KR20060034638A - 수지봉지형 반도체 패키지 및 이의 제조 방법 및 장치 - Google Patents
수지봉지형 반도체 패키지 및 이의 제조 방법 및 장치 Download PDFInfo
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- KR20060034638A KR20060034638A KR1020057021096A KR20057021096A KR20060034638A KR 20060034638 A KR20060034638 A KR 20060034638A KR 1020057021096 A KR1020057021096 A KR 1020057021096A KR 20057021096 A KR20057021096 A KR 20057021096A KR 20060034638 A KR20060034638 A KR 20060034638A
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- B29C2043/3623—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices a plurality of individual elements acting on the material in the same or diferent directions, e.g. making tubular T-joints, profiles coupled on a support, e.g. plate
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Abstract
Description
실시예1 | 비교예1 | |
몰딩 방법 | 본 발명의 몰딩방법 | 멀티-트랜스터 몰딩방법 |
비-충진율 | 0/3 | 0/3 |
외부 보이드 | 0/3 | 0/3 |
내부 보이드 | 0/3 | 0/3 |
와이어 쏠림 | 2.6% | 16.6% |
수지 소모율 | 3.7% | 75.7% |
구분 | 실시예1 | 실시예2 | 실시예3 |
폭 W(mm) | 0.3 | 0.6 | 0.3 |
면적비 | 96.5% | 85.2% | 76.5% |
비-충진율 | 0/3 | 0/3 | 0/3 |
외부 보이드 | 0/3 | 0/3 | 0/3 |
내부 보이드 | 0/3 | 0/3 | 0/3 |
와이어 쏠림 | 2.70% | 8.50% | 10.20% |
Claims (9)
- 수지-봉지형 반도체 패키지 제조 방법에 있어서,(1) 분말상 또는 과립상의 수지조성물을 계량포트로 공급하고, 이 수지조성물을 계량하는 공정과, (2) 상기 수지조성물을 계량포트로부터 히터를 갖는 교반포트로 이송시키는 공정과, (3) 상기 교반포트내의 수지조성물을 교반시키면서 용융시키는 공정과, (4) 교반용융된 상기 수지조성물을 취출하는 동시에 저압조건에서 패키지 형상으로 가압 성형시키는 공정과, (5) 반도체 칩 또는 전자부품이 실장된 리드프레임 또는 테이프 기판을 히터를 갖는 몰딩 다이의 상부 몰딩 유니트의 캐비티에 안착시키는 공정과, (6) 상기 성형된 수지조성물을 하부 몰딩 유니트의 캐비티 내측의 압축용 플런져에 안착시키는 공정과, (7) 상기 몰딩 다이의 클램핑 후, 압축용 플런져가 상기 수지조성물을 가압하여 몰딩 및 경화가 이루어지도록 함으로써, 반도체 칩 또는 전자 부품 및 리드프레임 또는 테이프 기판이 수지조성물로 봉지되어 일체의 성형물로 얻어지게 되는 공정과, (8) 상기 몰딩 다이로부터 일체로 몰딩된 반도체 패키지를 취출하는 단계를 포함하여 이루어진 것을 특징으로 하는 수지-봉지형 반도체 패키지 제조 방법.
- 청구항 1에 있어서, 상기 공정 (3)에서, 히터를 갖는 상기 교반포트의 온도는 상기 수지조성물이 교반 용융시 히터를 갖는 교반포트의 온도는 80℃∼120℃ 범 위인 것을 특징으로 하는 수지-봉지형 반도체 패키지 제조 방법.
- 청구항 1 또는 청구항 2에 있어서, 상기 공정 (3)에서, 교반조건하에서 상기 수지조성물의 용융을 위한 시간은 10∼50초 인 것을 특징으로 하는 수지-봉지형 반도체 패키지 제조 방법.
- 청구항 1 또는 청구항 2에 있어서,상기 공정 (4)에 있어서, 상기 수지조성물이 가압 및 성형될 때, 상기 몰딩 다이의 온도는 50℃∼100℃ 이고, 가압(성형)시 압력은 9.8KN∼39,2KN 인 것을 특징으로 하는 수지-봉지형 반도체 패키지 제조 방법.
- 청구항 1 또는 청구항 2에 있어서,상기 공정 (4)에서, 상기 성형된 수지조성물은 상기 하부 몰딩 유니트의 하부 캐비티의 몰딩 바닥면의 외형 형상과 실질적으로 동일하게 성형되되, 몰딩 바닥면의 외형 형상보다 0.1∼0.5mm 작게 성형되는 것을 특징으로 하는 수지-봉지형 반도체 패키지 제조 방법.
- 청구항 1 또는 청구항 2에 있어서,상기 공정 (4)에서, 상기 성형된 수지조성물의 일면이 갖는 면적은 상기 하부 몰딩 유니트의 캐비티의 몰딩 바닥면의 면적에 90% 이상인 것을 특징으로 하는 수지-봉지형 반도체 패키지 제조 방법.
- 청구항 1 또는 청구항 2에 있어서,상기 수지-봉지형 반도체 패키지는 압축용 플런져의 선단면의 외형 형상을 따라 형성된 요철라인 틀내에서 다이싱(diced)되는 것을 특징으로 하는 수지-봉지형 반도체 패키지 제조 방법.
- 수지-봉지형 반도체 패키지 제조 장치에 있어서,(1) 계량포트로 분말 또는 과립형 수지 조성물을 계량하여 공급하는 계량유니트와,(2) 상기 계량포트로부터 히터를 갖는 교반포트로 수지조성물을 이송시키는 수지 이송기와,(3) 교반용 플런져의 팁으로부터 돌출된 교반로드를 회전시켜 교반포트에서 수지조성물을 교반/용융시키는 교반/용융유니트와,(4) 교반/용융된 수지조성물을 취출하여 저압조건에서 패키지의 형상으로 성형하는 성형유니트와,(5) 봉지처리될 목적물을 안착시키기 위한 수단으로서, 반도체 칩 또는 전자부품이 부착된 리드프레임 또는 테이프 기판을 히터를 갖는 몰딩다이의 상부 몰딩 유니트의 캐비티에 안착시키기 위한 안착장치와,(6) 하부 몰딩 유니트의 캐비티 내측의 압축용 플런져에 상기 성형된 수지조성물을 부착시키기 위한 봉지수지 부착장치와,(7) 상기 몰딩 다이의 클램핑 후, 상기 압축용 플런져로 수지조성물을 가압시켜 반도체 칩 또는 전자부품 및 리드프레임 또는 테이프 기판이 봉지되어, 이 수지조성물의 성형 및 경화후 일체로 된 봉지체가 얻어지게 하는 봉지장치와,(8) 상기 몰딩 다이로부터 최종 수지 봉지된 반도체 패키지를 취출하기 위한 취출 장치를 포함하여 구성된 것을 특징으로 하는 수지-봉지형 반도체 패키지 제조 장치.
- 청구항 1 내지 청구항 7중 어느 하나에 의한 제조 방법 및 청구항 8에 의한 장치에 의하여 제조되는 수지-봉지형 반도체 패키지.
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EP (1) | EP1630861A4 (ko) |
JP (1) | JP4577309B2 (ko) |
KR (1) | KR100708600B1 (ko) |
CN (1) | CN100433280C (ko) |
MY (1) | MY139981A (ko) |
TW (1) | TWI342262B (ko) |
WO (1) | WO2005106942A1 (ko) |
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CN100572027C (zh) * | 2004-12-17 | 2009-12-23 | 株式会社松井制作所 | 压缩成形加工中的粉粒体材料的填充方法和填充装置 |
JP2007243146A (ja) * | 2006-02-09 | 2007-09-20 | Sharp Corp | 半導体装置の製造方法、および、半導体装置の製造装置 |
CN100463129C (zh) * | 2006-02-09 | 2009-02-18 | 夏普株式会社 | 半导体装置的制造方法及半导体装置的制造装置 |
JP4858966B2 (ja) * | 2006-11-02 | 2012-01-18 | Towa株式会社 | 電子部品の圧縮成形方法及び成形装置 |
JP5086945B2 (ja) | 2008-09-05 | 2012-11-28 | 株式会社東芝 | 半導体装置の製造方法 |
WO2010067538A1 (ja) * | 2008-12-10 | 2010-06-17 | 住友ベークライト株式会社 | 顆粒状の半導体封止用エポキシ樹脂組成物ならびにそれを用いた半導体装置及び半導体装置の製造方法 |
CN102246296B (zh) * | 2008-12-10 | 2014-02-05 | 住友电木株式会社 | 半导体封装用树脂组合物、半导体装置的制造方法及半导体装置 |
TWI483418B (zh) * | 2009-04-09 | 2015-05-01 | Lextar Electronics Corp | 發光二極體封裝方法 |
WO2010146860A1 (ja) * | 2009-06-17 | 2010-12-23 | パナソニック株式会社 | 樹脂モールド型電子部品の製造方法 |
JP5731009B2 (ja) * | 2011-11-08 | 2015-06-10 | アピックヤマダ株式会社 | 樹脂封止装置および樹脂供給装置 |
CN109049461B (zh) * | 2018-08-09 | 2023-09-01 | 深圳鼎晶科技有限公司 | 一种全自动精密模压封装线 |
KR101973059B1 (ko) | 2018-09-10 | 2019-04-26 | 박재천 | 농축비료성형물 압축성형장치 및 농축비료성형물 |
WO2022239224A1 (ja) * | 2021-05-14 | 2022-11-17 | 東洋紡株式会社 | 固形物の製造方法 |
CN113707563B (zh) * | 2021-08-16 | 2022-12-13 | 宁波群芯微电子股份有限公司 | 一种高集成度的集成电路封装装置及其使用方法 |
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JPS6136940A (ja) | 1984-07-30 | 1986-02-21 | Sumitomo Electric Ind Ltd | 半導体樹脂封止装置 |
JPH06275767A (ja) | 1993-03-22 | 1994-09-30 | Toshiba Corp | 樹脂封止型半導体装置の製造方法 |
JP3199963B2 (ja) | 1994-10-06 | 2001-08-20 | 株式会社東芝 | 半導体装置の製造方法 |
MY114536A (en) * | 1994-11-24 | 2002-11-30 | Apic Yamada Corp | A resin molding machine and a method of resin molding |
JPH08330342A (ja) * | 1995-05-29 | 1996-12-13 | Toshiba Corp | 半導体樹脂封止装置 |
JPH09187831A (ja) | 1996-01-08 | 1997-07-22 | Toshiba Corp | 樹脂封止圧縮成形装置およびその方法 |
JP3282988B2 (ja) * | 1997-05-01 | 2002-05-20 | アピックヤマダ株式会社 | 樹脂モールド方法及び樹脂モールド装置 |
JPH1140587A (ja) * | 1997-07-23 | 1999-02-12 | Toray Ind Inc | 半導体封止用樹脂タブレット、半導体装置および半導体封止用樹脂タブレットの製造方法 |
JP4416218B2 (ja) * | 1999-09-14 | 2010-02-17 | アピックヤマダ株式会社 | 樹脂封止方法及び樹脂封止装置 |
JP4320921B2 (ja) * | 2000-05-31 | 2009-08-26 | 住友ベークライト株式会社 | 樹脂材料の供給装置及び方法 |
DE10131698A1 (de) * | 2001-06-29 | 2003-01-30 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares strahlungsemittierendes Bauelement und Verfahren zu dessen Herstellung |
JP3795790B2 (ja) * | 2001-10-26 | 2006-07-12 | 株式会社サイネックス | 樹脂封止方法 |
KR100798207B1 (ko) * | 2001-11-26 | 2008-01-24 | 스미토모 베이클라이트 가부시키가이샤 | 수지재료의 공급장치 및 방법 |
JP3677763B2 (ja) * | 2001-12-04 | 2005-08-03 | 株式会社サイネックス | 半導体装置製造用金型 |
JP4336499B2 (ja) * | 2003-01-09 | 2009-09-30 | Towa株式会社 | 電子部品の樹脂封止成形方法及び装置 |
JP4336502B2 (ja) * | 2003-01-30 | 2009-09-30 | Towa株式会社 | 電子部品の樹脂封止成形方法及び装置 |
JP4477306B2 (ja) | 2003-03-28 | 2010-06-09 | 住友ベークライト株式会社 | 半導体の封止成形装置及びそれを用いた樹脂封止型半導体装置の製造 |
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TW200534984A (en) | 2005-11-01 |
EP1630861A1 (en) | 2006-03-01 |
TWI342262B (en) | 2011-05-21 |
WO2005106942A1 (ja) | 2005-11-10 |
MY139981A (en) | 2009-11-30 |
JPWO2005106942A1 (ja) | 2008-03-21 |
CN100433280C (zh) | 2008-11-12 |
EP1630861A4 (en) | 2007-08-15 |
JP4577309B2 (ja) | 2010-11-10 |
CN1806323A (zh) | 2006-07-19 |
KR100708600B1 (ko) | 2007-04-18 |
US20060223235A1 (en) | 2006-10-05 |
US7348220B2 (en) | 2008-03-25 |
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