KR20040099146A - Ag-Bi계 합금 스퍼터링 타겟 및 그의 제조방법 - Google Patents
Ag-Bi계 합금 스퍼터링 타겟 및 그의 제조방법 Download PDFInfo
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- KR20040099146A KR20040099146A KR1020040034124A KR20040034124A KR20040099146A KR 20040099146 A KR20040099146 A KR 20040099146A KR 1020040034124 A KR1020040034124 A KR 1020040034124A KR 20040034124 A KR20040034124 A KR 20040034124A KR 20040099146 A KR20040099146 A KR 20040099146A
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- ray diffraction
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
Claims (8)
- Ag-Bi계 합금 스퍼터링 타겟으로서,스퍼터링면의 복수 개소를 선택하여, X선 회절법에 의해 Ag(111)면의 X선 회절 피크 강도, Ag(200)면의 X선 회절 피크 강도, Ag(220)면의 X선 회절 피크 강도, Ag(311)면의 X선 회절 피크 강도, Bi(102)면의 X선 회절 피크 강도를 측정했을 때, 하기 수학식 1로 표시되는 석출 Bi 강도의 평균치가 0.01 원자%-1이하인 것을 특징으로 하는 Ag-Bi계 합금 스퍼터링 타겟:수학식 1상기 식에서,IBi(102)는 Bi(102)면의 X선 회절 피크 강도(단위 cps(counts per second); 이하 동일)를 나타내고, IAg(111)는 Ag(111)면의 X선 회절 피크 강도를 나타내고, IAg(200)은 Ag(200)면의 X선 회절 피크 강도를 나타내고, IAg(220)은 Ag(220)면의 X선 회절 피크 강도를 나타내고, IAg(311)은 Ag(311)면의 X선 회절 피크 강도를 나타내고,[Bi]는 Ag-Bi계 합금 스퍼터링 타겟의 Bi 함유량(단위 원자%)을 나타낸다.
- Ag-Bi계 합금 스퍼터링 타겟으로서,X선 미량분석법에 의해 스퍼터링면에서의 Bi의 특성 X선 강도의 면분포를 측정했을 때에, 이 특성 X선을 강도 레벨 0부터 최대치 사이에서 8 등분으로 분류하여, 강도 레벨이 낮은 쪽부터 순서대로 제 1 강도, 제 2 강도, 제 3 강도, 제 4 강도, 제 5 강도, 제 6 강도, 제 7 강도, 제 8 강도라 명명하고, 제 1 내지 제 8의 각각의 강도의 면적비(제 1 내지 제 8 강도의 합계 면적을 100%로 함)를 산출했을 경우, 제 3 내지 제 6 강도의 면적비의 합계가 89% 이상인 것을 특징으로 하는 Ag-Bi계 합금 스퍼터링 타겟.
- 제 1 항 또는 제 2 항에 있어서,평균 결정 입경이 200㎛ 이하인 것을 특징으로 하는 Ag-Bi계 합금 스퍼터링 타겟.
- 제 1 항 또는 제 2 항에 있어서,Bi 함유량이 3 원자% 이하(0 원자%를 포함하지 않음)의 Ag기 합금인 Ag-Bi계 합금 스퍼터링 타겟.
- 제 1 항 또는 제 2 항에 있어서,상기 Ag-Bi계 합금 스퍼터링 타겟이 하기 제 1, 제 2 및 제 3의 특성 보조 합금 원소에서 선택된 1종 이상을 함유한 것인 Ag-Bi계 합금 스퍼터링 타겟:제 1 특성 보조 합금 원소: Mg, Pd, Pt, Au, Zn, Al, Ga, In, Sn 및 Sb에서 선택된 1종 이상,제 2 특성 보조 합금 원소: Be, Ru, Rh, Os, Ir, Cu 및 Ge에서 선택된 1종 이상,제 3 특성 보조 합금 원소: Y, La, Ce, Nd, Sm, Gd, Tb, Dy, Ti, Zr 및 Hf에서 선택된 1종 이상.
- 제 5 항에 있어서,상기 특성 보조 합금 원소의 합계 함유량이 5 원자% 이하인 Ag-Bi계 합금 스퍼터링 타겟.
- Ag-Bi계 합금을, 온도 350℃ 이상, 시간 0.3 시간 이상, 냉각 속도 3℃/분 이상의 조건에서 용체화 처리하는 것을 특징으로 하는 Ag-Bi계 합금 스퍼터링 타겟의 제조방법.
- 제 7 항에 있어서,용체화 처리 온도가 830℃ 이하, 용체화 처리 시간이 13 시간 이하인 Ag-Bi계 합금 스퍼터링 타겟의 제조방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003139293A JP3993530B2 (ja) | 2003-05-16 | 2003-05-16 | Ag−Bi系合金スパッタリングターゲットおよびその製造方法 |
JPJP-P-2003-00139293 | 2003-05-16 |
Publications (2)
Publication Number | Publication Date |
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KR20040099146A true KR20040099146A (ko) | 2004-11-26 |
KR100603079B1 KR100603079B1 (ko) | 2006-07-20 |
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KR1020040034124A KR100603079B1 (ko) | 2003-05-16 | 2004-05-14 | Ag-Bi계 합금 스퍼터링 타겟 및 그의 제조방법 |
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US (2) | US7767041B2 (ko) |
JP (1) | JP3993530B2 (ko) |
KR (1) | KR100603079B1 (ko) |
CN (1) | CN1280446C (ko) |
DE (1) | DE102004024114B4 (ko) |
SG (1) | SG137678A1 (ko) |
TW (1) | TWI275650B (ko) |
Cited By (1)
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KR20180086189A (ko) * | 2015-11-10 | 2018-07-30 | 마테리온 어드벤스드 머티리얼즈 저머니 게엠베하 | 은 합금-기반 스퍼터링 표적 |
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2003
- 2003-05-16 JP JP2003139293A patent/JP3993530B2/ja not_active Expired - Lifetime
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2004
- 2004-05-12 SG SG200402576-3A patent/SG137678A1/en unknown
- 2004-05-13 TW TW093113503A patent/TWI275650B/zh active
- 2004-05-13 US US10/844,345 patent/US7767041B2/en active Active
- 2004-05-14 DE DE102004024114A patent/DE102004024114B4/de not_active Expired - Lifetime
- 2004-05-14 KR KR1020040034124A patent/KR100603079B1/ko active IP Right Grant
- 2004-05-17 CN CNB2004100447079A patent/CN1280446C/zh not_active Expired - Lifetime
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180086189A (ko) * | 2015-11-10 | 2018-07-30 | 마테리온 어드벤스드 머티리얼즈 저머니 게엠베하 | 은 합금-기반 스퍼터링 표적 |
Also Published As
Publication number | Publication date |
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DE102004024114A1 (de) | 2005-01-05 |
SG137678A1 (en) | 2007-12-28 |
KR100603079B1 (ko) | 2006-07-20 |
US20040226818A1 (en) | 2004-11-18 |
JP2004339585A (ja) | 2004-12-02 |
US7767041B2 (en) | 2010-08-03 |
DE102004024114B4 (de) | 2009-11-26 |
US20100038233A1 (en) | 2010-02-18 |
CN1280446C (zh) | 2006-10-18 |
TW200506072A (en) | 2005-02-16 |
CN1550573A (zh) | 2004-12-01 |
JP3993530B2 (ja) | 2007-10-17 |
TWI275650B (en) | 2007-03-11 |
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