TWI292920B - - Google Patents
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- Publication number
- TWI292920B TWI292920B TW91125390A TW91125390A TWI292920B TW I292920 B TWI292920 B TW I292920B TW 91125390 A TW91125390 A TW 91125390A TW 91125390 A TW91125390 A TW 91125390A TW I292920 B TWI292920 B TW I292920B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- liquid
- manufacturing
- wiring
- wiring board
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 173
- 239000007788 liquid Substances 0.000 claims description 151
- 238000004519 manufacturing process Methods 0.000 claims description 71
- 238000000034 method Methods 0.000 claims description 23
- 238000007664 blowing Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- 238000004140 cleaning Methods 0.000 claims description 10
- 230000002079 cooperative effect Effects 0.000 claims description 4
- 239000011344 liquid material Substances 0.000 claims 4
- 239000007779 soft material Substances 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000003513 alkali Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000011112 process operation Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002040099A JP2003243801A (ja) | 2002-02-18 | 2002-02-18 | 配線基板の製造方法及び製造装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI292920B true TWI292920B (enExample) | 2008-01-21 |
Family
ID=27780940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW91125390A TWI292920B (enExample) | 2002-02-18 | 2002-10-25 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2003243801A (enExample) |
| KR (1) | KR20030069044A (enExample) |
| CN (1) | CN1259704C (enExample) |
| TW (1) | TWI292920B (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100802394B1 (ko) * | 2005-11-10 | 2008-02-13 | (주)비엔에프 | 부도체 용액을 이용한 첨단전자 및 통신장비 내 회로기판의세정장치 및 방법 |
| JP4790451B2 (ja) * | 2006-03-08 | 2011-10-12 | 住友精密工業株式会社 | 基板処理装置 |
| KR102731377B1 (ko) * | 2016-11-28 | 2024-11-15 | 엘지디스플레이 주식회사 | 롤투롤 제조장치 |
-
2002
- 2002-02-18 JP JP2002040099A patent/JP2003243801A/ja not_active Withdrawn
- 2002-10-25 TW TW91125390A patent/TWI292920B/zh active
- 2002-12-26 KR KR1020020084143A patent/KR20030069044A/ko not_active Ceased
-
2003
- 2003-02-17 CN CN 03103718 patent/CN1259704C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1440057A (zh) | 2003-09-03 |
| CN1259704C (zh) | 2006-06-14 |
| KR20030069044A (ko) | 2003-08-25 |
| JP2003243801A (ja) | 2003-08-29 |
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