CN1259704C - 配线基板的制造方法以及制造装置 - Google Patents
配线基板的制造方法以及制造装置 Download PDFInfo
- Publication number
- CN1259704C CN1259704C CN 03103718 CN03103718A CN1259704C CN 1259704 C CN1259704 C CN 1259704C CN 03103718 CN03103718 CN 03103718 CN 03103718 A CN03103718 A CN 03103718A CN 1259704 C CN1259704 C CN 1259704C
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- CN
- China
- Prior art keywords
- substrate
- liquid
- aforesaid
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- mentioned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 69
- 239000007788 liquid Substances 0.000 claims abstract description 136
- 238000000034 method Methods 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims description 216
- 238000009434 installation Methods 0.000 claims description 33
- 238000009826 distribution Methods 0.000 claims description 19
- 239000012530 fluid Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 17
- 238000005406 washing Methods 0.000 claims description 14
- 238000007664 blowing Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000011241 protective layer Substances 0.000 description 9
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000002585 base Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 238000009795 derivation Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Images
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002040099A JP2003243801A (ja) | 2002-02-18 | 2002-02-18 | 配線基板の製造方法及び製造装置 |
| JP200240099 | 2002-02-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1440057A CN1440057A (zh) | 2003-09-03 |
| CN1259704C true CN1259704C (zh) | 2006-06-14 |
Family
ID=27780940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03103718 Expired - Fee Related CN1259704C (zh) | 2002-02-18 | 2003-02-17 | 配线基板的制造方法以及制造装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2003243801A (enExample) |
| KR (1) | KR20030069044A (enExample) |
| CN (1) | CN1259704C (enExample) |
| TW (1) | TWI292920B (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100802394B1 (ko) * | 2005-11-10 | 2008-02-13 | (주)비엔에프 | 부도체 용액을 이용한 첨단전자 및 통신장비 내 회로기판의세정장치 및 방법 |
| JP4790451B2 (ja) * | 2006-03-08 | 2011-10-12 | 住友精密工業株式会社 | 基板処理装置 |
| KR102731377B1 (ko) * | 2016-11-28 | 2024-11-15 | 엘지디스플레이 주식회사 | 롤투롤 제조장치 |
-
2002
- 2002-02-18 JP JP2002040099A patent/JP2003243801A/ja not_active Withdrawn
- 2002-10-25 TW TW91125390A patent/TWI292920B/zh active
- 2002-12-26 KR KR1020020084143A patent/KR20030069044A/ko not_active Ceased
-
2003
- 2003-02-17 CN CN 03103718 patent/CN1259704C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1440057A (zh) | 2003-09-03 |
| KR20030069044A (ko) | 2003-08-25 |
| JP2003243801A (ja) | 2003-08-29 |
| TWI292920B (enExample) | 2008-01-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060614 Termination date: 20100217 |