KR20070026176A - 기판 반송 장치, 기판 반송 방법 및 도포 현상 장치 - Google Patents
기판 반송 장치, 기판 반송 방법 및 도포 현상 장치 Download PDFInfo
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- KR20070026176A KR20070026176A KR1020060083188A KR20060083188A KR20070026176A KR 20070026176 A KR20070026176 A KR 20070026176A KR 1020060083188 A KR1020060083188 A KR 1020060083188A KR 20060083188 A KR20060083188 A KR 20060083188A KR 20070026176 A KR20070026176 A KR 20070026176A
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- substrate
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03D—APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS; ACCESSORIES THEREFOR
- G03D3/00—Liquid processing apparatus involving immersion; Washing apparatus involving immersion
- G03D3/08—Liquid processing apparatus involving immersion; Washing apparatus involving immersion having progressive mechanical movement of exposed material
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Robotics (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Environmental & Geological Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
Claims (13)
- 액체 침투 노광된 기판을 반송하는 아암 본체를 구비한 기판 반송 장치에 있어서,상기 아암 본체에 마련되고, 기판의 이면에 있어서의 주연부보다도 내부측을 지지하는 지지부와,상기 기판 주연부의 위치를 규제하기 위해 상기 지지부에 대해 상기 기판의 주연부를 끼워서 대향하는 위치에 마련된 규제부와,상기 지지부와 규제부 사이에 있어서의 기판의 이면보다도 하방 위치에 마련된 액받이부를 구비한 것을 특징으로 하는 기판 반송 장치.
- 제1항에 있어서, 기판이 지지부에 지지된 후, 상기 기판의 후방측의 주연부를 전방측에 상대적으로 압박하는 압박 수단을 구비하고,기판이 전방측에 상대적으로 압박됨으로써, 기판 전방측의 규제부에 의해 기판 주연부의 위치가 규제되는 것을 특징으로 하는 기판 반송 장치.
- 제1항 또는 제2항에 있어서, 상기 액받이부에는 액체를 흡인하기 위한 흡인구가 설치되어 있는 것을 특징으로 하는 기판 반송 장치.
- 제3항에 있어서, 상기 흡인구는 아암 본체에 형성된 흡인로의 선단 개구부인 것을 특징으로 하는 기판 반송 장치.
- 제1항 또는 제2항에 있어서, 상기 액받이부에 기판 이면의 주연부를 건조하기 위한 가스를 토출하는 가스 토출구가 설치되어 있는 것을 특징으로 하는 기판 반송 장치.
- 제5항에 있어서, 상기 가스 토출구는 아암 본체에 형성된 가스 공급로의 선단 개구부인 것을 특징으로 하는 기판 반송 장치.
- 제1항 또는 제2항에 있어서, 상기 액받이부에는 흡수성 부재가 설치되어 있는 것을 특징으로 하는 기판 반송 장치.
- 제1항 또는 제2항에 있어서, 상기 액받이부의 바닥면은 상기 바닥면에 부착된 액적이 미끄러 떨어지도록 지지부로부터 규제부를 보아 좌우 방향으로 경사져 있는 기판 반송 장치.
- 기판의 표면에 레지스트를 도포하는 도포 유닛 및 노광된 후의 기판에 현상액을 공급하여 현상하는 현상 유닛이 마련된 처리 블록과, 기판의 표면에 액층을 형성하여 액체 침투 노광을 행하는 노광 장치에 접속되는 인터페이스부를 구비한 도포 현상 장치에 있어서,상기 인터페이스부는 액체 침투 노광 후의 기판을 처리 블록측에 반송하는 기판 반송 장치로서 제1항 또는 제2항에 기재된 기판 반송 장치를 구비한 것을 특징으로 하는 도포 현상 장치.
- 기판의 이면에 있어서의 주연부보다도 내부측을 지지하는 지지부와, 상기 기판 주연부의 위치를 규제하기 위해 상기 지지부에 대해 상기 기판의 주연부를 끼워서 대향한 위치에 마련된 규제부를 구비한 기판 반송 장치를 이용하여, 액체가 기판의 이면 주연부에 남을 가능성이 있는 처리가 된 기판을 반송하는 기판을 반송하는 공정과,상기 지지부와 규제부 사이에 있어서의 기판의 이면보다도 하방 위치에 마련된 액받이부에 고인 액체를 흡인하는 공정을 포함하는 것을 특징으로 하는 기판 반송 방법.
- 제10항에 있어서, 상기 지지부와 규제부 사이에 있어서의 기판의 이면에 가스를 토출하여 건조시키는 공정을 더 포함하는 것을 특징으로 하는 기판 반송 방법.
- 제11항에 있어서, 상기 액체를 흡인하는 공정과 상기 건조시키는 공정은 동시에 행해지는 것을 특징으로 하는 기판 반송 방법.
- 제10항 내지 제12항 중 어느 한 항에 있어서, 기판의 후방측에 마련된 압박 수단을 상대적으로 후퇴시킨 상태에서 기판을 지지부에 지지하는 공정과,이어서 상기 압박 수단을 상대적으로 전방측에 압출하여 기판 전방측의 규제부에 의해 기판 주연부의 위치를 규제하는 공정을 포함하는 것을 특징으로 하는 기판 반송 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2005-00254158 | 2005-09-01 | ||
JP2005254158A JP4616731B2 (ja) | 2005-09-01 | 2005-09-01 | 塗布、現像装置 |
Publications (2)
Publication Number | Publication Date |
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KR20070026176A true KR20070026176A (ko) | 2007-03-08 |
KR101039210B1 KR101039210B1 (ko) | 2011-06-03 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060083188A KR101039210B1 (ko) | 2005-09-01 | 2006-08-31 | 도포 현상 장치 |
Country Status (5)
Country | Link |
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US (1) | US7563042B2 (ko) |
JP (1) | JP4616731B2 (ko) |
KR (1) | KR101039210B1 (ko) |
CN (1) | CN100426483C (ko) |
TW (1) | TWI323924B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20160056868A (ko) * | 2011-03-18 | 2016-05-20 | 도쿄엘렉트론가부시키가이샤 | 도포, 현상 장치, 도포, 현상 방법 및 기억 매체 |
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JP5006122B2 (ja) | 2007-06-29 | 2012-08-22 | 株式会社Sokudo | 基板処理装置 |
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JP5128918B2 (ja) * | 2007-11-30 | 2013-01-23 | 株式会社Sokudo | 基板処理装置 |
JP5001828B2 (ja) | 2007-12-28 | 2012-08-15 | 株式会社Sokudo | 基板処理装置 |
JP5179170B2 (ja) | 2007-12-28 | 2013-04-10 | 株式会社Sokudo | 基板処理装置 |
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JP2002299409A (ja) * | 2001-03-29 | 2002-10-11 | Dainippon Screen Mfg Co Ltd | 基板搬送装置および基板搬送方法 |
JP3933507B2 (ja) * | 2002-03-25 | 2007-06-20 | 大日本スクリーン製造株式会社 | 基板搬送装置および基板処理装置 |
JP2004071730A (ja) * | 2002-08-05 | 2004-03-04 | Sendai Nikon:Kk | レチクルハンドリング方法、レチクルハンドリング装置及び露光装置 |
KR101211451B1 (ko) * | 2003-07-09 | 2012-12-12 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
JP2005101069A (ja) * | 2003-09-22 | 2005-04-14 | Dainippon Screen Mfg Co Ltd | 搬送装置及び基板処理装置 |
WO2005036623A1 (ja) * | 2003-10-08 | 2005-04-21 | Zao Nikon Co., Ltd. | 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造方法 |
US7290813B2 (en) * | 2004-12-16 | 2007-11-06 | Asyst Technologies, Inc. | Active edge grip rest pad |
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2005
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- 2006-08-16 TW TW095130068A patent/TWI323924B/zh not_active IP Right Cessation
- 2006-08-16 US US11/504,785 patent/US7563042B2/en not_active Expired - Fee Related
- 2006-08-31 KR KR1020060083188A patent/KR101039210B1/ko active IP Right Grant
- 2006-09-01 CN CNB2006101285333A patent/CN100426483C/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20160056868A (ko) * | 2011-03-18 | 2016-05-20 | 도쿄엘렉트론가부시키가이샤 | 도포, 현상 장치, 도포, 현상 방법 및 기억 매체 |
Also Published As
Publication number | Publication date |
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JP4616731B2 (ja) | 2011-01-19 |
KR101039210B1 (ko) | 2011-06-03 |
JP2007067303A (ja) | 2007-03-15 |
TW200725787A (en) | 2007-07-01 |
US7563042B2 (en) | 2009-07-21 |
CN1925125A (zh) | 2007-03-07 |
US20070195297A1 (en) | 2007-08-23 |
TWI323924B (en) | 2010-04-21 |
CN100426483C (zh) | 2008-10-15 |
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