결조제(㏖) | |||
MnO | 희토류 | B2O3 | Li2O | SiO2 | |||
M1 | BaTiO3 | 0.28 | 0.5 | 없음 | 0.2 | 0.9 | 0.9 |
M2 | BaTiO3 | 0.28 | 없음 | Dy2O3:0.5 | 0.2 | 0.9 | 0.9 |
M3 | BaTiO3 | 0.28 | 0.5 | Dy2O3:0.25 | 0.2 | 0.9 | 0.9 |
M4 | BaTiO3 | 0.33 | 0.5 | Dy2O3:0.25 | 0.2 | 0.9 | 0.9 |
M5 | BaTiO3 | 0.40 | 0.5 | Dy2O3:0.25 | 0.2 | 0.9 | 0.9 |
M6 | BaTiO3 | 0.45 | 0.5 | Dy2O3:0.25 | 0.2 | 0.9 | 0.9 |
M7 | BaTiO3 | 0.28 | 0.5 | Gd2O3:0.25 | 0.2 | 0.9 | 0.9 |
M8 | BaTiO3 | 0.28 | 0.5 | Ho2O3:0.25 | 0.2 | 0.9 | 0.9 |
M9 | BaTiO3 | 0.28 | 0.5 | Er2O3:0.25 | 0.2 | 0.9 | 0.9 |
M10 | BaTiO3 | 0.28 | 0.5 | Yb2O3:0.25 | 0.2 | 0.9 | 0.9 |
M11 | BaTiO3 | 0.28 | 0.5 | Y2O3:0.25 | 0.2 | 0.9 | 0.9 |
M12 | Ba(Ti0.9Zr0.1)O3 | 0.28 | 0.5 | Dy2O3:0.25 | 0.2 | 0.9 | 0.9 |
M13 | (Ba0.9Sr0.1)TiO3 | 0.28 | 0.5 | Dy2O3:0.25 | 0.2 | 0.9 | 0.9 |
M14 | (Ba0.9Ca0.1)TiO3 | 0.28 | 0.5 | Dy2O3:0.25 | 0.2 | 0.9 | 0.9 |
시료 No. | 유전체 재료 | 교반시간 (hr) | 내부 전극 | 소성온도 (℃) | 그레인 직경(㎛) | t/D | 유전 특성 | 수명 특성 | |
유전율 | 온도특성 | ||||||||
1-1 | M3 | 15 | Cu | 1000 | 0.28 | 5% | 2010 | X8R | ○ |
1-2 | M3 | 15 | Ni | 1000 | 0.28 | 5% | 2100 | X7R | × |
시료 No. | 유전체 재료 | 교반시간 (hr) | 내부 전극 | 소성온도 (℃) | 그레인 직경(㎛) | t/D | 유전 특성 | 수명 특성 | |
유전율 | 온도특성 | ||||||||
2-1 | M4 | 15 | Cu | 1000 | 0.33 | 4% | 2520 | X8R | ○ |
2-2 | M4 | 20 | Cu | 1000 | 0.33 | 5% | 2540 | X8R | ○ |
2-3 | M4 | 25 | Cu | 1000 | 0.35 | 7% | 2680 | X7R | ○ |
2-4 | M4 | 30 | Cu | 1000 | 0.35 | 10% | 2700 | X7R | ○ |
2-5 | M4 | 40 | Cu | 1000 | 0.35 | 15% | 2750 | NG | ○ |
2-6 | M4 | 15 | Cu | 980 | 0.33 | 2% | 2480 | X8R | ○ |
2-7 | M4 | 15 | Cu | 960 | 0.33 | 1% | 2420 | X8R | × |
시료 No. | 유전체 재료 | 교반시간 (hr) | 내부 전극 | 소성온도 (℃) | 그레인 직경(㎛) | t/D | 유전 특성 | 수명 특성 | |
유전율 | 온도특성 | ||||||||
3-1 | M1 | 15 | Cu | 1000 | 0.30 | 4% | 2050 | X8R | × |
3-2 | M2 | 15 | Cu | 1000 | 0.36 | 7% | 2810 | X7R | × |
시료 No. | 유전체 재료 | 교반시간 (hr) | 내부 전극 | 소성온도 (℃) | 그레인 직경(㎛) | t/D | 유전 특성 | 수명 특성 | |
유전율 | 온도특성 | ||||||||
4-1 | M5 | 15 | Cu | 1000 | 0.40 | 5% | 3010 | X7R | ○ |
4-2 | M6 | 15 | Cu | 1000 | 0.45 | 4% | 3530 | NG | ○ |
시료 No. | 유전체 재료 | 교반시간 (hr) | 내부 전극 | 소성온도 (℃) | 그레인 직경(㎛) | t/D | 유전 특성 | 수명 특성 | |
유전율 | 온도특성 | ||||||||
5-1 | M7 | 15 | Cu | 1000 | 0.28 | 4% | 2020 | X8R | ○ |
5-2 | M8 | 15 | Cu | 1000 | 0.28 | 6% | 2010 | X8R | ○ |
5-3 | M9 | 15 | Cu | 1000 | 0.28 | 5% | 2060 | X8R | ○ |
5-4 | M10 | 15 | Cu | 1000 | 0.28 | 4% | 2040 | X8R | ○ |
5-5 | M11 | 15 | Cu | 1000 | 0.28 | 5% | 2040 | X8R | ○ |
5-6 | M12 | 15 | Cu | 1000 | 0.28 | 5% | 2420 | X7R | ○ |
5-7 | M13 | 15 | Cu | 1000 | 0.28 | 6% | 2130 | X7R | ○ |
5-8 | M14 | 15 | Cu | 1000 | 0.28 | 6% | 2220 | X7R | ○ |
Claims (3)
- 거의 직방체 형상의 세라믹 적층체와, 이 세라믹 적층체 중에 유전체 세라믹스를 통해 대향되면서 또한 교대로 서로 다른 단면으로 인출되도록 형성된 내부 전극과, 상기 세라믹 적층체의 양 단면에 형성되고 이 단면으로 인출된 상기 내부 전극의 각각에 전기적으로 접속된 외부 전극을 갖는 적층 세라믹 콘덴서에 있어서,상기 내부 전극은 Cu 또는 Cu 합금으로 구성되어 있으며,상기 유전체 세라믹스는 단면에서 봤을 때의 직경의 평균치가 400㎚ 이하인 그레인과 입계로 구성된 BaTiO3를 주체로 하는 페로브스카이트형 유전체 재료의 소결체이며,상기 그레인은 도메인 패턴을 갖는 유전체와, 이 유전체의 표면에 형성된 껍질로 구성되어 있는 것을 특징으로 하는 적층 세라믹 콘덴서.
- 제 1 항에 있어서,단면에서 봤을 때의 상기 그레인 직경의 평균치를 D, 상기 껍질 두께의 평균치를 t라고 했을 때, t/D가 2%~10%인 것을 특징으로 하는 적층 세라믹 콘덴서.
- 제 1 항에 있어서,상기 내부 전극 사이에 끼어있는 상기 유전체 세라믹스 중에 Cu가 분포되어 있는 것을 특징으로 하는 적층 세라믹 콘덴서.
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JP2006281923A JP4936850B2 (ja) | 2006-09-15 | 2006-09-15 | 積層セラミックコンデンサ |
JPJP-P-2006-00281923 | 2006-09-15 |
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KR20080025318A true KR20080025318A (ko) | 2008-03-20 |
KR100903355B1 KR100903355B1 (ko) | 2009-06-23 |
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US (1) | US7710712B2 (ko) |
JP (1) | JP4936850B2 (ko) |
KR (1) | KR100903355B1 (ko) |
CN (1) | CN101145447B (ko) |
TW (1) | TWI402874B (ko) |
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JP5589891B2 (ja) * | 2010-05-27 | 2014-09-17 | 株式会社村田製作所 | セラミック電子部品及びその製造方法 |
JP5496331B2 (ja) * | 2010-06-25 | 2014-05-21 | 京セラ株式会社 | コンデンサ |
JP5531863B2 (ja) * | 2010-08-31 | 2014-06-25 | Tdk株式会社 | 誘電体磁器組成物およびセラミック電子部品 |
WO2012053316A1 (ja) | 2010-10-20 | 2012-04-26 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
WO2012120712A1 (ja) * | 2011-03-04 | 2012-09-13 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
CN103000369B (zh) * | 2012-12-11 | 2015-09-23 | 北京元六鸿远电子技术有限公司 | 高耐电压片式陶瓷电容器的制备方法 |
WO2014097678A1 (ja) * | 2012-12-21 | 2014-06-26 | 株式会社村田製作所 | 積層セラミックコンデンサおよびその製造方法 |
KR101452079B1 (ko) * | 2012-12-28 | 2014-10-16 | 삼성전기주식회사 | 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판 |
KR101462767B1 (ko) * | 2013-03-14 | 2014-11-20 | 삼성전기주식회사 | 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판 |
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KR102078013B1 (ko) * | 2014-02-06 | 2020-02-17 | 삼성전기주식회사 | 적층 세라믹 전자부품, 그 제조방법 및 적층 세라믹 커패시터의 실장 기판 |
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