TW200428486A - Substrate treatment device - Google Patents

Substrate treatment device Download PDF

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Publication number
TW200428486A
TW200428486A TW093110254A TW93110254A TW200428486A TW 200428486 A TW200428486 A TW 200428486A TW 093110254 A TW093110254 A TW 093110254A TW 93110254 A TW93110254 A TW 93110254A TW 200428486 A TW200428486 A TW 200428486A
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Taiwan
Prior art keywords
substrate
conveying
nozzle
nozzles
supplied
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TW093110254A
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Chinese (zh)
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TWI335616B (en
Inventor
Futoshi Shimai
Shigeru Kawata
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Tokyo Ohka Kogyo Co Ltd
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Publication of TW200428486A publication Critical patent/TW200428486A/en
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Publication of TWI335616B publication Critical patent/TWI335616B/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Spray Control Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Provide a substrate treatment device that doesn't decrease the substrate processing speed and does not generate mottled developing image. The substrate treatment device having a pair of nozzles for solvent supply, which are installed in opposite, is perpendicular to the substrate transfer direction and on the two sides of the transportation line that is constructed by plural axle clipping rollers. Its features are: the said nozzles can rotate along the horizontal direction, and the length of each nozzle is around half of the substrate width. The nozzles can rotationally move upon the substrate while supplying and stand by at the position departing from the right top of the substrate while non-applying. An elevating part that bends the substrate by a way of higher central fraction and lower ends is equipped at the said transportation line.

Description

(1) (1)200428486 玖、發明說明 【發明所屬之技術領域] 本發明係有關一種將處理液供給到在運送線上被運送 之玻璃基板等之基板的基板處理裝置。 【先前技術】 在專利文獻1中,係記載著爲了將基板顯像、洗淨, 而在將基板予以密閉的處理室裡,將1張1張的基板利用放 置匣來處理。此外,在專利文獻2中,則揭示了利用噴嘴 與基板保持台的相對移動,來淸洗基板的技術。 〔專利文獻1〕日本特開平10-163159號公報(第3頁〜 第7頁) 〔專利文獻2〕日本特開2 0 0 0 - 1 0 7 7 1 5號公報(第3頁〜 第4頁) 但是,對於處理大型且大量的基板,上述處理裝置恐 怕無能無力。 在此,係考慮到可利用連續運送式(具運送線)處理 裝置來提昇處理效率。以往的連續運送式處理裝置,如第 6圖所不般,其顯像液、沖洗液、淸洗液等的處理液,係 被固定在裝置的蓋子的頂板部份,再從噴嘴以淋浴狀被處 理供給。 【發明內容】 〔發明所欲解決之課題〕 -5- (2) (2)200428486 但是’ 一旦彈回或蒸發的處理液附著在頂板部份,而 形成水滴滴落到處理中之基板表面的話,就會發生顯像斑 駁等的不良影響。 所以’本發明爲了解決上述問題點,即以提供一種無 須降低基板的處理速度,且在基板上不會產生顯像斑駁的 基板處理裝置爲其目的。 〔用以解決問題之手段〕 用以解決上述問題之本發明的基板處理裝置,係爲針 對一種由在與基板之運送方向呈直交的方向上,與軸卡合 之多數的滾子所構成的運送線的兩側,具有一對呈對向配 置之處理液供給用噴嘴的基板處理裝置,其特徵爲:上述 噴嘴在水平方向係可旋轉,並且各噴嘴的長度係大約爲上 述基板之寬度尺寸的一半;且在處理液供給時可於上述基 板上旋轉移動,而在非供給時,則在離開基板之正上方的 位置上待機。 或者是,針對一種由在與基板之運送方向呈直交的方 向上,與軸卡合之多數的滾子所構成的運送線的兩側,具 有一對呈對向配置之處理液供給用噴嘴的基板處理裝置, 其特徵爲:上述噴嘴在水平方向係可旋轉,並且各噴嘴的 長度係大約爲上述基板之寬度尺寸的一半;且在處理液供 給時可於上述基板上旋轉移動,而在非供給時,則在離開 基板之正上方的位置上待機;並且在上述運送線上,係配 置著以使基板的下面中央部較高而兩端部較低的方式彎曲 -6- (3) (3)200428486 的昇降構件。 也就是說’供給沖洗液等之處理液的噴嘴,將其長度 設定爲基板之運送方向的寬度方向的略一半,並以夾持著 運送線般地左右設置。此時,設置位置可爲左右相同位置 ’或有些差距亦可。此外,夾持著運送線而呈左右設置的 噴嘴’當基板被運送回來時則會旋轉,並在基板的運送路 上與運送用滾子呈平行的位置上停止,並在運送基板的同 時也進行沖洗液等之處理液的供給作業。當基板超過時會 再旋轉回到原來的位置。在進行連續處理時,並沒有將噴 嘴回復的必要。 再者’本發明係爲:一種針對在由與基板之運送方向 呈直交的方向上,與軸彼此卡合之多數的滾子所構成的運 送線的上方,將以與運送方向呈直交之方向爲長方向的處 理液供給用細縫噴嘴,以沿著運送方向來回移動般配置的 基板處理裝置,其特徵爲:上述細縫噴嘴的長度係約同於 與基板之運送線的運送方向呈直交之寬度尺寸的長度,並 在供給時,係比在爲了防止上述基板於通過前的液體滴落 的待機位置,更在上述基板上方移動,並將處理液供給至 基板上。 如此一來,因爲供給被設置於運送線的顯像液、沖洗 液、洗淨液等的處理液的噴嘴、或是細縫噴嘴,係爲旋轉 式或移動式,所以與固定式噴嘴相較的話,就沒有在基板 處理裝置設置頂板部份的必要,故可避免水滴滴落對基板 產生不良的影響。 (4) (4)200428486 【貫施方式】 以下茲參照所附圖式來說明本發明之實施形態。在此 ’第1圖係有關本發明之基板處理裝置的全體平面圖,沿 著基板的運送線1,從上流側依序配置著有顯像液供給部2 、顯像液回收部3、沖洗液供給·回收部4及乾燥部5,並 且在顯像供給部2及沖洗液供給·回收部4,又各自配置有 旋轉式處理液供給噴嘴6,該供給噴嘴6於供給時,如實線 所示般係在基板上旋轉,而在非供給時則如虛線所示般, 係在離開基板正上方的位置上待機。 上述運送線1係由多數的滾子(圓筒狀的滾柱)7所構 成,這些滾子7係以等距離間隔,且在與基板之運送方向 呈直交的方向上配置著軸,該長度係被設定得比被運送之 基板W的寬度尺寸爲長,並藉由馬達(無圖示)來使其 同步迴轉。 如第2圖所不’被配置在顯像液回收部3、或者是沖洗 液供給·回收部4的複數個滾子7當中,位於中間部的滾子 7 a係可自由昇降動,並且從該滾子7 a至上流側及下流側 ,在基板之長邊長度的大約1 / 2的位置的下方,係設有管 狀的回收構件(無圖示)。 接下來,具體地說明處理基板的方法。首先,如第3 圖所示般,被滚子7所運送來的基板一旦接近顯像液供給 部2的話’則在運送線1之兩側待機的噴嘴6就會開始旋轉 ,變成與基板之運送幾乎呈垂直’而將顯像液承裝於基板 的表面。 -8- (5) (5)200428486 再者,如第4圖所示般,噴嘴6亦可爲包夾著運送線, 沿著.運送方向而被配置在不同的位置。此外,如第5圖所 示般’用以取代旋轉式噴嘴6,也可在沿著運送方向往復 動的同時’使用該長度足以包覆基板之寬度尺寸的該細縫 噴嘴8 ’ 一旦當基板接近顯像液供給部2時,細縫噴嘴8就 會從圖式之虛線所示的待機部,以與運送方向相反的方向 水平移動’而將顯像液承裝在基板的表面。 靜置以既定之時間來加以顯像處理的話,將滾子運送 至隣接的顯像液回收部3,可自由昇降的滾子7 a則會在位 於基板之運送方向(長度方向)的中間時,使基板停止。 接下來如第2圖所示般,使滾子7 a上昇。如此一來, 就會變成基板中央上凸,而兩端下彎的山型彎曲狀,而被 承裝在基板表面的顯像液也就會自兩端流下。 之後,如第1圖所示般,基板被滾子所運送,一直移 動到沖洗液的供給·回收部才停止。接下來即如第2圖所 示,在該沖洗液的供給·回收部4,在使滾子7 a上昇並使 基板彎曲呈山型的同時,噴嘴6亦在呈最高狀態的基板的 中央從待機位置開始旋轉,並供給沖洗液。被供給的沖洗 液係沿著基板表面向兩端流下。最後,基板就會被滾子朝 向乾燥部5運送。 在圖式例中,雖已說明了使滾子昇降動的構成,但也 可不要讓滾子昇降動,而另外在滾子與滾子之間設置棒狀 或桿狀的昇降構件。此外,也可以使中間位置的滾子的上 流側及下流側的滾子下降,而使基板彎曲,用以來取代使 -9- (6) (6)200428486 中間位置的上昇。 〈發明效果〉 如上述之說明般,本發明之可供給設置於運送線上之 顯像液、沖洗液、洗淨液等之處理液的噴嘴’或細縫噴嘴 係爲旋轉式或移動式,所以與固定式噴嘴相較的話’則無 須在基板處理裝置上加設頂板部份,如此一來,就可避免 水滴滴落,對基板產生不良的影響。 【圖式簡單說明】 第1圖係爲本發明之基板處理裝置的全體平面圖。 第2圖係爲本發明之基板處理裝置之沖洗液供給部的 一實施例的立體圖。 第3圖係爲本發明之基板處理裝置之顯像液供給部的 一實施例的上面圖。 第4圖係爲本發明之基板處理裝置之顯像液供,給部的 其他實施例的上面圖。 第5圖係爲本發明之基板處理裝置之另一實施例的上 面圖。 第6圖係爲以往之連續運送式之處理裝置的剖面圖。 【主要元件符號說明】 1..........運送線 顯像液供給部 -10- (7) (7)200428486 3 ...........顯像液回收部 4 ...........沖洗液供給·回收部 5 ...........乾燥部 6 ...........旋轉式噴嘴 7 ..........浪子 8 ..........細縫噴嘴(1) (1) 200428486 (ii) Description of the invention [Technical field to which the invention belongs] The present invention relates to a substrate processing apparatus that supplies a processing liquid to a substrate such as a glass substrate that is transported on a transport line. [Prior Art] In Patent Document 1, it is described that, in order to develop and clean a substrate, a processing chamber in which the substrate is hermetically sealed is used to process the substrates one by one using a placement cassette. In addition, Patent Document 2 discloses a technique for cleaning a substrate by using a relative movement of a nozzle and a substrate holding table. [Patent Document 1] Japanese Patent Application Laid-Open No. 10-163159 (Page 3 to Page 7) [Patent Document 2] Japanese Patent Application Laid-Open No. 2 0 0 0-1 0 7 7 1 5 (Page 3 to 4) However, for processing large and large substrates, the above-mentioned processing apparatus is probably incapable. Here, it is considered that continuous processing (with transportation line) processing equipment can be used to improve processing efficiency. The conventional continuous conveying processing device is different from that shown in FIG. 6 in that the processing liquid such as the developing liquid, the washing liquid, and the washing liquid is fixed on the top plate part of the cover of the device, and then showered from the nozzle. Be processed supply. [Summary of the Invention] [Problems to be Solved by the Invention] -5- (2) (2) 200428486 However, if the processing liquid that rebounds or evaporates adheres to the top plate portion, and water droplets form on the surface of the substrate under processing , There will be adverse effects such as mottled imaging. Therefore, the present invention aims to provide a substrate processing apparatus without reducing the processing speed of the substrate and which does not cause mottled development on the substrate. [Means for Solving the Problem] The substrate processing apparatus of the present invention for solving the above-mentioned problems is directed to a type of roller composed of a plurality of rollers that engage with the shaft in a direction orthogonal to the conveying direction of the substrate. On both sides of the conveying line, there are a pair of substrate processing apparatuses for processing liquid supply nozzles arranged opposite to each other, wherein the nozzles are rotatable in a horizontal direction, and the length of each nozzle is approximately the width of the substrate. When the processing liquid is supplied, it can rotate and move on the substrate, and when it is not supplied, it waits at a position directly above the substrate. Alternatively, a pair of processing liquid supply nozzles disposed opposite to each other are provided on both sides of a conveying line composed of a plurality of rollers engaged with the shaft in a direction orthogonal to the conveying direction of the substrate. The substrate processing apparatus is characterized in that: the nozzles are rotatable in a horizontal direction, and the length of each nozzle is about half of the width dimension of the substrate; and the substrate can be rotated and moved on the substrate when the processing liquid is supplied. At the time of supply, it waits at a position directly above the substrate; and on the above-mentioned conveying line, it is arranged to bend so that the lower center portion of the substrate is higher and the both ends are lower -6- (3) (3 ) 200428486 lifting member. In other words, the nozzle for supplying a processing liquid such as a rinsing liquid is set to have a length of approximately half of the width direction of the substrate in the conveyance direction, and is arranged left and right so as to hold the conveyance line. At this time, the installation position may be the same position on the left and right, or some gaps may be used. In addition, the nozzles, which are arranged right and left while holding the transport line, rotate when the substrate is transported back, stop at a position parallel to the transport roller on the substrate transport path, and perform the same as the substrate is transported Supply of processing liquid such as rinse liquid. When the substrate is over, it will rotate back to its original position. It is not necessary to restore the nozzle during continuous processing. Furthermore, the present invention is directed to a direction perpendicular to the conveying direction above a conveying line composed of a plurality of rollers engaged with the shaft in a direction orthogonal to the conveying direction of the substrate. The substrate processing apparatus is a slit nozzle for processing liquid supply in the long direction, and is arranged to move back and forth along the conveyance direction. The length of the slit nozzle is approximately the same as the direction orthogonal to the conveyance direction of the substrate conveyance line. The length of the width dimension is higher than that of the substrate in the standby position to prevent the substrate from dripping before passing through, and the processing liquid is supplied onto the substrate. In this way, the nozzle or the slit nozzle for supplying the processing liquid, such as the developing liquid, the washing liquid, and the cleaning liquid installed on the conveying line, is a rotary type or a mobile type, so it is compared with a fixed type nozzle. In this case, there is no need to provide a top plate portion in the substrate processing apparatus, so it is possible to prevent the water droplets from having a bad influence on the substrate. (4) (4) 200428486 [Performance] The following describes embodiments of the present invention with reference to the drawings. Here, the first diagram is an overall plan view of the substrate processing apparatus of the present invention. A developer supply unit 2, a developer recovery unit 3, and a rinse solution are sequentially arranged from the upstream side along the substrate transport line 1. The supply / recovery unit 4 and the drying unit 5, and the developing supply unit 2 and the flushing liquid supply / recovery unit 4 are each provided with a rotary processing liquid supply nozzle 6, which is shown as a solid line during supply. Generally, it rotates on the substrate, and when it is not supplied, as shown by the dotted line, it waits at a position directly above the substrate. The above-mentioned conveying line 1 is composed of a plurality of rollers (cylindrical rollers) 7. These rollers 7 are arranged at equal distances, and a shaft is arranged in a direction orthogonal to the conveying direction of the substrate. It is set to be longer than the width dimension of the substrate W to be transported, and synchronously rotated by a motor (not shown). As shown in FIG. 2, the rollers 7 a located in the middle portion of the plurality of rollers 7 in the developing liquid recovery unit 3 or the flushing liquid supply and recovery unit 4 can be moved up and down freely. The roller 7 a is provided with a tubular recovery member (not shown) below the position on the upstream side and the downstream side of the substrate at a position about 1/2 of the length of the long side of the substrate. Next, a method of processing a substrate will be specifically described. First, as shown in FIG. 3, as soon as the substrate transported by the roller 7 approaches the developer supply unit 2, 'the nozzles 6 waiting on both sides of the transport line 1 will start to rotate and become the same as the substrate. The conveyance is almost vertical, and the developer is placed on the surface of the substrate. -8- (5) (5) 200428486 Furthermore, as shown in FIG. 4, the nozzles 6 may be arranged at different positions along the conveying direction while sandwiching the conveying line. In addition, as shown in FIG. 5 'to replace the rotary nozzle 6, it can also be reciprocated along the conveying direction' while using the slit nozzle 8 which is long enough to cover the width of the substrate. When approaching the developer supply unit 2, the slit nozzle 8 moves horizontally from the standby part shown by the dotted line in the figure in a direction opposite to the conveyance direction 'to mount the developer on the surface of the substrate. If it is left to be developed for a predetermined period of time, the roller is transported to the adjacent developing liquid recovery section 3, and the roller 7 a which can be raised and lowered freely is located in the middle of the substrate transport direction (longitudinal direction). To stop the substrate. Next, as shown in FIG. 2, the roller 7a is raised. In this way, the center of the substrate will be convex, and the two ends will be bent in a mountain shape, and the developing liquid carried on the substrate surface will flow down from both ends. Thereafter, as shown in Fig. 1, the substrate is transported by the rollers, and it is moved until the supply / recovery part of the rinse liquid is stopped. Next, as shown in FIG. 2, in the supply / recovery part 4 of the washing liquid, while the roller 7 a is raised and the substrate is bent into a mountain shape, the nozzle 6 is also driven from the center of the substrate in the highest state. The standby position starts to rotate and supplies the rinse fluid. The supplied rinsing liquid flows down to both ends along the surface of the substrate. Finally, the substrate is transported toward the drying section 5 by the roller. In the example of the drawings, the structure for raising and lowering the roller has been described. However, instead of raising and lowering the roller, a rod-shaped or rod-shaped lifting member may be provided between the roller and the roller. In addition, the rollers on the upstream and downstream sides of the rollers in the middle position can be lowered to bend the substrate, which can be used instead of raising the center position of -9- (6) (6) 200428486. <Effects of the Invention> As described above, the nozzles or slit nozzles of the present invention capable of supplying a processing liquid such as a developing liquid, a rinsing liquid, and a cleaning liquid installed on a transport line are of a rotary type or a movable type, Compared with the fixed nozzle, 'the top plate part does not need to be provided on the substrate processing device, so that water droplets can be prevented from dripping, which has an adverse effect on the substrate. [Brief Description of the Drawings] FIG. 1 is an overall plan view of a substrate processing apparatus of the present invention. Fig. 2 is a perspective view of an embodiment of a rinsing liquid supply section of the substrate processing apparatus of the present invention. Fig. 3 is a top view of an embodiment of a developing solution supply section of a substrate processing apparatus of the present invention. Fig. 4 is a top view of another embodiment of the developing liquid supply and supply section of the substrate processing apparatus of the present invention. Fig. 5 is a top view of another embodiment of the substrate processing apparatus of the present invention. Fig. 6 is a sectional view of a conventional continuous-conveying type processing apparatus. [Description of Symbols of Main Components] 1 ............. Transfer line developer supply unit -10- (7) (7) 200428486 3 ...... developer recovery Part 4 ........... Flushing liquid supply and recovery part 5 ........... Dry part 6 ........... Rotary nozzle 7. ......... Prodigal 8 .......... Slit nozzle

-11 --11-

Claims (1)

(1) (1)200428486 拾、申請專利範圍 1 · 一種基板處理裝置,係針對一種由在與基板之運送 方向呈直交的方向上,與軸卡合之多數的滾子所構成的運 送線的兩側,具有一對呈對向配置之處理液供給用噴嘴的 基板處理裝置,其特徵爲:上述噴嘴在水平方向係可旋轉 ,並且各噴嘴的長度係大約爲上述基板之寬度尺寸的一半 ;並且在處理液供給時,可於上述基板上旋轉移動,而在 非供給時,則在離開基板之正上方的位置上待機。 2 . —種基板處理裝置,係針對一種由在與基板之運送 方向呈直交的方向上,與軸卡合之多數的滾子所構成的運 送線的兩側,具有一對呈對向配置之處理液供給用噴嘴的 基板處理裝置,其特徵爲:上述噴嘴在水平方向係可旋轉 ,並且各噴嘴的長度係大約爲上述基板之寬度尺寸的一半 ;且在供給時可於上述基板上旋轉移動,而在非供給時, 則在離開基板之正上方的位置上待機,並且在上述運送線 上,係配置著以使基板的下面中央部較高而兩端部較低之 方式彎曲的昇降構件。 3 ·如申請專利範圍第1或2項所述的基板處理裝置,其 中,上述呈對向配置的一對噴嘴,係包夾著上述運送線, 並沿著運送方向,被配置在相同的位置。 4 ·如申請專利範圍第1或2項所述的基板處理裝置,其 中,上述呈對向配置的一對噴嘴,係包夾著上述運送線, 並沿著運送方向’被配置在不同的位置。 5 . —種基板處理裝置,係針對一種在由與基板之運送 -12- (2) (2)200428486 方向呈直父的方向上,與軸彼此卡合之多數的滾子所構成 的運送線的上方,將以與運送方向呈直交之方向做爲長方 向的處理液供給用細縫噴嘴,以沿著運送方向來回移動般 配置的基板處理裝置,其特徵爲:上述細縫噴嘴的長度, 係約同於與基板之運送線的運送方向呈直交的寬度尺寸, 並在供給時,係比在爲了防止在上述基板通過前的液體滴 落的待機位置,更在上述基板的上方移動,而將處理液供 給至基板上。(1) (1) 200428486 Pickup, patent application scope 1 · A substrate processing device is directed to a conveying line composed of a plurality of rollers engaged with a shaft in a direction orthogonal to the conveying direction of the substrate On both sides, there is a substrate processing apparatus having a pair of nozzles for processing liquid supply arranged opposite to each other, characterized in that the nozzle is rotatable in a horizontal direction, and the length of each nozzle is approximately half the width dimension of the substrate; In addition, when the processing liquid is supplied, it can be rotated and moved on the substrate, and when it is not supplied, it waits at a position directly above the substrate. 2. A substrate processing device for a pair of oppositely disposed conveying lines on both sides of a conveying line composed of a plurality of rollers engaged with a shaft in a direction orthogonal to the conveying direction of the substrate. The substrate processing apparatus for a nozzle for supplying a processing liquid is characterized in that: the nozzles are rotatable in a horizontal direction, and the length of each nozzle is approximately half of the width dimension of the substrate; and can be rotated and moved on the substrate during supply. When it is not supplied, it stands by at a position directly above the substrate, and on the above-mentioned transport line, an elevating member that is bent so that the lower center portion of the substrate is higher and the both ends are lower is arranged. 3. The substrate processing apparatus according to item 1 or 2 of the scope of patent application, wherein the pair of nozzles arranged in the opposite direction are arranged at the same position along the transportation direction while sandwiching the transportation line. . 4 · The substrate processing apparatus according to item 1 or 2 of the patent application scope, wherein the pair of nozzles disposed in the opposite direction are arranged at different positions along the transportation direction while sandwiching the transportation line. . 5. A substrate processing device for a conveying line composed of a plurality of rollers that engage with the shaft in a direction that is straight to the direction of the substrate-to-substrate conveying -12- (2) (2) 200428486 The substrate processing device is configured with a slit nozzle for processing liquid supply in a direction orthogonal to the conveyance direction as a long direction, and is arranged to move back and forth along the conveyance direction. The length of the slit nozzle is as follows. The width is approximately the same as the width direction orthogonal to the conveying direction of the substrate conveying line, and when it is supplied, it moves more above the substrate than in the standby position to prevent the liquid from dripping before the substrate passes. The processing liquid is supplied onto the substrate. -13--13-
TW093110254A 2003-04-14 2004-04-13 Substrate treatment device TW200428486A (en)

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JP4849914B2 (en) * 2006-03-13 2012-01-11 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, and computer-readable storage medium
JP4824723B2 (en) * 2008-06-17 2011-11-30 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP5303231B2 (en) * 2008-09-30 2013-10-02 東京応化工業株式会社 Coating device
CN108015024B (en) * 2017-12-01 2021-03-05 浙江德尔威工程机械设备有限公司 Glass cleaning device

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