200300875 經濟部智慧財產局員工消費合作社印製 A7 _______B7五、發明説明（1 ) 發明所屬之技術領域 本發明係關於對玻璃基板或半導體晶圓等基板施予顯 像等處理的系統。 先行技術 在玻璃基板等基板形成微細的配線圖案等是透過微細 圖案的遮罩來進行蝕刻或離子摻雜等各種處理。 於是，要形成上述微細圖案的遮罩就在基板表面形成 光阻劑膜，對該光阻劑膜進行選擇性曝光，供給顯像液至 曝光後的光阻劑膜，如果是負型光阻劑膜則溶出非曝光部 分，如果爲正型光阻劑膜則溶出曝光部分後形成微細圖案 〇 就LCD用的大型角基板的顯像而言，顯像方法大致分 爲2種，1種是旋轉顯像，另1種爲線內（in-line)式顯像系 統。 旋轉顯像系統是將曝光後的基板保持在旋轉杯內的夾 盤，在該靜止狀態的基板表面盛放顯像液，在進行指定時 間顯像後利用夾盤使基板旋轉利用離心力甩開顯像液的系 統，因爲是在靜止的狀態下進行顯像所以適於微細的圖案 形成。 此外，線內式顯像系統則是邊搬送基板，邊從配置在 搬送路上方的噴嘴將顯像液噴灑狀地供給至基板表面，再 邊搬送基板邊進行潤濕與乾燥的系統，因爲並未使基板旋 轉所以裝置構成簡單。 (請先閱讀背面之注意事- :寫本頁) •裝. 訂 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -5- 200300875 A7 B7 五、發明説明（2) 【發明所欲解決的課題】 請 先 閱 讀 背 意 項 再 填 馬 本 頁 旋轉顯像系統方面，對旋轉時的亂流或基板本身的破 損，甚至裝置全體大型化會造成顯著的問題，使基板大型 化的情況下有其限度。 另一方面，線內式顯像系統方面，因爲是邊搬送基板 邊進行顯像，所以容易產生振動所導致的顯像不均勻，此 外噴灑噴嘴造成的物理力會導致顯像後線幅的均一性不安 定。於是’也考慮在使基板靜止的狀態下進行顯像，但因 爲顯像所需時間比較長，所以在線內式顯像系統要配合顯 像中的基板而使其他基板都停止下來，是相當不具效率的 用以解決課題之手段 經濟部智慧財產局員工消費合作社印製 爲解決上述課題，關於本發明的基板處理系統具備： 搬送基板的基板搬送部，及在基板施予處理的基板處理部 ’其構成特徵爲：前述基板搬送部與基板處理部被配置成 平面圖上爲重疊的型態，在前述基板搬送部的途中配置有 基板搬送部與基板處理部之間進行基板傳送的傳送裝置。 這樣的構成下，就能在使基板靜止的狀態下有效率地 進行顯像等處理。 前述基板處理部的數目可以是1個，也可以是沿著基板 搬送部在上游側與下游側被配置於隔開的2個位置的構成， 或者是沿著基板搬送部被配置於上游側與下游側的相隔開 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） 200300875 A7 B7 五、發明説明（3 ) 或者是沿著基板搬送部被配置於上游側與下游側的相隔開 處，還有在基板搬送部垂直方向的隔開處的合計4處的構成 〇 此外，前述基板處理部的具體構成方面考量設計構成 在基板表面供給顯像液的顯像液塗敷噴嘴，及從基板表面 回收顯像液的顯像液回收噴嘴。另外，顯像液塗敷噴嘴以 及顯像液回收噴嘴方面也可以作成與基板表面保持一定間 隔來移動的構成。 尤其，在將本系統應用於顯像的情況下，最好是設置 將顯像液回收噴嘴所回收的顯像液再從顯像液塗敷噴嘴塗 敷的循環流路。 發明之實施型態 以下根據所附圖面來說明本發明的實施型態。在此， 第1圖爲有關本發明基板處理系統的縱剖面圖，第2圖爲該 基板處理系統的平面圖，第3圖乃至第1 6圖爲說明該基板處 理系統的作業工程的縱剖面圖。 基板處理系統具備直線狀的基板搬送部1。該基板搬送 部1在途中配置著傳送裝置2。 基板搬送部1是由多數個搬送滾筒11與一對搬送帶1 2所 形成，在傳送裝置2的部分配置一對搬送帶12。即使以採用 搬送滾筒11來搬送大型玻璃基板的情況，也能防止玻璃基 板的下垂’而在以採用搬送帶1 2作爲傳送裝置2並採用可以 升降的夾盤的情況下，可以迴避與該夾盤的干涉。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐) '~. (請先閱讀背面之注意事填寫本頁) -裝·200300875 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _______ B7 V. Description of the Invention (1) Technical Field to which the Invention belongs The present invention relates to a system for performing imaging and other processing on substrates such as glass substrates or semiconductor wafers. Prior art In forming a fine wiring pattern on a substrate such as a glass substrate, various processes such as etching or ion doping are performed through a mask of the fine pattern. Therefore, to form the mask with the fine pattern, a photoresist film is formed on the substrate surface, and the photoresist film is selectively exposed, and a developing solution is supplied to the exposed photoresist film. If it is a negative photoresist The non-exposed part is dissolved in the agent film, and a fine pattern is formed after the exposed part is dissolved in the case of a positive photoresist film. As for the development of the large-size corner substrate for LCD, the development methods are roughly divided into two types, one is Rotary imaging, the other is an in-line imaging system. The rotary imaging system is a chuck that holds the exposed substrate in a rotating cup, and the developing liquid is held on the surface of the substrate in a stationary state. After a specified time of development, the substrate is rotated by the chuck and the display is rotated by centrifugal force. The liquid image system is suitable for fine pattern formation because it develops images in a stationary state. In addition, the in-line imaging system is a system that transports the substrate, sprays the developing solution to the surface of the substrate from a nozzle arranged above the transport path, and wets and dries the substrate while conveying the substrate. Since the substrate is not rotated, the device configuration is simple. (Please read the notes on the back-: Write this page first) • Binding. The size of the bound paper is applicable to the Chinese National Standard (CNS) A4 (210X297 mm) -5- 200300875 A7 B7 V. Description of the invention (2) [ Problems to be Solved by the Invention] Please read the intro items first and then fill in this page. For the rotary imaging system, the turbulence during the rotation or the damage of the substrate itself, or even the enlargement of the entire device, will cause significant problems, making the substrate large. There are limits to how it can be changed. On the other hand, with the in-line development system, the development is carried out while the substrate is being transported. Therefore, it is easy to cause uneven development due to vibration. In addition, the physical force caused by the spray nozzle will cause uniform line width after development. Sexual instability. Therefore, it is also considered that the development is performed while the substrate is stationary, but because the development time is relatively long, the in-line development system needs to cooperate with the substrate in the development and stop the other substrates. Efficient means for solving problems Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs to solve the above-mentioned problems, the substrate processing system of the present invention includes: a substrate transfer section for transferring substrates, and a substrate processing section for processing substrates. It is characterized in that the substrate transfer unit and the substrate processing unit are arranged so as to overlap in a plan view, and a transfer device for transferring substrates between the substrate transfer unit and the substrate processing unit is arranged in the middle of the substrate transfer unit. With this configuration, processing such as development can be performed efficiently with the substrate stationary. The number of the substrate processing units may be one, or may be a structure in which two substrates are arranged at two positions spaced apart from each other on the upstream side and the downstream side along the substrate transfer unit, or may be arranged along the substrate transfer unit on the upstream side and the substrate transfer unit. Separation on the downstream side This paper applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) 200300875 A7 B7 V. Description of the invention (3) Or it is arranged along the substrate conveying section on the upstream side and downstream side. At the opening, there are a total of 4 structures in the vertical space of the substrate conveying section. In addition, the specific structure of the substrate processing section is designed with a developing solution coating nozzle that supplies a developing solution on the substrate surface. And a developing solution recovery nozzle that recovers the developing solution from the substrate surface. In addition, the developer application nozzle and developer recovery nozzle may be configured to move while maintaining a certain distance from the substrate surface. In particular, in the case where the system is applied to development, it is preferable to provide a circulation flow path for applying the developing solution recovered by the developing solution recovery nozzle and then applying the developing solution from the developing solution application nozzle. Embodiments of the Invention Embodiments of the invention will be described below with reference to the drawings. Here, FIG. 1 is a longitudinal sectional view of the substrate processing system of the present invention, FIG. 2 is a plan view of the substrate processing system, and FIGS. 3 to 16 are longitudinal sectional views illustrating the operation process of the substrate processing system. . The substrate processing system includes a linear substrate transfer unit 1. The substrate transfer unit 1 is provided with a transfer device 2 in the middle. The substrate transfer unit 1 is formed of a plurality of transfer rollers 11 and a pair of transfer belts 12, and a pair of transfer belts 12 are arranged in a portion of the transfer device 2. It is possible to prevent the glass substrate from sagging even when a large glass substrate is transported by using the transporting roller 11. When the transporting belt 12 is used as the conveying device 2 and a chuck capable of lifting is used, it is possible to avoid contact with the clamp. Disc interference. This paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) '~. (Please read the notes on the back first and fill in this page)
、1T 經濟部智慧財產局員工消費合作社印製 200300875 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（4 ) 另外，在傳送裝置2通過搬送滾筒11之間採用可以升降 的升降桿的情況下並無必要採用搬送帶丨2，可以是僅以搬 送滾筒1 1來構成基板搬送部1。 此外’基板處理系統具備基板處理部3。基板處理部3 是以前述傳送裝置2的位置做爲基準而在基板搬送部1的上 游側與下游側被配置成平面圖上爲重疊的型態。另外，圖 示例中是將基板處理部3配置在基板搬送部1的上方，但也 是可以配置在下方。 基板處理部3分別具備在與前述傳送裝置2之間進行基 板傳送的臂3 1，在被保持在臂3 1上的基板表面供給顯像液 等處理液的塗敷噴嘴32，吸引回收被供給到基板表面的顯 像液等處理液的回收噴嘴3 3。 前述塗敷噴嘴32以及回收噴嘴33被做成與基板表面保 持一定間隔並可以來回動作的型態，進而也可以採用切口 噴嘴作爲這些塗敷噴嘴32以及回收噴嘴33來進行有效率的 塗敷·回收。 以下就以上構成所形成的基板處理系統所做的顯像處 理加以說明。 首先，如第1圖所示光阻劑膜曝光處理終了的第1片基 板W1會經基板搬送部1的搬送滾筒π上被朝傳送裝置2搬送 過去。 接著，如第3圖所示，如果第1片基板1由搬送帶12搬送 直到傳送裝置2上，一旦停止下來就使傳送裝置2 (夾盤） 上昇從搬送帶12接收第1片基板W1。 (請先閲讀背面之注意事填寫本頁) -裝- 訂 線 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） -8- 200300875 經濟部智慧財產局員工消費合作社印製 A7 _____B7_五、發明説明（5 ) 如果從搬送帶1 2接收到第1片基板W 1，則如第4圖所示 ’使傳送裝置2更上昇到極限，將第1片基板W1舉高至基板 處理部3的位置。這時，第2片基板W2會經基板搬送部1的 搬送滾筒1 1上被朝傳送裝置2搬送過去。 接著，如第5圖所示，上游側的基板處理部3的臂3 1會 從傳送裝置接收第1片基板W1，傳送裝置2則下降到原來的 位置，如第6圖所示，塗敷噴嘴32會下降到與第1片基板W1 的間隔成指定的間隔。此外，與此同時，第2片基板W2會 被搬送到傳送裝置2上。 之後，如第7圖所示，在臂3 1載置基板直接後退這段期 間會從塗敷噴嘴32供給顯像液。藉此對第1片基板W1—定 量均等地供給顯像液。此外，在對第1片基板W1供給顯像 液期間，傳送裝置2會將第2片基板W2舉高到基板處理部3 的位置。 接著，如第8圖所示，在上游側的基板處理部3回收噴 嘴33會下降到大約接觸到第1片基板W1表面的顯像液，而 在下游側的基板處理部3塗敷噴嘴32則下降到接近第2片基 板W2的表面。此外，與此同時，第3片基板W3會被搬送到 傳送裝置2上。 然後，如第9圖所示，在上游側的基板處理部3臂3 1會 前進並以回收噴嘴回收第1片基板W1上的顯像液，而在下 游側的基板處理部3臂31會後退並供給顯像液至第2片基板 W2上。另外，已回收的顯像液透過循環流路邊被追加新液 ，邊被調整顯像液的濃度，被過濾之後，再從塗敷噴嘴32 本紙張尺度適用中國國家標隼（CNS ) A4規格（210X 297公釐） (請先閲讀背面之注意事4一|填寫本頁) -裝1T printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 200300875 A7 B7 printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (4) In addition, a lifting rod that can be raised and lowered is used between the conveying device 2 and the transfer roller 11 In this case, it is not necessary to use a transfer belt 丨 2, and the substrate transfer unit 1 may be constituted only by the transfer roller 11. The substrate processing system includes a substrate processing unit 3. The substrate processing unit 3 is arranged on the upstream side and the downstream side of the substrate transfer unit 1 so as to be superimposed on a plan view based on the position of the transfer device 2. In the example shown in the figure, the substrate processing unit 3 is arranged above the substrate transfer unit 1, but it may be arranged below. The substrate processing unit 3 is provided with an arm 31 for transferring substrates to and from the transfer device 2 and a coating nozzle 32 for supplying a processing liquid such as a developing solution on the surface of the substrate held by the arm 31 to suck and recover the supply. A collection nozzle 33 for a processing liquid such as a developing liquid to the substrate surface. The coating nozzle 32 and the recovery nozzle 33 are configured to be able to move back and forth while maintaining a certain distance from the substrate surface. Furthermore, a slit nozzle can be used as the coating nozzle 32 and the recovery nozzle 33 to perform efficient coating. Recycle. The development processing performed by the substrate processing system formed by the above configuration will be described below. First, as shown in FIG. 1, the first substrate W1 after the photoresist film exposure process is completed is transferred to the transfer device 2 via the transfer roller π of the substrate transfer unit 1. Next, as shown in FIG. 3, if the first substrate 1 is conveyed by the conveying belt 12 to the conveying device 2, once it stops, the conveying device 2 (chuck) is raised to receive the first substrate W1 from the conveying belt 12. (Please read the cautions on the back to fill in this page first)-Binding-Threading This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) -8- 200300875 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _____B7_V. Description of the Invention (5) If the first substrate W 1 is received from the conveying belt 12, as shown in FIG. 4, 'the conveying device 2 is raised to the limit, and the first substrate W1 is lifted up. To the substrate processing section 3. At this time, the second substrate W2 is transferred to the transfer device 2 via the transfer roller 11 of the substrate transfer unit 1. Next, as shown in FIG. 5, the arm 31 of the substrate processing unit 3 on the upstream side receives the first substrate W1 from the transfer device, and the transfer device 2 is lowered to the original position. As shown in FIG. 6, coating is performed. The nozzle 32 descends to a predetermined interval from the interval of the first substrate W1. At the same time, the second substrate W2 is transferred to the transfer device 2. Thereafter, as shown in Fig. 7, the developing liquid is supplied from the coating nozzle 32 while the substrate 31 on the arm 31 is directly retracted. Thereby, the developing liquid is uniformly supplied to the first substrate W1 in a fixed amount. During the supply of the developing solution to the first substrate W1, the transfer device 2 raises the second substrate W2 to the position of the substrate processing unit 3. Next, as shown in FIG. 8, the recovery nozzle 33 of the substrate processing unit 3 on the upstream side is lowered to the developing liquid that approximately contacts the surface of the first substrate W1, and the nozzle 32 is applied to the substrate processing unit 3 on the downstream side. Then, it descends to a surface close to the second substrate W2. At the same time, the third substrate W3 is transferred to the transfer device 2. Then, as shown in FIG. 9, the substrate processing unit 3 arm 31 on the upstream side advances and collects the developing solution on the first substrate W1 with a recovery nozzle, and the substrate processing unit 3 arm 31 on the downstream side moves forward. Retreat and supply the developing solution onto the second substrate W2. In addition, the recovered developing solution is added with new solution through the circulation flow path, and the concentration of the developing solution is adjusted while being filtered. Then, the coating nozzle is applied from the coating nozzle. This paper size is in accordance with China National Standard (CNS) A4. (210X 297mm) (Please read the note on the back of the page first | fill out this page)-installed
、1T 線 -9- 200300875 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明（6 ) 被供給出去。 接著，如第10圖所示，傳送裝置2上昇後接收第1片基 板W 1，進而如第1 1圖所示，傳送裝置下降後將第1片基板 W1傳送給基板搬送部1。該第1片基板W1被送到下游側後， 如第12圖所示，以傳送裝置2將第3片基板W3從基板搬送部 1舉起，如第13圖所示，將第3片基板W3送到上游側的基板 處理部3。這段期間，於下游側的基板處理部3對第2片基板 W2施予顯像處理。 然後如第14圖所示，於上游側的基板處理部3供給顯像 液給第3片基板W3，於下游側的基板處理部回收第2片基板 W2上的顯像液，將第4片基板W4送到搬送部1。之後，如第 15圖所示第2片基板W2會透過傳送裝置2被送回搬送部1， 第3片基板W3則在上游側的基板處理部3被施予顯像處理， 進而如第16圖所示，第4片基板W4會被送到下游側的基板 處理部3。 以後，反覆上述的操作，對基板施予連續地顯像處理 〇 第17圖爲表示另一實施例並與第2圖同樣的平面圖，該 實施例中，是將基板處理部3以傳送裝置2爲中心配置成4個 。作成這種構造可以更加縮短處理的生產循環週期。 第1 8圖爲第1圖的另一實施例，在上游側或者下游側的 其中一方追加基板搬送部3，如第1 7圖所示即使不能朝橫方 向展開時，也能縮短處理的生產循環週期。 進而，如第1 9圖所示，在基板處理部3正下方設置供給 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事填寫本頁) -裝· 、11 -線 -10- 200300875 經濟部智慧財產局員工消費合作社印製 ______ B7_五、發明説明（7 ) 潤濕液的潤濕處理部，當然可以實現系統的小型化。 發明的效果 如以上說明，根據本發明因爲利用傳送裝置將搬送途 中的基板送到基板處理部進行顯像等處理，所以沒有必要 在處理中停止其他基板的搬送，又因爲是對靜止狀態的基 板施予處理，所以能提高處理的均一性，而且將基板搬送 部與基板處理部配置成平面圖上爲重疊的型態，可以達成 系統全體的小型化。 圖面之簡單說明 第1圖係關於本發明基板處理系統的縱剖面圖。 第2圖係同基板處理系統的平面圖。 第3圖係說明該基板處理系統的作業工程的縱剖面圖。 第4圖係說明該基板處理系統的作業工程的縱剖面圖。 第5圖係說明該基板處理系統的作業工程的縱剖面圖。 第6圖係說明該基板處理系統的作業工程的縱剖面圖。 第7圖係說明該基板處理系統的作業工程的縱剖面圖。 第8圖係說明該基板處理系統的作業工程的縱剖面圖。 第9圖係說明該基板處理系統的作業工程的縱剖面圖。 第10圖係說明該基板處理系統的作業工程的縱剖面圖 〇 第11圖係說明該基板處理系統的作業工程的縱剖面圖 〇 第1 2圖係說明該基板處理系統的作業工程的縱剖面圖 請先閱讀背面之注意事tmF填寫本頁} -裝· 、\-ά 線 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -11 - 200300875 A7 B7 五、發明説明（8 ) 〇 第1 3圖係說明該基板處理系統的作業工程的縱剖面圖 〇 第1 4圖係說明該基板處理系統的作業工程的縱剖面圖 〇 第1 5圖係說明該基板處理系統的作業工程的縱剖面圖 〇 第1 6圖係說明該基板處理系統的作業工程的縱剖面圖 〇 第17圖係表示另一實施例的平面圖。 第1 8圖係表示另一實施例的縱剖面圖。 第1 9圖係表示另一實施例的縱剖面圖。 圖號說明 1基板搬送部 2傳送裝置 3基板處理部 11搬送滾筒 12搬送帶 31臂 32塗敷噴嘴 33回收噴嘴 W1第1片基板 W2第2片基板 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事填寫本頁) 裝' 訂 經濟部智慧財產局員工消費合作社印製 200300875 A7 B7 五、發明説明（9 ) W3第3片基板 W4第4片基板 (請先閲讀背面之注意事填寫本頁) •裝. 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -13-Line 1T -9- 200300875 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (6) was supplied. Next, as shown in FIG. 10, after the transfer device 2 is raised, the first substrate W1 is received, and as shown in FIG. 11, the transfer device is lowered, and the first substrate W1 is transferred to the substrate transfer unit 1. After the first substrate W1 is sent to the downstream side, as shown in FIG. 12, the third substrate W3 is lifted from the substrate transfer unit 1 by the transfer device 2, and as shown in FIG. 13, the third substrate W1 is lifted. W3 is sent to the substrate processing section 3 on the upstream side. During this period, the substrate processing unit 3 on the downstream side performs a development process on the second substrate W2. Then, as shown in FIG. 14, the developing solution is supplied to the third substrate W3 by the substrate processing unit 3 on the upstream side, and the developing solution on the second substrate W2 is recovered by the substrate processing unit on the downstream side. The substrate W4 is sent to the transfer unit 1. After that, as shown in FIG. 15, the second substrate W2 is returned to the conveying unit 1 through the conveying device 2, and the third substrate W3 is subjected to development processing at the substrate processing unit 3 on the upstream side, as shown in FIG. 16. It is shown that the fourth substrate W4 is sent to the substrate processing unit 3 on the downstream side. After that, the above-mentioned operations are repeated to continuously develop the substrate. Fig. 17 is a plan view showing another embodiment and the same as Fig. 2. In this embodiment, the substrate processing unit 3 is transferred to the transfer device 2. Configure 4 for the center. With this structure, the processing cycle time can be shortened even more. Fig. 18 is another embodiment of Fig. 1. The substrate conveying section 3 is added to one of the upstream side and the downstream side. As shown in Fig. 17, even when it cannot be expanded in the horizontal direction, the processing production can be shortened. Cycle. Further, as shown in FIG. 19, a standard for supplying this paper is provided below the substrate processing section 3 to apply the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the notes on the back first and fill in this page)- · ， 11 -line-10- 200300875 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ______ B7_ V. Description of the Invention (7) The wetting treatment section of the wetting liquid can of course realize the miniaturization of the system. Advantageous Effects of Invention As described above, according to the present invention, since a substrate in transit is transferred to a substrate processing unit for development and processing by a transfer device, it is not necessary to stop the transfer of other substrates during processing, and it is because the substrate is in a stationary state. Since the treatment is performed, the uniformity of the treatment can be improved, and the substrate transfer unit and the substrate processing unit can be arranged in an overlapping pattern in a plan view, and the entire system can be miniaturized. Brief Description of the Drawings Fig. 1 is a longitudinal sectional view of a substrate processing system according to the present invention. Figure 2 is a plan view of the substrate processing system. FIG. 3 is a longitudinal cross-sectional view illustrating a work process of the substrate processing system. FIG. 4 is a longitudinal cross-sectional view illustrating a work process of the substrate processing system. FIG. 5 is a longitudinal cross-sectional view illustrating a work process of the substrate processing system. FIG. 6 is a longitudinal cross-sectional view illustrating a work process of the substrate processing system. FIG. 7 is a longitudinal cross-sectional view illustrating a work process of the substrate processing system. FIG. 8 is a longitudinal cross-sectional view illustrating a work process of the substrate processing system. FIG. 9 is a longitudinal cross-sectional view illustrating a work process of the substrate processing system. Fig. 10 is a longitudinal sectional view illustrating the operation process of the substrate processing system. Fig. 11 is a longitudinal sectional view illustrating the operation process of the substrate processing system. Fig. 12 is a longitudinal sectional view illustrating the operation process of the substrate processing system. Please read the note on the back tmF to fill in this page first}-Installation ·, \ -ά The size of the paper is applicable to the Chinese National Standard (CNS) A4 (210X297 mm) -11-200300875 A7 B7 V. Description of the invention (8 ) 〇 Figure 13 is a longitudinal sectional view illustrating the operation process of the substrate processing system. Figure 14 is a longitudinal sectional view illustrating the operation process of the substrate processing system. Figure 15 is a description of the operation of the substrate processing system. A longitudinal sectional view of the process. FIG. 16 is a longitudinal sectional view illustrating the work process of the substrate processing system. FIG. 17 is a plan view showing another embodiment. Fig. 18 is a longitudinal sectional view showing another embodiment. Fig. 19 is a longitudinal sectional view showing another embodiment. Description of drawing numbers 1 substrate transfer unit 2 transfer device 3 substrate processing unit 11 transfer drum 12 transfer belt 31 arm 32 coating nozzle 33 recovery nozzle W1 first substrate W2 second substrate This paper is in accordance with China National Standard (CNS) A4 Specifications (210X297mm) (Please read the notes on the back and fill in this page first) Binding 'Order printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by the Consumer Cooperatives 200300875 A7 B7 V. Description of the invention (9) W3 third substrate W4 Substrate (please read the notes on the back to fill in this page first) • Installation. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives This paper is printed in accordance with China National Standard (CNS) A4 (210X 297 mm) -13-