TWI335616B - - Google Patents

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TWI335616B
TWI335616B TW093110254A TW93110254A TWI335616B TW I335616 B TWI335616 B TW I335616B TW 093110254 A TW093110254 A TW 093110254A TW 93110254 A TW93110254 A TW 93110254A TW I335616 B TWI335616 B TW I335616B
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Taiwan
Prior art keywords
substrate
transport
processing apparatus
roller
disposed
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TW093110254A
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Chinese (zh)
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TW200428486A (en
Inventor
Futoshi Shimai
Shigeru Kawata
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Tokyo Ohka Kogyo Co Ltd
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Publication of TWI335616B publication Critical patent/TWI335616B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Spray Control Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

1335616 ⑴ 玖、發明說明 【發明所屬之技術領域】 本發明係有關一種將處理液供給到在運送線上被運送 ^ 之玻璃基板等之基板的基板處理裝置。 ‘ 【先前技術】 在專利文獻1中，係記載著爲了將基板顯像、洗淨， 而在將基板予以密閉的處理室裡，將1張1張的基板利用放 · 置匣來處理。此外，在專利文獻2中，則揭示了利用噴嘴 與基板保持台的相對移動，來清洗基板的技術。 〔專利文獻1〕日本特開平10-163159號公報（第3頁〜 第7頁） 〔專利文獻2〕日本特開2000-107715號公報（第3頁〜 第4頁） 但是，對於處理大型且大量的基板，上述處理裝置恐 怕有其處理限度》 · 在此，係考慮到可利用連續運送式（具運送線）處理 裝置來提昇處理效率。以往的連續運送式處理裝置，如第 6圖所示般，其顯像液、沖洗液、清洗液等的處理液，係 被固定在裝置的外罩頂板部份，再從噴嘴以淋浴狀被處理 供給。 【發明內容】 〔發明所欲解決之課題〕 Γ C* ^ -5- (2) 1335616 但是，一旦彈回或蒸發的處理液附著在頂板部份，而 形成水滴滴落到處理中之基板表面的話，就會發生顯像斑 駁等的不良影響。 所以，本發明爲了解決上述問題點，即以提供一種無 須降低基板的處理速度，且在基板上不會產生顯像斑駁的 基板處理裝置爲其目的。 φ 〔用以解決問題之手段〕 用以解決上述問題之本發明的基板處理裝置，係在由 使軸朝向與基板之運送方向呈直交的方向統合一致之多數 的滾子所構成的運送線的兩側，具有一對呈對向配置之處 理液供給用噴嘴的基板處理裝置，上述噴嘴在水平方向係 可旋轉，並且各噴嘴的長度係大約爲上述基板之寬度尺寸 的一半；且在處理液供給時可於上述基板上旋轉移動，而 在非供給時，則在離開基板之正上方的位置上待機。 • 或者是，在由使軸朝向與基板之運送方向呈直交的方 向統合一致之多數的滾子所構成的運送線的兩側，具有一 對呈對向配置之處理液供給用噴嘴的基板處理裝置，上述 噴嘴在水平方向係可旋轉，並且各噴嘴的長度係大約爲上 述基板之寬度尺寸的一半；且在處理液供給時可於上述基 板上旋轉移動，而在非供給時，則在離開基板之正上方的 位置上待機；並且在上述運送線上，係配置著以使基板的 下面中央部較高而兩端部較低的方式彎曲的昇降構件。 也就是說，供給沖洗液等之處理液的噴嘴，將其長度1335616 (1) Technical Field of the Invention The present invention relates to a substrate processing apparatus that supplies a processing liquid to a substrate such as a glass substrate that is transported on a transport line. [Prior Art] In Patent Document 1, it is described that in order to develop and clean a substrate, in a processing chamber in which a substrate is sealed, one sheet of one substrate is processed by a discharge. Further, Patent Document 2 discloses a technique of cleaning a substrate by relative movement of a nozzle and a substrate holding stage. [Patent Document 1] Japanese Patent Laid-Open No. Hei 10-163159 (p. 3 to page 7) [Patent Document 2] JP-A-2000-107715 (pages 3 to 4) A large number of substrates, the above-mentioned processing apparatus may have a processing limit thereof. Here, it is considered that a continuous transport type (transport line) processing apparatus can be utilized to improve processing efficiency. In the conventional continuous transport type processing apparatus, as shown in Fig. 6, the processing liquid such as the developing liquid, the rinsing liquid, and the cleaning liquid is fixed to the top plate portion of the outer cover of the device, and is then treated as a shower from the nozzle. supply. SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] Γ C* ^ -5- (2) 1335616 However, once the rebounded or evaporated treatment liquid adheres to the top plate portion, water droplets are dropped onto the surface of the substrate during processing. If it happens, the adverse effects such as mottled images will occur. Therefore, the present invention has been made in order to solve the above problems, and to provide a substrate processing apparatus which does not require a reduction in processing speed of a substrate and which does not cause development mottle on the substrate. Φ [Means for Solving the Problem] The substrate processing apparatus of the present invention for solving the above problems is a transport line composed of a plurality of rollers which are integrated with a direction in which the axis is orthogonal to the direction in which the substrate is transported. a substrate processing apparatus having a pair of processing liquid supply nozzles disposed opposite to each other, wherein the nozzles are rotatable in a horizontal direction, and each nozzle has a length of about half of a width dimension of the substrate; and the treatment liquid When the supply is performed, the substrate can be rotationally moved, and when it is not supplied, it stands by at a position directly above the substrate. Or a substrate treatment of a pair of processing liquid supply nozzles disposed in opposite directions on both sides of a transport line composed of a plurality of rollers that are aligned in a direction orthogonal to the direction in which the substrate is transported. In the device, the nozzle is rotatable in a horizontal direction, and each nozzle has a length of about half of a width of the substrate; and is rotatable on the substrate when the processing liquid is supplied, and is away when not supplied. The position is directly above the substrate, and the elevating member is curved so that the central portion of the lower surface of the substrate is high and the both end portions are low. That is, the nozzle for supplying the treatment liquid such as the rinse liquid, the length thereof

[S -6- (3) . .... 1335616 設定爲基板之運送方向的寬度方向的略一半，並以夾持著 _ 運送線般地左右設置。此時，設置位置可爲左右相同位置 ，或有些差距亦可。此外，夾持著運送線而呈左右設置的 — 噴嘴，當基板被運送來時則會旋轉，並在基板的運送路上 ‘ 與運送用滾子呈平行的位置上停止，並在運送基板的同時 也進行沖洗液等之處理液的供給作業。當基板通過時會再 旋轉回到原來的位置。在進行連續處理時，並沒有將噴嘴 回復的必要。 籲 再者，本發明係由由使軸朝向與基板之運送方向呈直 交的方向統合一致之多數的滾子所構成的運送線的上方， 將以與運送方向呈直交之方向爲長方向的處理液供給用細 縫噴嘴，以沿著運送方向來回移動般配置的基板處理裝置 ，上述細縫噴嘴的長度係設爲約等同於與基板之運送線的 運送方向呈直交之寬度尺寸的長度，並在供給時從用以防 止上述基板於通過前的液體滴落的待機位置，朝向上述基 板上方移動，再將處理液供給至基板上。 鲁 如此一來，因爲供給被設置於運送線的顯像液、沖洗 液 '洗淨液等的處理液的噴嘴、或是細縫噴嘴，係爲旋轉 式或移動式，所以與固定式噴嘴相較的話，就沒有在基板 處理裝置設置頂板部份的必要，故可避免水滴滴落對基板 產生不良的影響。 【實施方式】 以下茲參照所附圖式來說明本發明之實施形態。在此 ，第1圖係有關本發明之基板處理裝置的全體平面圖，沿 (4) 1335616 -著基板的運送線1，從上游側依序配置著有顯像液供給部2 、顯像液回收部3、沖洗液供給和回收部4、以及乾燥部5 • ，並且在顯像供給部2及沖洗液供給和回收部4，又各自配 ' 置有旋轉式處理液供給噴嘴6，該供給噴嘴6於供給時，如 實線所示般係在基板上旋轉，而在非供給時則如虛線所示 般，係在離開基板正上方的位置上待機。 上述運送線1係由多數的滾子（圓筒狀的滾柱）7所構 φ 成，這些滾子7係以等距離間隔，且在與基板之運送方向 呈直交的方向上配置著軸，該長度係被設定得比被運送之 基板W的寬度尺寸爲長，並藉由馬達（無圖示）來使其 同步迴轉。 如第2圖所示，被配置在顯像液回收部3、或者是沖洗 液供給和回收部4的複數個滾子7當中，位於中間部的滾子 7a係可自由昇降動作，並且從該滾子7a至上游側及下游 側，在基板之長邊長度的大約1/2的位置的下方，係設有 • 管狀的回收構件（無圖示）。 接下來，具體地說明處理基板的方法。首先，如第3 圖所示般，被滾子7所運送來的基板一旦接近顯像液供給 部2的話，則在運送線1之兩側待機的噴嘴6就會開始旋轉 ，變成與基板之運送方向幾乎呈垂直，而將顯像液承裝於 基板的表面。 再者，如第4圖所示般，噴嘴6亦可爲包夾著運送線， 沿著運送方向而被配置在不同的位置。此外，如第5圖所 示般，用以取代旋轉式噴嘴6，也可在沿著運送方向往復 m -8 - (5) (5)1335616 ft ί乍的同時，使用該長度足以涵蓋基板之寬度尺寸的該細 縫噴嘴8，一旦當基板接近顯像液供給部2時，細縫噴嘴8 ^會從圖式之虛線所示的待機部，以與運送方向相反的方 向水平移動，而將顯像液承裝在基板的表面。 靜置以既定之時間來加以顯像處理之後，以滾子運送 至隣接的顯像液回收部3，可自由昇降的滾子7a則會在位 於基板之運送方向（長度方向）的中間時，使基板停止。 接下來如第2圖所示般，使滾子7a上昇。如此一來， 就會變成基板中央上凸，而兩端下彎的山型彎曲狀，而被 承裝在基板表面的顯像液也就會自兩端流下。 •之後，如第1圖所示般，基板被滾子所運送，一直移 動到沖洗液的供給和回收部4才停止。接下來即如第2圖所 示’在該沖洗液的供給和回收部4，在使滾子7a上昇並使 基板彎曲呈山型的同時，噴嘴6亦從待機位置開始旋轉至 呈最高狀態的基板的中央，並供給沖洗液。被供給的沖洗 液係沿著基板表面向兩端流下。最後，基板就會被滾子朝 向乾燥部5運送。 在圖式例中，雖已說明了使滾子昇降動作的構成，但 也可不要讓滾子昇降動作，而另外在滾子與滾子之間設置 棒狀或桿狀的昇降構件。此外，也可以使中間位置的滾子 的上游側及下游側的滾子下降，而使基板彎曲，用以來取 代使中間位置的上昇。 〈發明效果〉 -9- (6) 1335616 - 如上述之說明般，本發明之可供給設置於運送線上之 顯像液、沖洗液、洗淨液等之處理液的噴嘴，或細縫噴嘴 - 係爲旋轉式或移動式，所以與固定式噴嘴相較的話，則無 ' 須在基板處理裝置上加設頂板部份，如此一來，就可避免 水滴滴落，對基板產生不良的影響。 【圖式簡單說明】 φ 第1圖係爲本發明之基板處理裝置的全體平面圖。 第2圖係爲本發明之基板處理裝置之沖洗液供給部的 —實施例的立體圖。 第3圖係爲本發明之基板處理裝置之顯像液供給部的 —實施例的上視圖。 第4圖係爲本發明之基板處理裝置之顯像液供給部的 其他實施例的上視圖。 第5圖係爲本發明之基板處理裝置之另一實施例的上 鲁視圖。 第6圖係爲以往之連續運送式之處理裝置的剖面圖。 【主要元件符號說明】 1 ..........運送線 2 ..........顯像液供給部 3 ...........顯像液回收部 4 ...........沖洗液供給和回收部 5 ...........乾燥部[S -6- (3) . . . 1335616 Set to a half of the width direction of the substrate transport direction, and set it to the left and right like the _ transport line. At this time, the setting position can be the same position on the left and right, or some gaps can be used. Further, the nozzles which are disposed on the left and right while holding the transport line are rotated when the substrate is transported, and are stopped at a position parallel to the transport roller on the transport path of the substrate, and are transported while the substrate is being transported. The supply operation of the treatment liquid such as the rinse liquid is also performed. When the substrate passes, it will rotate back to its original position. There is no need to return the nozzle during continuous processing. Further, the present invention is directed to a process in which a direction in which the axis is orthogonal to the conveyance direction is a long direction by a roller which is formed by a plurality of rollers which are aligned in a direction orthogonal to the direction in which the substrate is conveyed. The liquid supply slit nozzle is configured to move back and forth along the transport direction, and the slit nozzle has a length equal to a length which is approximately equal to a width dimension orthogonal to a transport direction of the transport line of the substrate, and At the time of supply, the substrate is moved upward from the standby position for preventing the liquid droplets from dropping before the substrate passes, and the processing liquid is supplied onto the substrate. In this way, since the nozzle for supplying the treatment liquid such as the developing liquid, the rinsing liquid, and the cleaning liquid supplied to the transport line or the slit nozzle is a rotary type or a movable type, the fixed nozzle is used. In comparison, there is no need to provide a top plate portion in the substrate processing apparatus, so that it is possible to prevent the drop of water droplets from adversely affecting the substrate. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Here, the first drawing is a general plan view of the substrate processing apparatus according to the present invention, and along the transport line 1 of the substrate (4) 1335616, the developing liquid supply unit 2 and the developer liquid are sequentially disposed from the upstream side. The portion 3, the rinsing liquid supply and recovery unit 4, and the drying unit 5, and the developing solution supply unit 2 and the rinsing liquid supply and recovery unit 4 are each provided with a rotary processing liquid supply nozzle 6, which is provided 6 is rotated on the substrate as shown by the solid line at the time of supply, and stands by at a position directly above the substrate as shown by the broken line when not supplied. The transport line 1 is formed by a plurality of rollers (cylindrical rollers) 7 which are equidistantly spaced apart and arranged in a direction orthogonal to the transport direction of the substrate. This length is set to be longer than the width dimension of the substrate W to be transported, and is synchronously rotated by a motor (not shown). As shown in Fig. 2, among the plurality of rollers 7 disposed in the developing liquid recovery unit 3 or the rinse liquid supply and recovery unit 4, the roller 7a located at the intermediate portion is freely movable up and down, and The roller 7a is provided on the upstream side and the downstream side, and a tubular collecting member (not shown) is provided below the position of about 1/2 of the length of the long side of the substrate. Next, a method of processing the substrate will be specifically described. First, as shown in FIG. 3, when the substrate conveyed by the roller 7 approaches the developing liquid supply unit 2, the nozzle 6 that is waiting on both sides of the transport line 1 starts to rotate and becomes a substrate. The transport direction is almost vertical, and the developer is mounted on the surface of the substrate. Further, as shown in Fig. 4, the nozzles 6 may be placed at different positions along the transport direction by sandwiching the transport line. In addition, as shown in FIG. 5, instead of the rotary nozzle 6, it is also possible to reciprocate m -8 - (5) (5) 1335616 ft ί 沿着 along the transport direction, and the length is sufficient to cover the substrate. When the substrate is close to the developing liquid supply unit 2, the slit nozzle 8 of the width dimension moves horizontally from the standby portion indicated by the broken line in the drawing in a direction opposite to the conveying direction. The developing solution is mounted on the surface of the substrate. After standing for a predetermined period of time, the image is processed by a roller, and then transported to the adjacent developing liquid recovery unit 3 by a roller, and the roller 7a that can be lifted and lowered is placed in the middle of the substrate in the transport direction (longitudinal direction). Stop the substrate. Next, as shown in Fig. 2, the roller 7a is raised. As a result, the center of the substrate is convex, and the mountain shape bent at both ends is curved, and the developer liquid supported on the surface of the substrate flows from both ends. • Thereafter, as shown in Fig. 1, the substrate is transported by the rollers, and is moved until the supply and recovery portion 4 of the rinse liquid is stopped. Next, as shown in Fig. 2, in the supply and recovery portion 4 of the rinse liquid, the nozzle 6 is moved from the standby position to the highest state while the roller 7a is raised and the substrate is bent into a mountain shape. The center of the substrate is supplied with a rinse liquid. The supplied rinsing liquid flows down the substrate surface toward both ends. Finally, the substrate is transported by the rollers toward the drying section 5. In the illustrated example, the configuration in which the roller is moved up and down has been described. However, the roller may be moved up and down, and a rod-shaped or rod-shaped lifting member may be provided between the roller and the roller. Further, the rollers on the upstream side and the downstream side of the rollers at the intermediate position may be lowered to bend the substrate, and the intermediate position may be replaced by the replacement. <Effects of the Invention> -9- (6) 1335616 - As described above, the nozzle of the present invention capable of supplying a treatment liquid such as a developing liquid, a rinsing liquid, or a cleaning liquid provided on a conveying line, or a slit nozzle - It is a rotary or mobile type. Therefore, if it is compared with a fixed nozzle, there is no need to add a top plate portion to the substrate processing device. This prevents dripping of water droplets and adversely affects the substrate. BRIEF DESCRIPTION OF THE DRAWINGS φ Fig. 1 is a plan view showing the entire substrate processing apparatus of the present invention. Fig. 2 is a perspective view showing an embodiment of a rinse liquid supply unit of the substrate processing apparatus of the present invention. Fig. 3 is a top view showing an embodiment of a developing liquid supply unit of the substrate processing apparatus of the present invention. Fig. 4 is a top view showing another embodiment of the developing liquid supply unit of the substrate processing apparatus of the present invention. Fig. 5 is a top plan view showing another embodiment of the substrate processing apparatus of the present invention. Fig. 6 is a cross-sectional view showing a conventional continuous transport type processing apparatus. [Description of main component symbols] 1 ..........Transport line 2 ..... Imaging liquid supply unit 3 ........... Imaging liquid Recycling section 4 ...........washing liquid supply and recovery section 5 ...........drying section

[S -10- 1335616 (7) ' . ’ , %年9月令曰修{更)正醤換頁 .旋轉式噴嘴 滾子 細縫噴嘴 ' , ί: . Ϊ， -11 -[S -10- 1335616 (7) ' . ’ , September, September, 曰 曰 { { ) 醤 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Claims (1)

1335616 f年g月今日修&lt;更)正替換頁 (8) 拾、申請專利範圍 1. 一種基板處理裝置，係在由使軸朝向與基板之運送 ' 方向呈直交的方向統合一致之多數的滾子所構成的運送線 ' 的兩側，具有一對呈對向配置之處理液供給用噴嘴的基板 處理裝置，其特徵爲： 上述噴嘴在水平方向係可旋轉，並且各噴嘴的長度係 大約爲上述基板之寬度尺寸的一半；且在供給時可於上述 • 基板上旋轉移動，而在非供給時，’則在離開基板之正上方 的位置上待機，並且配置著以使基板的下面中央部較高而 兩端部較低之方式進行彎曲的昇降構件，該昇降構件，係 可以使上述運送線之中間位置的滾子上昇、或是可以使位 於中間位置之滾子其上游側及下游側的滾子下降。 2. 如申請專利範圍第1項所述的基板處理裝置，其中 ，上述呈對向配置的一對噴嘴，係包夾著上述運送線，並 沿著運送方向，被配置在相同的位置。 β 3.如申請專利範圍第1項所述的基板處理裝置，其中 ，上述呈對向配置的一對噴嘴，係包夾著上述運送線，並 沿著運送方向，被配置在不同的位置。 4.如申請專利範圍第〗項所述的基板處理裝置，其中 ，上述呈對向配置的一對噴嘴，係當基板被運送過來時， 會於水平方向旋轉，並旋轉到在基板的運送路上且與運送 用滾子呈平行的塗佈位置爲止並在該處停止，而當基板通 過時會再次於水平方向旋轉，並旋轉到離開基板之正上方 位置的待機位置爲止。 (S)1335616 f-year-and-year-old repair &lt;more) replacement page (8) Pickup, patent application scope 1. A substrate processing apparatus is integrated in a direction in which the axis is oriented orthogonal to the direction of transport of the substrate. A substrate processing apparatus having a pair of processing liquid supply nozzles disposed in opposite directions on both sides of the transport line constituting the roller, wherein the nozzle is rotatable in the horizontal direction, and the length of each nozzle is approximately It is half of the width dimension of the above substrate; and can be rotationally moved on the above substrate when supplied, and when not supplied, 'waits at a position directly above the substrate, and is disposed so that the lower center of the substrate a lifting member that is curved at a relatively high portion and has a lower end portion. The lifting member is configured to raise a roller at an intermediate position of the conveying line or to provide an upstream and downstream roller at an intermediate position. The side rollers are lowered. 2. The substrate processing apparatus according to claim 1, wherein the pair of nozzles disposed to face each other sandwich the transport line and are disposed at the same position along the transport direction. The substrate processing apparatus according to claim 1, wherein the pair of nozzles disposed in opposite directions sandwich the transport line and are disposed at different positions along the transport direction. 4. The substrate processing apparatus according to claim 1, wherein the pair of nozzles disposed in opposite directions are rotated in a horizontal direction and rotated to a transport path on the substrate when the substrate is transported. And stopping at the application position parallel to the transport roller, and when the substrate passes, it rotates again in the horizontal direction and rotates to a standby position away from the position immediately above the substrate. (S)
TW093110254A 2003-04-14 2004-04-13 Substrate treatment device TW200428486A (en)

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JP4849914B2 (en) * 2006-03-13 2012-01-11 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, and computer-readable storage medium
JP4824723B2 (en) * 2008-06-17 2011-11-30 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP5303231B2 (en) * 2008-09-30 2013-10-02 東京応化工業株式会社 Coating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108015024A (en) * 2017-12-01 2018-05-11 浙江德尔威工程机械设备有限公司 A kind of glass washing device

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