KR20070061018A - 반도체 장치에 배치되는 중계 부재, 반도체 장치, 및반도체 장치의 제조 방법 - Google Patents
반도체 장치에 배치되는 중계 부재, 반도체 장치, 및반도체 장치의 제조 방법 Download PDFInfo
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- KR20070061018A KR20070061018A KR1020060031858A KR20060031858A KR20070061018A KR 20070061018 A KR20070061018 A KR 20070061018A KR 1020060031858 A KR1020060031858 A KR 1020060031858A KR 20060031858 A KR20060031858 A KR 20060031858A KR 20070061018 A KR20070061018 A KR 20070061018A
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Abstract
Description
Claims (10)
- 반도체 장치에 배치되는 중계 부재로서,전체면이 도체물로 이루어지는 주면을 갖는 것을 특징으로 하는 중계 부재.
- 제1항에 있어서,해당 중계 부재는, 상기 반도체 장치에 배치되는 적어도 1개의 반도체 소자와 동일한 재료로 이루어지는 기판을 포함하고,상기 주면은 상기 기판의 위쪽에 형성되어 있는 것을 특징으로 하는 중계 부재.
- 제1항 또는 제2항에 있어서,상기 주면에 홈부가 형성되고, 상기 홈부에 의해 상기 주면은 복수의 영역으로 분할되어 있는 것을 특징으로 하는 중계 부재.
- 제1 및 제2 반도체 소자; 및상기 제1 반도체 소자와 상기 제2 반도체 소자의 접속, 또는 상기 제2 반도체 소자와 배선 기판 또는 리드 프레임의 접속을 중계하는 중계 부재를 구비한 반도체 장치로서,상기 중계 부재는, 상기 제1 및 제2 반도체 소자 사이에 배치되고,상기 중계 부재의 주면의 전체면이 도체물로 이루어지고,상기 중계 부재와 상기 제2 반도체 소자, 및 상기 중계 부재와 상기 제1 반도체 소자 또는 상기 배선 기판 또는 상기 리드 프레임이, 본딩 와이어에 의해 접속된 것을 특징으로 하는 반도체 장치.
- 제4항에 있어서,상기 제2 반도체 소자는, 상기 중계 부재 상에 배치되고,상기 중계 부재의 상기 주면은, 상기 제2 반도체 소자의 주면보다도 큰 것을 특징으로 하는 반도체 장치.
- 제4항 또는 제5항에 있어서,상기 중계 부재는, 상기 제1 및 제2 반도체 소자 사이에 복수 배치되고,상기 제2 반도체 소자는, 해당 복수의 중계 부재의 각각의 일부 위에 설치되어 있는 것을 특징으로 하는 반도체 장치.
- 제6항에 있어서,상기 복수의 중계 부재는, 공통인 단일의 필름 형상 접착제에 의해, 제1 반도체 소자 상에 고착되어 있는 것을 특징으로 하는 반도체 장치.
- 중계 부재를 구비한 반도체 장치의 제조 방법으로서,상기 중계 부재에 필름 형상의 접착제를 접착하는 공정;하나의 개소에서는 상기 중계 부재만을 절단하고, 다른 개소에서는 상기 중계 부재와 상기 중계 부재에 접착된 상기 접착제의 쌍방을 절단하여, 공통인 단일의 상기 필름 형상 접착제로 접착하고 있는 복수의 분할된 중계 부재를 형성하는 공정; 및해당 복수의 분할된 중계 부재를 동시에 반도체 소자에 배치하는 공정을 포함하는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제8항에 있어서,상기 중계 부재만의 절단은, 상기 중계 부재의 도체부의 절단인 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제8항 또는 제9항에 있어서,상기 중계 부재만의 절단은, 레이저 가공에 의해서 행해지는 것을 특징으로 하는 반도체 장치의 제조 방법.
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JPJP-P-2005-00354986 | 2005-12-08 | ||
JP2005354986A JP4707548B2 (ja) | 2005-12-08 | 2005-12-08 | 半導体装置、及び半導体装置の製造方法 |
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US (1) | US7973404B2 (ko) |
JP (1) | JP4707548B2 (ko) |
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CN (2) | CN100521193C (ko) |
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KR101331980B1 (ko) * | 2012-02-06 | 2013-11-25 | 한국과학기술원 | 광섬유 광기반 균형 광세기 탐지법을 이용한 광신호와 전자신호 간 위상 탐지기 및 위상 탐지 방법 |
KR101413220B1 (ko) * | 2007-10-02 | 2014-06-30 | 삼성전자주식회사 | 인터포저를 포함하는 반도체 패키지 및 반도체 패키지의 제조방법 |
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CN101740552B (zh) * | 2008-11-25 | 2012-05-23 | 南茂科技股份有限公司 | 多芯片封装结构及其制造方法 |
JP5404083B2 (ja) * | 2009-02-10 | 2014-01-29 | 株式会社東芝 | 半導体装置 |
EP3633723B1 (en) | 2009-05-14 | 2023-02-22 | Rohm Co., Ltd. | Semiconductor device |
JP5315268B2 (ja) | 2010-03-10 | 2013-10-16 | ルネサスエレクトロニクス株式会社 | 電子装置 |
US10026714B2 (en) * | 2014-02-14 | 2018-07-17 | Nxp Usa, Inc. | Integrated circuit device |
JP2021145084A (ja) | 2020-03-13 | 2021-09-24 | キオクシア株式会社 | 半導体装置 |
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JP2734463B2 (ja) * | 1989-04-27 | 1998-03-30 | 株式会社日立製作所 | 半導体装置 |
JPH0456262A (ja) * | 1990-06-25 | 1992-02-24 | Matsushita Electron Corp | 半導体集積回路装置 |
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-
2005
- 2005-12-08 JP JP2005354986A patent/JP4707548B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-17 TW TW095109161A patent/TWI314761B/zh not_active IP Right Cessation
- 2006-03-17 US US11/377,393 patent/US7973404B2/en not_active Expired - Fee Related
- 2006-04-06 CN CNB200610073868XA patent/CN100521193C/zh not_active Expired - Fee Related
- 2006-04-06 CN CN200810169908XA patent/CN101373719B/zh not_active Expired - Fee Related
- 2006-04-07 KR KR1020060031858A patent/KR100878931B1/ko active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101413220B1 (ko) * | 2007-10-02 | 2014-06-30 | 삼성전자주식회사 | 인터포저를 포함하는 반도체 패키지 및 반도체 패키지의 제조방법 |
KR101331980B1 (ko) * | 2012-02-06 | 2013-11-25 | 한국과학기술원 | 광섬유 광기반 균형 광세기 탐지법을 이용한 광신호와 전자신호 간 위상 탐지기 및 위상 탐지 방법 |
Also Published As
Publication number | Publication date |
---|---|
TWI314761B (en) | 2009-09-11 |
JP4707548B2 (ja) | 2011-06-22 |
CN100521193C (zh) | 2009-07-29 |
KR100878931B1 (ko) | 2009-01-19 |
US20070132102A1 (en) | 2007-06-14 |
TW200723422A (en) | 2007-06-16 |
JP2007158244A (ja) | 2007-06-21 |
CN101373719B (zh) | 2011-11-23 |
CN1979847A (zh) | 2007-06-13 |
CN101373719A (zh) | 2009-02-25 |
US7973404B2 (en) | 2011-07-05 |
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