JP2003243801A - 配線基板の製造方法及び製造装置 - Google Patents
配線基板の製造方法及び製造装置Info
- Publication number
- JP2003243801A JP2003243801A JP2002040099A JP2002040099A JP2003243801A JP 2003243801 A JP2003243801 A JP 2003243801A JP 2002040099 A JP2002040099 A JP 2002040099A JP 2002040099 A JP2002040099 A JP 2002040099A JP 2003243801 A JP2003243801 A JP 2003243801A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- liquid
- wiring board
- manufacturing
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 78
- 239000007788 liquid Substances 0.000 claims abstract description 155
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims description 145
- 239000000463 material Substances 0.000 claims description 16
- 238000007664 blowing Methods 0.000 claims description 14
- 238000004140 cleaning Methods 0.000 claims description 14
- 238000012546 transfer Methods 0.000 claims description 7
- 239000007779 soft material Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 239000002585 base Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002040099A JP2003243801A (ja) | 2002-02-18 | 2002-02-18 | 配線基板の製造方法及び製造装置 |
| TW91125390A TWI292920B (enExample) | 2002-02-18 | 2002-10-25 | |
| KR1020020084143A KR20030069044A (ko) | 2002-02-18 | 2002-12-26 | 배선 기판의 제조 방법 및 제조 장치 |
| CN 03103718 CN1259704C (zh) | 2002-02-18 | 2003-02-17 | 配线基板的制造方法以及制造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002040099A JP2003243801A (ja) | 2002-02-18 | 2002-02-18 | 配線基板の製造方法及び製造装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003243801A true JP2003243801A (ja) | 2003-08-29 |
Family
ID=27780940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002040099A Withdrawn JP2003243801A (ja) | 2002-02-18 | 2002-02-18 | 配線基板の製造方法及び製造装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2003243801A (enExample) |
| KR (1) | KR20030069044A (enExample) |
| CN (1) | CN1259704C (enExample) |
| TW (1) | TWI292920B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3327491A1 (en) * | 2016-11-28 | 2018-05-30 | LG Display Co., Ltd. | Roll to roll fabrication apparatus |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100802394B1 (ko) * | 2005-11-10 | 2008-02-13 | (주)비엔에프 | 부도체 용액을 이용한 첨단전자 및 통신장비 내 회로기판의세정장치 및 방법 |
| JP4790451B2 (ja) * | 2006-03-08 | 2011-10-12 | 住友精密工業株式会社 | 基板処理装置 |
-
2002
- 2002-02-18 JP JP2002040099A patent/JP2003243801A/ja not_active Withdrawn
- 2002-10-25 TW TW91125390A patent/TWI292920B/zh active
- 2002-12-26 KR KR1020020084143A patent/KR20030069044A/ko not_active Ceased
-
2003
- 2003-02-17 CN CN 03103718 patent/CN1259704C/zh not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3327491A1 (en) * | 2016-11-28 | 2018-05-30 | LG Display Co., Ltd. | Roll to roll fabrication apparatus |
| US10802308B2 (en) | 2016-11-28 | 2020-10-13 | Lg Display Co., Ltd. | Roll to roll fabrication apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1440057A (zh) | 2003-09-03 |
| CN1259704C (zh) | 2006-06-14 |
| KR20030069044A (ko) | 2003-08-25 |
| TWI292920B (enExample) | 2008-01-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050719 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20050916 |