KR20030069044A - 배선 기판의 제조 방법 및 제조 장치 - Google Patents
배선 기판의 제조 방법 및 제조 장치 Download PDFInfo
- Publication number
- KR20030069044A KR20030069044A KR1020020084143A KR20020084143A KR20030069044A KR 20030069044 A KR20030069044 A KR 20030069044A KR 1020020084143 A KR1020020084143 A KR 1020020084143A KR 20020084143 A KR20020084143 A KR 20020084143A KR 20030069044 A KR20030069044 A KR 20030069044A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- liquid
- wiring board
- board
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 69
- 239000007788 liquid Substances 0.000 claims abstract description 159
- 239000000758 substrate Substances 0.000 claims abstract description 157
- 238000000034 method Methods 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims description 17
- 238000004140 cleaning Methods 0.000 claims description 14
- 238000007664 blowing Methods 0.000 claims description 12
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 230000002542 deteriorative effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002040099A JP2003243801A (ja) | 2002-02-18 | 2002-02-18 | 配線基板の製造方法及び製造装置 |
| JPJP-P-2002-00040099 | 2002-02-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20030069044A true KR20030069044A (ko) | 2003-08-25 |
Family
ID=27780940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020020084143A Ceased KR20030069044A (ko) | 2002-02-18 | 2002-12-26 | 배선 기판의 제조 방법 및 제조 장치 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2003243801A (enExample) |
| KR (1) | KR20030069044A (enExample) |
| CN (1) | CN1259704C (enExample) |
| TW (1) | TWI292920B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100802394B1 (ko) * | 2005-11-10 | 2008-02-13 | (주)비엔에프 | 부도체 용액을 이용한 첨단전자 및 통신장비 내 회로기판의세정장치 및 방법 |
| KR20180060325A (ko) * | 2016-11-28 | 2018-06-07 | 엘지디스플레이 주식회사 | 롤투롤 제조장치 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4790451B2 (ja) * | 2006-03-08 | 2011-10-12 | 住友精密工業株式会社 | 基板処理装置 |
-
2002
- 2002-02-18 JP JP2002040099A patent/JP2003243801A/ja not_active Withdrawn
- 2002-10-25 TW TW91125390A patent/TWI292920B/zh active
- 2002-12-26 KR KR1020020084143A patent/KR20030069044A/ko not_active Ceased
-
2003
- 2003-02-17 CN CN 03103718 patent/CN1259704C/zh not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100802394B1 (ko) * | 2005-11-10 | 2008-02-13 | (주)비엔에프 | 부도체 용액을 이용한 첨단전자 및 통신장비 내 회로기판의세정장치 및 방법 |
| KR20180060325A (ko) * | 2016-11-28 | 2018-06-07 | 엘지디스플레이 주식회사 | 롤투롤 제조장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1440057A (zh) | 2003-09-03 |
| CN1259704C (zh) | 2006-06-14 |
| JP2003243801A (ja) | 2003-08-29 |
| TWI292920B (enExample) | 2008-01-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20021226 |
|
| PA0201 | Request for examination | ||
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20050124 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20050617 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20050124 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |