JP2002096038A - Device for treating substrate - Google Patents

Device for treating substrate

Info

Publication number
JP2002096038A
JP2002096038A JP2000291047A JP2000291047A JP2002096038A JP 2002096038 A JP2002096038 A JP 2002096038A JP 2000291047 A JP2000291047 A JP 2000291047A JP 2000291047 A JP2000291047 A JP 2000291047A JP 2002096038 A JP2002096038 A JP 2002096038A
Authority
JP
Japan
Prior art keywords
substrate
brush
cleaning
roller
transport
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000291047A
Other languages
Japanese (ja)
Other versions
JP4838929B2 (en
Inventor
Takahiro Yamazaki
貴弘 山崎
Akira Hara
暁 原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2000291047A priority Critical patent/JP4838929B2/en
Publication of JP2002096038A publication Critical patent/JP2002096038A/en
Application granted granted Critical
Publication of JP4838929B2 publication Critical patent/JP4838929B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Cleaning In General (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a treating device for preventing the carrying velocity from being fluctuated when a substrate is carried in/away from a treating part. SOLUTION: This treating device has a carrying mechanism 11 for carrying the substrate 1 and the brush treating parts 28, 29 for subjecting the substrate carried by the mechanism 11 to the prescribed treatment. The mechanism 11 has a lower carrying roller 14 to be brought into contact with the undersurface of the substrate and an upper carrying roller 18 which is disposed at the position opposite to the roller 14 and brought into contact with the top surface of the substrate over the whole length of the width direction for interposing/carrying the substrate in cooperation with the roller 14.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は基板を所定方向に
搬送しながら洗浄などの処理を行う基板の処理装置に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for performing processing such as cleaning while transporting a substrate in a predetermined direction.

【0002】[0002]

【従来の技術】たとえば、液晶表示装置や半導体装置の
製造工程においては、基板としての液晶用ガラス基板や
半導体ウエハを高い清浄度で洗浄することが要求される
工程がある。
2. Description of the Related Art For example, in a manufacturing process of a liquid crystal display device or a semiconductor device, there is a process that requires cleaning a glass substrate for a liquid crystal or a semiconductor wafer as a substrate with high cleanliness.

【0003】このような基板を洗浄する方式としては、
洗浄液中に複数枚の基板を浸漬するデイップ方式や基板
に向けて洗浄液を噴射して一枚づつ洗浄する枚葉方式が
あり、最近では高い清浄度が得られるとともに、コスト
的に有利な枚葉方式が採用されることが多くなってきて
いる。
[0003] As a method for cleaning such a substrate,
There are a dip method in which multiple substrates are immersed in the cleaning liquid, and a single-wafer method in which the cleaning liquid is sprayed toward the substrate to wash one by one. Recently, high cleanliness has been obtained and cost-effective single-wafer processing The scheme is increasingly adopted.

【0004】枚葉方式の1つとしてロ−ル状の洗浄ブラ
シを用いたブラシ洗浄装置が知られている。このブラシ
洗浄装置は基板を搬送機構によって所定方向に搬送する
とともに、その搬送途中に、上記被洗浄基板の表裏両面
に接触しながら回転駆動される、処理部を構成する複数
の洗浄ブラシを配置し、洗浄液を供給しながら各洗浄ブ
ラシを回転駆動することで、上記基板に付着した微粒子
を洗浄除去するようにしている。
A brush cleaning apparatus using a roll-shaped cleaning brush is known as one of the single-wafer systems. This brush cleaning device transports a substrate in a predetermined direction by a transport mechanism, and arranges a plurality of cleaning brushes constituting a processing unit, which are rotated while being in contact with the front and back surfaces of the substrate to be cleaned during the transport. By rotating each cleaning brush while supplying the cleaning liquid, the fine particles adhering to the substrate are cleaned and removed.

【0005】このようなブラシ洗浄装置によれば、ロ−
ルブラシのブラシ毛が基板に付着した微粒子を擦り落と
すので、高い清浄度が得られる。ところで、基板は所定
の厚さを有するばかり、洗浄ブラシによる洗浄作用を得
るために洗浄ブラシの周速度を基板の搬送速度と異なる
速度、通常速い速度に設定したり、上下一対の洗浄ブラ
シの一方を基板の搬送方向に対して逆方向に回転するな
どのことが行われる。
According to such a brush cleaning device,
Since the bristles of the brush brush the fine particles attached to the substrate, high cleanliness can be obtained. Incidentally, the substrate has a predetermined thickness, and in order to obtain the cleaning action of the cleaning brush, the peripheral speed of the cleaning brush is set to a speed different from the transport speed of the substrate, usually to a high speed, or one of a pair of upper and lower cleaning brushes. Is rotated in the direction opposite to the substrate transport direction.

【0006】そのため、搬送されてきた基板の先端の幅
方向全長が洗浄ブラシに接触したとき、基板はその厚さ
や一対の洗浄ブラシの一方が基板の搬送方向と逆方向に
回転駆動されていることによって一対の洗浄ブラシ間に
円滑に入り込まないということがある。
Therefore, when the entire length in the width direction of the tip of the conveyed substrate comes into contact with the cleaning brush, the thickness of the substrate and one of the pair of cleaning brushes are rotationally driven in the direction opposite to the direction in which the substrate is conveyed. As a result, it may not be able to smoothly enter between the pair of cleaning brushes.

【0007】また、一対の洗浄ブラシが基板の搬送方向
と同方向に回転駆動されている場合には、基板の搬送速
度と洗浄ブラシの周速度との差によって生じる接触力
で、基板が洗浄ブラシによって引き込まれる引き込み現
象が生じたり、基板の後端が洗浄ブラシから離れるとき
には洗浄ブラシから受ける接触力によって搬送速度より
も速い速度で押出される押出し現象が生じる。
When the pair of cleaning brushes are driven to rotate in the same direction as the substrate transport direction, the substrate is cleaned by the contact force generated by the difference between the substrate transport speed and the peripheral speed of the cleaning brush. When the rear end of the substrate separates from the cleaning brush, an extruding phenomenon occurs in which the substrate is extruded at a speed higher than the transport speed due to the contact force received from the cleaning brush.

【0008】このような現象が生じると、基板の搬送速
度が一定しなくなるため、洗浄むらが生じるなというこ
とがある。
[0008] When such a phenomenon occurs, the transfer speed of the substrate becomes inconsistent, so that uneven cleaning may not occur.

【0009】そこで、従来は、図7に示すように基板1
を搬送する搬送機構を、下部駆動軸2に設けられ基板1
の下面の幅方向両端部を支持する下部搬送ローラ3と、
上部駆動軸4に設けられ上記基板1の上面の幅方向両端
部に接触するOリング5が外周面に取着された上乗せロ
ーラ6とで構成し、基板を下部搬送ローラ3とOリング
5とで挟持搬送するということが行われている。
Therefore, conventionally, as shown in FIG.
A transport mechanism for transporting the substrate 1 is provided on the lower drive shaft 2.
A lower transport roller 3 that supports both widthwise ends of the lower surface of
An O-ring 5 provided on the upper drive shaft 4 and in contact with both ends in the width direction of the upper surface of the substrate 1 is constituted by an additional roller 6 attached to the outer peripheral surface. It is performed that the sheet is nipped and conveyed.

【0010】それによって、搬送される基板1が一対の
洗浄ブラシ間に入り込むときや離れるときに、上記上乗
せローラ6のOリング5による挟持力で基板1を一定の
速度で搬送できるようにしている。
Thus, when the substrate 1 to be conveyed enters or separates between a pair of cleaning brushes, the substrate 1 can be conveyed at a constant speed by the clamping force of the O-ring 5 of the additional roller 6. .

【0011】[0011]

【発明が解決しようとする課題】ところで、搬送機構に
よって搬送される基板1は、上述したように上面の幅方
向両端部だけが上乗せローラ6に取着されたOリング5
によって押圧されている。そのため、基板1の上面とO
リング5との接触面積が小さく、十分な接触抵抗が得ら
れないから、上乗せローラ6によって十分な挟持力が得
られず、基板1の搬送を円滑に行えないということがあ
る。
As described above, the substrate 1 conveyed by the conveyance mechanism has the O-ring 5 attached to the roller 6 only on both ends in the width direction of the upper surface as described above.
Is pressed by. Therefore, the upper surface of the substrate 1 and O
Since the contact area with the ring 5 is small and sufficient contact resistance cannot be obtained, a sufficient clamping force cannot be obtained by the additional roller 6, and the substrate 1 may not be transported smoothly.

【0012】基板1の搬送を円滑に行うため、基板1の
上面に対してOリング5を強く押し付け、接触抵抗の増
大を図ることが考えられる。しかしながら、Oリング5
を基板1の端部に強く押圧すると、基板1に荷重が局部
的に集中することになるため、基板1の端部に割れや欠
けを招くということがある。
In order to carry the substrate 1 smoothly, the O-ring 5 may be strongly pressed against the upper surface of the substrate 1 to increase the contact resistance. However, O-ring 5
If the substrate 1 is strongly pressed against the edge of the substrate 1, the load will be locally concentrated on the substrate 1, which may cause cracks or chips at the edge of the substrate 1.

【0013】とくに、基板が大型化すればする程、基板
1が一対の洗浄ブラシ間に入り込むときや離れるときの
搬送速度が変動しやすくなるから、それを防止するため
にはOリング5による押圧力を強くしなかればならなく
なり、その結果、基板の割れや欠けを招き易くなる。
In particular, as the size of the substrate is increased, the transport speed of the substrate 1 when entering or leaving the pair of cleaning brushes is more likely to fluctuate. The pressure must be increased, and as a result, the substrate is liable to crack or chip.

【0014】この発明は、基板に荷重を局部的に集中さ
せず、その基板が処理部に入るときや出るときに搬送速
度が大きく変動するのを防止できるようにした基板の処
理装置を提供することにある。
The present invention provides a substrate processing apparatus capable of preventing a load from locally concentrating on a substrate and preventing a transfer speed from greatly changing when the substrate enters or exits the processing section. It is in.

【0015】[0015]

【課題を解決するための手段】請求項1の発明は、基板
を搬送する搬送機構と、この搬送機構によって搬送され
る基板に所定の処理を行う処理部とを具備し、上記搬送
機構は、基板の下面に接触する下部搬送ローラと、この
下部搬送ローラと対向する位置に配置され基板の上面の
幅方向全長に接触して上記下部搬送ローラとで上記基板
を挟持搬送する上部搬送ローラとを有することを特徴と
する基板の処理装置にある。
According to a first aspect of the present invention, there is provided a transport mechanism for transporting a substrate, and a processing unit for performing a predetermined process on the substrate transported by the transport mechanism. A lower transport roller that contacts the lower surface of the substrate, and an upper transport roller that is disposed at a position facing the lower transport roller and contacts the entire length of the upper surface of the substrate in the width direction and sandwiches and transports the substrate with the lower transport roller. An apparatus for treating a substrate, comprising:

【0016】請求項2の発明は、上記下部搬送ローラと
上部搬送ローラは、同じ周速度で回転駆動されることを
特徴とする請求項1記載の基板の処理装置にある。
The invention according to claim 2 is the substrate processing apparatus according to claim 1, wherein the lower transport roller and the upper transport roller are driven to rotate at the same peripheral speed.

【0017】請求項3の発明は、上記上部搬送ローラ
は、軸方向中心部で左右に分割された一対のブラシ部を
有し、これらブラシ部は上記基板との接触によって基板
の幅方向中心部から端部に向かう方向に回転する逆向き
の螺旋状に設けられていることを特徴とする請求項1記
載の基板の処理装置にある。
According to a third aspect of the present invention, the upper transport roller has a pair of brush portions divided left and right at a central portion in the axial direction, and the brush portions are brought into contact with the substrate in the central portion in the width direction of the substrate. 2. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is provided in a reverse spiral shape that rotates in a direction from the to the end.

【0018】請求項4の発明は、上記処理部は、基板の
上面と下面とをブラシ洗浄するための下部洗浄ブラシと
上部洗浄ブラシであって、これら洗浄ブラシの一方は基
板の搬送方向に対して逆方向に回転駆動されることを特
徴とする請求項1記載の基板の処理装置にある。
According to a fourth aspect of the present invention, the processing section includes a lower cleaning brush and an upper cleaning brush for brush cleaning the upper surface and the lower surface of the substrate, and one of the cleaning brushes is arranged in the direction of transport of the substrate. 2. The substrate processing apparatus according to claim 1, wherein the substrate is driven to rotate in a reverse direction.

【0019】この発明によれば、上部ローラを基板の幅
方向全長にわたって接触させるようにしたから、基板に
局部的な集中荷重を加えることなく大きな接触抵抗が得
られるため、基板の割れや欠けを招くことなく、基板を
一定の搬送速度で搬送することができる。
According to the present invention, since the upper roller is brought into contact with the entire length of the substrate in the width direction, a large contact resistance can be obtained without applying a local concentrated load to the substrate. The substrate can be transported at a constant transport speed without inviting.

【0020】[0020]

【発明の実施の形態】以下、この発明の第1の実施の形
態を図面を参照して説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

【0021】図1乃至図4はこの発明の第1の実施の形
態を示す。この第1の実施の形態は処理装置としてのブ
ラシ洗浄装置を示し、このブラシ洗浄装置は図1に示す
ように液晶装置用のガラス基板などの基板1を矢印Aで
示す方向へ搬送する搬送機構11を有する。この搬送機
構11は、図3に示すように基板1の搬送方向に沿って
所定間隔で配置され架台12に軸受12aを介して回転
自在に支持された複数の下部搬送ローラ14が設けられ
ている。
FIGS. 1 to 4 show a first embodiment of the present invention. This first embodiment shows a brush cleaning device as a processing device, and this brush cleaning device transports a substrate 1 such as a glass substrate for a liquid crystal device in a direction indicated by an arrow A as shown in FIG. 11 As shown in FIG. 3, the transport mechanism 11 is provided with a plurality of lower transport rollers 14 which are arranged at predetermined intervals in the transport direction of the substrate 1 and are rotatably supported on a gantry 12 via bearings 12a. .

【0022】この下部搬送ローラ14は下部駆動軸13
を有する。この下部駆動軸13には、基板1の下面の幅
方向を所定間隔で支持する所定の幅寸法の円盤状をなし
た複数の支持ローラ15及び基板1の幅方向両端部に係
合して基板1の蛇行を防止する、上記支持ローラ15よ
りも大径な部分を有する一対の押えローラ16とからな
る。
The lower transport roller 14 is connected to the lower drive shaft 13
Having. The lower drive shaft 13 is engaged with a plurality of disk-shaped support rollers 15 of a predetermined width dimension for supporting the width direction of the lower surface of the substrate 1 at predetermined intervals, and at both ends in the width direction of the substrate 1. And a pair of pressing rollers 16 having a portion larger in diameter than the support roller 15 for preventing the meandering.

【0023】下部搬送ローラ14の上方には上部搬送ロ
ーラ18が上記下部搬送ローラ14と軸線を平行にして
設けられている。上部搬送ローラ18は上記架台12に
軸受12aを介して回転自在に設けられた上部駆動軸1
7を有し、この上部駆動軸17には軸方向中心部で左右
に分割された一対のブラシ部21,22が設けられてい
る。各ブラシ部21,22は、金属製のホルダ23にブ
ラシ毛24が保持されていて、このホルダ23を上記上
部駆動軸17に螺旋状に巻回して形成されている。
Above the lower transport roller 14, an upper transport roller 18 is provided with the axis parallel to the lower transport roller 14. The upper transport roller 18 is rotatably provided on the gantry 12 via a bearing 12a.
The upper drive shaft 17 is provided with a pair of brush parts 21 and 22 which are divided into right and left parts at the center in the axial direction. Each of the brush portions 21 and 22 has a brush bristles 24 held by a metal holder 23, and is formed by spirally winding the holder 23 around the upper drive shaft 17.

【0024】一対のブラシ部21,22のブラシ毛24
の上記上部駆動軸17に対する巻回方向は図2及び図3
に示すように逆方向であって、しかもその巻回方向は上
部駆動軸17が回転駆動されて矢印A方向に搬送される
基板1に対して接触したときに、この基板1の幅方向中
心部から端部に向かう方向に回転するようになってい
る。
The brush bristles 24 of the pair of brush portions 21 and 22
The winding direction of the upper drive shaft 17 with respect to FIG.
And the winding direction is the center of the substrate 1 in the width direction when the upper drive shaft 17 is rotated and comes into contact with the substrate 1 conveyed in the direction of arrow A. To rotate in the direction from the end to the end.

【0025】それによって、上部搬送ローラ18の一対
のブラシ部21,22は、下部搬送ローラ14の支持部
15と押え部16とで基板1の上下面を幅方向ほぼ全長
にわたって挟持して搬送する機能だけでなく、基板1の
上面や各ブラシ部21,22に付着した塵埃を基板1の
幅方向中心部から両端部へ排出する機能及び基板1を直
進させる機能も備えている。つまり、上部搬送ローラ1
8を一対のブラシ部21,22に分けずに全長にわたっ
て巻き方向が同一方向の螺旋状にすると、その巻き方向
に基板1を移動して直進させることができなくなるが、
一対のブラシ部21,22のブラシ毛24の巻回方向を
逆方向にしたことで、基板1を直進させることができ
る。
As a result, the pair of brush portions 21 and 22 of the upper transport roller 18 transport the upper and lower surfaces of the substrate 1 between the support portion 15 and the pressing portion 16 of the lower transport roller 14 over substantially the entire length in the width direction. In addition to the function, it has a function of discharging dust adhering to the upper surface of the substrate 1 and the brush portions 21 and 22 from the center in the width direction of the substrate 1 to both ends and a function of moving the substrate 1 straight. That is, the upper transport roller 1
If the winding direction is the same in the spiral direction over the entire length without dividing the pair 8 into a pair of brush portions 21 and 22, the substrate 1 cannot be moved in the winding direction and moved straight.
By setting the winding direction of the brush bristles 24 of the pair of brush portions 21 and 22 to be opposite, the substrate 1 can be moved straight.

【0026】下部駆動軸13と上部駆動軸17との一端
部には互いに噛合した同じ歯数の一対の第1の従動ギヤ
25aがそれぞれ嵌着され、下部駆動軸13の他端部に
は第2の従動ギヤ25bが嵌着されている。第2の従動
ギヤ25bには第1の駆動源26によって回転駆動され
る駆動ギヤ27が噛合している。したがって、各駆動軸
13,17に設けられた各搬送ローラ14,18は、第
1の駆動源26によって図1に矢印で示すように基板1
の搬送搬送方向と同方向、つまり下部搬送ローラ14は
時計方向で、上部搬送ローラ18は反時計方向に同じ周
速度で回転駆動されるようになっている。
A pair of first driven gears 25a having the same number of teeth meshing with each other are fitted to one ends of the lower drive shaft 13 and the upper drive shaft 17, respectively. Two driven gears 25b are fitted. The second driven gear 25b meshes with a driving gear 27 that is driven to rotate by a first driving source 26. Accordingly, each of the transport rollers 14 and 18 provided on each of the drive shafts 13 and 17 is moved by the first drive source 26 as shown by an arrow in FIG.
, That is, the lower transport roller 14 is driven clockwise, and the upper transport roller 18 is driven counterclockwise at the same peripheral speed.

【0027】上記搬送機構11の中途部の二箇所にはそ
れぞれ処理部としての第1のブラシ洗浄部28と第2の
ブラシ洗浄部29とが設けられている。各ブラシ洗浄部
28,29の上流側と下流側に対をなす上記上部搬送ロ
ーラ14と上記下部搬送ローラ18とがそれぞれ配置さ
れている。
A first brush cleaning unit 28 and a second brush cleaning unit 29 as processing units are provided at two places in the middle of the transport mechanism 11, respectively. The upper transport roller 14 and the lower transport roller 18 are disposed on the upstream and downstream sides of the brush cleaning units 28 and 29, respectively.

【0028】図4に示すように、各ブラシ洗浄部28,
29は下部駆動軸31と上部駆動軸32とを有する。下
部駆動軸31と上部駆動軸32とは、軸線を上下方向に
所定間隔で平行にして上記架台12に軸受12aを介し
て回転自在に支持されている。
As shown in FIG. 4, each brush cleaning section 28,
29 has a lower drive shaft 31 and an upper drive shaft 32. The lower drive shaft 31 and the upper drive shaft 32 are rotatably supported by the gantry 12 via bearings 12a with their axes parallel in the vertical direction at predetermined intervals.

【0029】各駆動軸31,32には下部洗浄ブラシ3
3と上部洗浄ブラシ34が設けられている。一対の駆動
軸1,32は、洗浄ブラシ33,34間に基板1がない
ときに互いのブラシ毛33a,34aが接触する間隔で
配設されている。この状態を図4に示す。
The lower cleaning brush 3 is provided on each of the drive shafts 31 and 32.
3 and an upper cleaning brush 34 are provided. The pair of drive shafts 1 and 32 are arranged at intervals where the brush bristles 33a and 34a contact each other when the substrate 1 is not present between the cleaning brushes 33 and 34. This state is shown in FIG.

【0030】各駆動軸31,32の一端部には第3の従
動ギヤ35が嵌着されている。一対の第3の従動ギヤ3
5は間には上記架台12に回転自在に支持された支軸3
6aに嵌着された中間ギヤ36に噛合している。下部駆
動軸31の他端部には第4の従動ギヤ37が嵌着されて
いる。この第4の従動ギヤ37には第2の駆動源38に
よって回転駆動される駆動ギヤ39が噛合している。
A third driven gear 35 is fitted to one end of each of the drive shafts 31 and 32. A pair of third driven gears 3
5 is a support shaft 3 rotatably supported by the gantry 12 therebetween.
6a is engaged with the intermediate gear 36 fitted to the gear 6a. A fourth driven gear 37 is fitted to the other end of the lower drive shaft 31. The fourth driven gear 37 meshes with a driving gear 39 that is driven to rotate by a second driving source 38.

【0031】それによって、上記第2の駆動源38が作
動すると、下部洗浄ブラシ33と上部洗浄ブラシ34と
が基板1の搬送方向に対して異なる方向に回転駆動され
るようになっている。
Thus, when the second drive source 38 operates, the lower cleaning brush 33 and the upper cleaning brush 34 are driven to rotate in different directions with respect to the transport direction of the substrate 1.

【0032】この実施の形態では、図1に矢印で示すよ
うに第1のブラシ洗浄部28の下部洗浄ブラシ33と上
部洗浄ブラシ34はともに反時計方向に回転駆動され、
第2のブラシ洗浄部29の下部洗浄ブラシ33と上部洗
浄ブラシ34はともに時計方向に回転駆動されるように
なっている。
In this embodiment, both the lower cleaning brush 33 and the upper cleaning brush 34 of the first brush cleaning section 28 are driven to rotate counterclockwise as indicated by arrows in FIG.
The lower cleaning brush 33 and the upper cleaning brush 34 of the second brush cleaning unit 29 are both driven to rotate clockwise.

【0033】なお、図1において、39は、第1のブラ
シ洗浄部28の上流側と第2のブラシ洗浄部29の下流
側にそれぞれ回転自在に配置され搬送される基板を支持
するための支持ローラである。
In FIG. 1, reference numeral 39 denotes a support for rotatably disposed on the upstream side of the first brush cleaning section 28 and on the downstream side of the second brush cleaning section 29 for supporting a substrate to be conveyed. Roller.

【0034】さらに、図1に示すように、各ブラシ洗浄
部28,29には、搬送される基板1の上面と下面に向
けて処理液を噴射するノズル体40が設けられている。
Further, as shown in FIG. 1, each of the brush cleaning units 28 and 29 is provided with a nozzle body 40 for spraying a processing liquid toward the upper surface and the lower surface of the substrate 1 to be conveyed.

【0035】このような構成の処理装置によれば、基板
1は搬送機構11の下部搬送ローラ14と上部搬送ロー
ラ18とによって上下面が挟持されて矢印A方向に搬送
される。そして、基板1は、第1のブラシ洗浄部28及
び第2の洗浄部29に入り込むときや送り出されるとき
に、下部洗浄ブラシ33と上部洗浄ブラシ34との回転
方向に応じて受ける回転力によって搬送速度が大きく変
動する虞がある。
According to the processing apparatus having such a configuration, the substrate 1 is transported in the direction of arrow A with the upper and lower surfaces sandwiched by the lower transport roller 14 and the upper transport roller 18 of the transport mechanism 11. The substrate 1 is transported by the rotational force received in accordance with the rotation direction of the lower cleaning brush 33 and the upper cleaning brush 34 when the substrate 1 enters the first brush cleaning unit 28 and the second cleaning unit 29 or is sent out. The speed may fluctuate greatly.

【0036】しかしながら、基板1を搬送する搬送機構
11は、下部搬送ローラ14と上部搬送ローラ18を有
し、上部搬送ローラ18は基板1の上面の幅方向全長に
わたって接触している。つまり、基板1は下部搬送ロー
ラ14の支持部15と、上部搬送ローラ18の一対のブ
ラシ部21,22によって幅方向全長が挟持されて搬送
される。基板1は幅方向全長が挟持されることで、十分
に大きな挟持力で挟持搬送されることになる。
However, the transport mechanism 11 for transporting the substrate 1 has the lower transport roller 14 and the upper transport roller 18, and the upper transport roller 18 is in contact with the entire upper surface of the substrate 1 in the width direction. That is, the substrate 1 is conveyed with the entire length in the width direction sandwiched between the support portion 15 of the lower conveyance roller 14 and the pair of brush portions 21 and 22 of the upper conveyance roller 18. The substrate 1 is nipped and conveyed with a sufficiently large nipping force because the entire length in the width direction is nipped.

【0037】したがって、基板1が第1、第2のブラシ
洗浄部28,29に入り込むときやこれらブラシ洗浄部
28,29から送り出されるときに、各ブラシ洗浄部2
8,29の洗浄ブラシ33,34からこれらの回転方向
に応じた力を受けても、支持部15とブラシ部21,2
2とによる挟持力によって基板1の搬送速度が大きく変
動するのが防止される。つまり、基板1はほぼ一定の搬
送速度でブラシ洗浄部28,29に送り込まれるととも
に、これらブラシ部28,29から送り出されるから、
各ブラシ部28,29での基板1の洗浄に洗浄むらが生
じるのを防止することができる。
Therefore, when the substrate 1 enters the first and second brush cleaning units 28 and 29 or is sent out from the brush cleaning units 28 and 29, each of the brush cleaning units 2
8 and 29, the support portion 15 and the brush portions 21 and
2 prevents the transfer speed of the substrate 1 from greatly changing due to the holding force caused by the pinching force. That is, the substrate 1 is sent to the brush cleaning units 28 and 29 at a substantially constant transport speed, and is sent out from the brush units 28 and 29.
It is possible to prevent unevenness in cleaning of the substrate 1 in each of the brush portions 28 and 29.

【0038】基板1を各ブラシ部28,29に送り込ん
だり、送り出される際に、基板1を一定の搬送速度で搬
送できるようにするための挟持力を得るため、上部搬送
ローラ18の一対のブラシ部21,22を基板1の幅方
向全長にわたって接触させるようにした。
When the substrate 1 is fed into and out of each of the brush portions 28 and 29, a pair of brushes of the upper transport roller 18 is used to obtain a pinching force for transporting the substrate 1 at a constant transport speed. The portions 21 and 22 are brought into contact over the entire length of the substrate 1 in the width direction.

【0039】そのため、基板1に対する単位長さ当たり
の接触力を大きくしなくとも、基板1全体としては大き
な挟持力(搬送力)を得ることができる。つまり、大き
な挟持力を得るために、基板1に局部的に大きな荷重を
加えずにすむから、基板1に割れや欠けが発生するのを
防止することもできる。
Therefore, a large clamping force (transport force) can be obtained for the entire substrate 1 without increasing the contact force per unit length with the substrate 1. That is, since a large load is not locally applied to the substrate 1 in order to obtain a large clamping force, it is possible to prevent the substrate 1 from being cracked or chipped.

【0040】上部搬送ローラ18に設けられた一対のブ
ラシ部21,22は逆向きの螺旋状であって、搬送され
る基板1と回転しながら接触することで、この基板1の
幅方向中心部から端部に向かう方向に回転する。
The pair of brush portions 21 and 22 provided on the upper conveying roller 18 are spirals in the opposite direction, and come into contact with the substrate 1 to be conveyed while rotating. Rotate in the direction from to the end.

【0041】そのため、塵埃が基板1の上面に付着して
いたり、基板1の上面からブラシ部21,22に転移し
たりしても、それらの塵埃は上部搬送ローラ18の一対
のブラシ部21,22の回転方向に沿って基板1の幅方
向両端部へ送り出されるから、基板1の上面に塵埃が付
着残留するのを防止することができるばかりか、基板1
を直進させることができる。
Therefore, even if dust adheres to the upper surface of the substrate 1 or transfers from the upper surface of the substrate 1 to the brush portions 21 and 22, the dust is transferred to the pair of brush portions 21 and Since the substrate 1 is sent to both ends in the width direction of the substrate 1 along the rotation direction of the substrate 22, it is possible to prevent dust from adhering and remaining on the upper surface of the substrate 1, and
Can go straight.

【0042】各ブラシ洗浄部28,29の一対の洗浄ブ
ラシ31,32は同じ回転方向(基板1の搬送方向に対
して逆方向)に回転駆動され、しかも一対の洗浄ブラシ
33,34間から基板1が搬出されると、これらのブラ
シ毛33a,34aが接触する間隔で配置されている。
The pair of cleaning brushes 31 and 32 of each of the brush cleaning units 28 and 29 are driven to rotate in the same rotation direction (the direction opposite to the direction in which the substrate 1 is transported). When 1 is carried out, these brush bristles 33a, 34a are arranged at intervals at which they come into contact.

【0043】そのため、一対の洗浄ブラシ33,34間
から基板1が搬送されると、互いの洗浄ブラシ33,3
4のブラシ毛33a,34aが擦れ合うから、これらの
ブラシ毛に付着した塵埃を効率よく除去するできる。
Therefore, when the substrate 1 is transported from between the pair of cleaning brushes 33 and 34, the cleaning brushes 33 and 3
Since the brush bristles 33a and 34a of the fourth brush rub against each other, dust adhering to these brush bristles can be efficiently removed.

【0044】図5にこの発明の第2の実施の形態、図6
にこの発明の第3の実施の形態を示す。これらの実施の
形態は処理部の変形例であって、第2の実施の形態の処
理部は、基板1の上下面に向けて高圧ノズル41によっ
て洗浄液を基板1の上下面に噴射するジェット洗浄部4
2であり、第3の実施の形態の処理部は一対のエアーナ
イフ43によって高圧エアーを噴射して基板1の上下面
の水切りを行う水切り部44である。
FIG. 5 shows a second embodiment of the present invention, and FIG.
FIG. 9 shows a third embodiment of the present invention. These embodiments are modifications of the processing unit. The processing unit according to the second embodiment is a jet cleaning in which the cleaning liquid is jetted toward the upper and lower surfaces of the substrate 1 by the high-pressure nozzle 41 toward the upper and lower surfaces. Part 4
The processing unit according to the third embodiment is a draining unit 44 that drains the upper and lower surfaces of the substrate 1 by injecting high-pressure air with a pair of air knives 43.

【0045】これらの処理部においても、搬送機構11
によって搬送される基板1がジェット洗浄部42から噴
射される洗浄液やエアーナイフ43から噴射される高圧
エアーの力を受けても、その搬送速度が大きく変動する
のを防止することができるから、基板1を均一に洗浄し
たり、乾燥するすることができる。
In these processing units, the transport mechanism 11
Even if the substrate 1 conveyed by the substrate receives the force of the cleaning liquid jetted from the jet cleaning unit 42 or the high-pressure air jetted from the air knife 43, the transfer speed of the substrate 1 can be prevented from greatly changing. 1 can be washed and dried uniformly.

【0046】また、上記第1の実施の形態では搬送機構
の上部搬送ローラに一対のブラシ部を設けて基板を下部
搬送ローラとで挟持するようにしたが、上部搬送ローラ
の上部駆動軸にはブラシ部に代わりロール状スポンジを
設けるようにしてもよく、要は基板を傷付けることなく
幅方向全長を挟持できる構成であればよい。
In the first embodiment, a pair of brushes is provided on the upper transport roller of the transport mechanism so that the substrate is sandwiched between the lower transport roller. Instead of the brush portion, a roll-shaped sponge may be provided, and the point is that any structure may be used as long as the entire length in the width direction can be clamped without damaging the substrate.

【0047】また、下部搬送ローラは円盤状の複数の支
持ローラを所定間隔で設けたが、円盤状の支持ローラに
代わり、基板の下面の幅方向全長にわたって接触するロ
ール状としてもよく、下部搬送ローラは上部搬送ローラ
から受ける押圧力によって基板が下方へ撓むのを防止で
きるればよい。
Although the lower transport roller has a plurality of disk-shaped support rollers provided at predetermined intervals, the lower transport roller may be in the form of a roll contacting the entire lower surface of the substrate in the width direction instead of the disk-shaped support roller. The roller only needs to be able to prevent the substrate from bending downward due to the pressing force received from the upper transport roller.

【0048】[0048]

【発明の効果】この発明によれば、上部搬送ローラを基
板の幅方向全長にわたって接触させるようにした。
According to the present invention, the upper conveying roller is brought into contact with the entire length of the substrate in the width direction.

【0049】そのため、基板に局部的な集中荷重を加え
ることなく下部反訴すローラと上部搬送ローラとによっ
て大きな接触抵抗が得られるため、基板の割れや欠けを
招くことなく、基板を上部搬送ローラと下部搬送ローラ
とで挟持して一定の搬送速度で搬送することができる。
As a result, a large contact resistance can be obtained by the lower repelling roller and the upper transport roller without applying a local concentrated load to the substrate, so that the substrate can be brought into contact with the upper transport roller without causing cracking or chipping of the substrate. The sheet can be conveyed at a constant conveying speed while being held between the lower conveying rollers.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明の第1の実施の形態を示す処理装置の
概略的構成を示す側面図。
FIG. 1 is a side view showing a schematic configuration of a processing apparatus according to a first embodiment of the present invention.

【図2】処理装置の第1のブラシ洗浄部を示す平面図。FIG. 2 is a plan view showing a first brush cleaning unit of the processing apparatus.

【図3】下部搬送ローラと上部搬送ローラとを示す正面
図。
FIG. 3 is a front view showing a lower transport roller and an upper transport roller.

【図4】ブラシ洗浄部を示す正面図。FIG. 4 is a front view showing a brush cleaning unit.

【図5】この発明の第2の実施の形態を示す処理部とし
てのジェット洗浄部を示す説明図。
FIG. 5 is an explanatory diagram showing a jet cleaning unit as a processing unit according to a second embodiment of the present invention.

【図6】この発明の第3の実施の啓太を示す処理部とし
ての水切り部を示す説明図。
FIG. 6 is an explanatory view showing a water draining unit as a processing unit showing Keita according to a third embodiment of the present invention.

【図7】従来の基板の搬送構造を示す説明図。FIG. 7 is an explanatory view showing a conventional substrate transport structure.

【符号の説明】[Explanation of symbols]

1…基板 11…搬送機構 14…下部搬送ローラ 18…上部搬送ローラ 21,22…ブラシ部 28…第1の洗浄ブラシ部 29…第2の洗浄ブラシ部 33…下部洗浄ブラシ 34…上部洗浄ブラシ DESCRIPTION OF SYMBOLS 1 ... Substrate 11 ... Transport mechanism 14 ... Lower transport roller 18 ... Upper transport roller 21, 22 ... Brush part 28 ... First cleaning brush part 29 ... Second cleaning brush part 33 ... Lower cleaning brush 34 ... Upper cleaning brush

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H01L 21/68 H01L 21/68 A Fターム(参考) 3B116 AA02 AB16 BA02 BA08 BA15 BB24 BB25 CC03 3F033 BA01 BB01 BC03 5F031 CA02 CA05 GA53 MA23 PA20──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01L 21/68 H01L 21/68 A F term (Reference) 3B116 AA02 AB16 BA02 BA08 BA15 BB24 BB25 CC03 3F033 BA01 BB01 BC03 5F031 CA02 CA05 GA53 MA23 PA20

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 基板を搬送する搬送機構と、この搬送機
構によって搬送される基板に所定の処理を行う処理部と
を具備し、 上記搬送機構は、基板の下面に接触する下部搬送ローラ
と、この下部搬送ローラと対向する位置に配置され基板
の上面の幅方向全長に接触して上記下部搬送ローラとで
上記基板を挟持搬送する上部搬送ローラとを有すること
を特徴とする基板の処理装置。
A transport mechanism configured to transport a substrate; and a processing unit configured to perform a predetermined process on the substrate transported by the transport mechanism. The transport mechanism includes a lower transport roller that contacts a lower surface of the substrate; An apparatus for processing a substrate, comprising: an upper transfer roller disposed at a position facing the lower transfer roller and in contact with the entire length of the upper surface of the substrate in the width direction to pinch and transfer the substrate with the lower transfer roller.
【請求項2】 上記下部搬送ローラと上部搬送ローラ
は、同じ周速度で回転駆動されることを特徴とする請求
項1記載の基板の処理装置。
2. The substrate processing apparatus according to claim 1, wherein the lower transport roller and the upper transport roller are driven to rotate at the same peripheral speed.
【請求項3】 上記上部搬送ローラは、軸方向中心部で
左右に分割された一対のブラシ部を有し、これらのブラ
シ部は上記基板との接触によって基板の幅方向中心部か
ら端部に向かう方向に回転する逆向きの螺旋状に設けら
れていることを特徴とする請求項1記載の基板の処理装
置。
3. The upper conveying roller has a pair of brush portions divided into right and left portions at a central portion in an axial direction, and these brush portions are moved from a central portion in a width direction of the substrate to an end portion by contact with the substrate. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is provided in a reverse spiral shape that rotates in a direction toward the substrate.
【請求項4】 上記処理部は、基板の上面と下面とをブ
ラシ洗浄するための下部洗浄ブラシと上部洗浄ブラシで
あって、これら洗浄ブラシの一方は基板の搬送方向に対
して逆方向に回転駆動されることを特徴とする請求項1
記載の基板の処理装置。
4. The processing section includes a lower cleaning brush and an upper cleaning brush for brush cleaning the upper and lower surfaces of the substrate, and one of the cleaning brushes rotates in a direction opposite to a transport direction of the substrate. 2. The apparatus according to claim 1, wherein the apparatus is driven.
A substrate processing apparatus according to any one of the preceding claims.
JP2000291047A 2000-09-25 2000-09-25 Substrate processing equipment Expired - Fee Related JP4838929B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000291047A JP4838929B2 (en) 2000-09-25 2000-09-25 Substrate processing equipment

Publications (2)

Publication Number Publication Date
JP2002096038A true JP2002096038A (en) 2002-04-02
JP4838929B2 JP4838929B2 (en) 2011-12-14

Family

ID=18774189

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
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JP2007194244A (en) * 2006-01-17 2007-08-02 Fujitsu Ltd Device and method for cleaning wafer
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JP2014030815A (en) * 2012-08-06 2014-02-20 Joybond Co Ltd Washing tool
WO2014192203A1 (en) * 2013-05-28 2014-12-04 株式会社ダイワ Cleaning brush for printed wiring board and cleaning machine using same
CN104828518A (en) * 2015-02-26 2015-08-12 友达光电股份有限公司 Substrate conveying device
JP2017177467A (en) * 2016-03-29 2017-10-05 日本碍子株式会社 Green sheet cleaning device
CN107931184A (en) * 2017-12-22 2018-04-20 无锡市创恒机械有限公司 A kind of plate body dust-extraction unit

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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1326757C (en) * 2003-07-11 2007-07-18 友达光电股份有限公司 Transport mechanism and wet type processing device thereof
US8496758B2 (en) 2006-01-17 2013-07-30 Fujitsu Semiconductor Limited Cleaning apparatus and cleaning method for wafer
JP2007194244A (en) * 2006-01-17 2007-08-02 Fujitsu Ltd Device and method for cleaning wafer
US7908698B2 (en) 2006-01-17 2011-03-22 Fujitsu Semiconductor Limited Cleaning apparatus and cleaning method for wafer
KR101257932B1 (en) * 2006-12-22 2013-04-24 엘지디스플레이 주식회사 Cleaning apparatus
JP2008184676A (en) * 2007-01-31 2008-08-14 Kowa Co Ltd Brush roll and cleaning device
JP2008273687A (en) * 2007-04-27 2008-11-13 Dainippon Printing Co Ltd Conveying device for flat plate-like base
US9016230B2 (en) 2009-05-13 2015-04-28 Atotech Deutschland Gmbh Method and assembly for treating a planar material to be treated and device for removing or holding off treatment liquid
JP2012527103A (en) * 2009-05-13 2012-11-01 アトテック・ドイチュラント・ゲーエムベーハー Method, processing station and assembly for processing planar workpieces
US9713265B2 (en) 2009-05-13 2017-07-18 Atotech Deutschland Gmbh Method, treatment station and assembly for treating a planar material to be treated
JP2014030815A (en) * 2012-08-06 2014-02-20 Joybond Co Ltd Washing tool
WO2014192203A1 (en) * 2013-05-28 2014-12-04 株式会社ダイワ Cleaning brush for printed wiring board and cleaning machine using same
JP2014231025A (en) * 2013-05-28 2014-12-11 株式会社ダイワ Cleaning brush for print circuit board, and cleaner using the same
KR20150005545A (en) * 2013-05-28 2015-01-14 가부시키가이샤 다이와 Cleaning brush for printed circuit board and cleaning device using it
KR101705862B1 (en) * 2013-05-28 2017-02-10 가부시키가이샤 다이와 Cleaning brush for printed circuit board and cleaning device using it
CN104828518A (en) * 2015-02-26 2015-08-12 友达光电股份有限公司 Substrate conveying device
JP2017177467A (en) * 2016-03-29 2017-10-05 日本碍子株式会社 Green sheet cleaning device
CN107931184A (en) * 2017-12-22 2018-04-20 无锡市创恒机械有限公司 A kind of plate body dust-extraction unit

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