200412261 玫、發明說明 (發明說明應敘明：發明所屬之技術領域、先前技術、內容、實施方式及圖式簡單說明） (一） 發明所屬之技術領域 本發明是關於一種洗淨裝置，詳言之，係關於一種用 於製造電路用基板之方法中，用於將經以處理液加以表面 處理過之基板材料用洗淨液加以洗淨的洗淨裝置。 (二） 先前技術 技術背景 隨著電子機器之高性能化、高功能化、小型輕量化， 其電路用基板也朝高精確度化、精巧化、極薄化方向邁進， 使得所形成的電路之高密度化、微小化非常顯著。並且在 此種基板之製程，則在各程序中對於輸送中之基板材料噴 射處理液，藉以對基板材料施加各種表面處理。 例如，一向是依序噴射顯影液-> 蝕刻液—剝離液等處 理液，藉以依序施加顯影—蝕刻-剝離等處理而形成電路。 另一方面一向是例如依序施加浸漬於非電解鍍銅液—噴射 顯影液—浸漬於電解鍍銅液—噴射剝離液等，藉以依序施 加化學式鍍銅—顯影-電鍍銅―剝離等處理而形成電路。 並且一向是噴射水洗液等洗淨液以作爲該等程序之事 後處理而實施洗淨處理。 如上所述，在基板之製程，例如最近之等離子體顯示 器用或液晶用玻璃基板之製程、或經封裝有半導體零組件 的模組基板之製程、以及其他之印刷配線基板之製程中， 200412261 則在其各程序爲了形成電路而經用酸性或鹼性處理液施加· 基板材料之表面處理後，實施使用洗淨液的洗淨處理以作 爲事後處理，藉以實行經表面處理後附著、殘留於基板材 料的處理液之洗淨除去工作。 並且如此之洗淨處理，對於如上所述電路之高密度化、· 微小化正在不斷地進展的此種基板而言，在其品質上之重 要性日益增加。 換句話說，若不能確實實施事後之洗淨處理，則將在 其後續程序發生障礙、造成氧化之原因，致有可能在半導 體零組件組配上招致障礙。 <以往之技術> 以往，如此之基板材料的洗淨處理，一向是使用洗淨 噴嘴與空氣噴嘴來進行。 換句話說，此種傳統洗淨處理一向是採取如下述步驟 即：邊以輸送機輸送基板材料下，—邊由前後左右相對配 置之眾多洗淨噴嘴，噴射水洗液或其他洗淨液，-而將基 板材料加以洗淨處理後，—由相對配置之空氣噴嘴噴射空 氣，θ藉以由基板材料上除去經由洗淨噴嘴噴射而滯留於 基板材料上之洗淨液。 欲解決之課題 <關於第一問題> 然而此種傳統洗淨裝置，一直有如下述問題爲人所詬 病0 200412261 第一’受到指摘之問題爲無法確實除去洗淨液。即經· 由洗淨噴嘴噴出之洗淨液，其大部分雖會一面洗淨基板一 面流向基板材料左右（與輸送方向成正交之寬度方向）後， 由左右側端流下而落下，但有一部分仍舊會滯留於基板上。 在藉由洗淨噴嘴之洗淨處理結束時，基板上仍然滯留 著厚度達數毫米左右之末流下的洗淨液，並且如此般滯留 之洗淨液’雖然寄望於後續程序之藉空氣噴嘴的空氣吹刮 來加以除去，但是以往其除去效果卻非確實。 按對於厚度達數毫米之洗淨液而言，僅靠空氣噴嘴的 吹刮，則因其沖力弱，所以仍難於除去其全部。 尤其在最近之玻璃基板有工件大小趨於大片化之傾向 下，洗淨液會在大的基板上滯留成廣大又厚的積水狀，使 得確實的除去更加有困難。加上也會發生因空氣吹刮而由 基板飛散飄浮之洗淨液，會再度附著於基板上之現象。 如此在已通過空氣噴嘴段之基板上，會有洗淨液之水 滴殘留，或起因於該水滴並隨著時間經過而發生斑點或污 點等情事。如此之水滴或斑點•污點等，必會在後續程序 中招致各種障礙，造成電路之氧化或侵蝕等原因，且對於 半導體零組件之裝配也會引起故障等各種電路事故。 如前所述，對於電路之高密度化、微小化正在急速進 展的此種基板而言’如此之事故發生，將造成品質上的致 命傷。 <關於第二之問題> 200412261 第二，在設備成本或維護方面，也有問題受到指摘。-即以往也採取將空氣噴嘴設成爲複數段，以作爲上述洗淨 液滯留現象之因應對策。 然因此種空氣噴嘴卻由於爲使空氣能均勻噴射而要求 非常高的精確度，以致價格貴到一支單價爲例如達幾拾萬 日元之鉅，因此如欲使用複數支空氣噴嘴，則在設備成本 方面大有問題。加上需要大容量空氣壓縮機等來配合供應 大量空氣，致使在動力成本、維護成本、運轉成本方面也 有問題受到指摘。 (三）發明內容 <關於本發明> 有鑑於此，本發明之洗淨裝置是爲解決上述傳統方式 之課題而經由本發明者專心致力於硏發結果所完成者。 其特徵爲在洗淨噴嘴與空氣噴嘴之間配置逆向噴嘴而 朝向上游側噴射洗淨液，藉以推回滯留於基板上的洗淨液 而構成者。 因此本發明之目的在於提供一種基板之製造工程用之 洗淨裝置，其係可由基板材料上確實除去洗淨液，及該洗 淨裝置是在設備成本或運轉成本方面優越且可付諸實務應 用的洗淨裝置。 ， [解決問題之技術方法] <關於各申請專利範圍請求項> 能解決如上所述課題的本發明之技術手段如下。首先 關於請求項1如下。請求項1之洗淨裝置，其特徵爲：是 一 9 一 200412261 用於基板之製程，且對於以輸送機輸送之基板材料依序設 有噴射洗淨液之洗淨噴嘴，向上游側噴射流體之逆向噴嘴， 以及噴射空氣之空氣噴嘴。 關於請求項2如下。請求項2之洗淨裝置，其特徵爲： 是在請求項1中用以使用洗淨液來洗淨爲了形成電路而，經 用處理液加以表面處理之該基板材料者。且自上游側向下 游側依序設有該洗淨噴嘴與該逆向噴嘴與該空氣噴嘴。 並且’該輸送機具有滾輪群或輪子群，用以以水平姿 勢輸送該基板材料。該洗淨噴嘴是相對於被輸送之該基板 材料，在前後左右相對配置有複數個，用以噴射水洗液或 其他洗淨液。 該逆向噴嘴是對於被輸送之該基板材料，向與輸送方 向相反之上游側傾斜而相對配置，用以噴射水洗液或其他 之洗淨液。該空氣噴嘴是對於被輸送之該基板材料相對而 配置。 關於請求項3如下。請求項3之洗淨裝置，其特徵爲： 在請求項3中該逆向噴嘴是對於被輸送之該基板材料以掩 蓋其全幅寬範圍之方式而配置，用以對該基板材料使洗淨 液向上游側斜成下降傾斜而噴射成幕狀。 並且藉如此之洗淨液噴射，即能發揮使經由該洗淨噴 嘴噴射而滯留於該基板材料上之洗淨液向上游側推回之功 能而使洗淨液由該基板材料之左右兩側端流下。 關於請求項4如下。請求項4之洗淨裝置，其特徵爲： 在請求項3中該空氣噴嘴是對於被輸送之該基板材料以掩 -1 0 ~ 200412261 蓋其全幅寬範圍之方式相對而配置，且由向左右之寬度方 向呈直線的縫隙狀噴嘴所構成，同時向上游側傾斜而相對 配置’用以對該基板材料使空氣向上游側傾斜而噴射成幕 狀。 並且藉如此之空氣噴射使經以該逆向噴嘴或因自然落 下而除去大部分所剩下之洗淨液，由該基板材料加以除去。 關於請求項5如下。該請求項5之洗淨裝置，其特徵 爲：在請求項4中該洗淨噴嘴是至少配置在被輸送之該基 板材料之上側，且介以配管連接於泵或液槽。該逆向噴嘴 是至少配置在被輸送之該基板材料之上側，且介以配管連 接於泵或液槽。該空氣噴嘴是至少配置在被輸送之該基板 材料之上側，且介以配管而連接於空氣源。 關於請求項6如下。請求項6之洗淨裝置，其特徵爲： 在請求項5中該洗淨裝置是用於等離子體顯示器用或液晶 用之玻璃基板、封裝有半導體零組件之模組基板、及其他 印刷配線基板之製程。 關於請求項7如下。請求項7之洗淨裝置，其特徵爲： 在請求項6中該洗淨裝置是用於處理程序之預先處理或事 後處理，用以除去在該基板材料所附著、殘留之處理液及 其他。 <關於作用> 本發明由於構成如上所述，具有如下列作用。 - 11 一 200412261 該洗淨裝置可用於等離子體顯示器或液晶用玻璃基. 板、或經封裝有半導體零組件之模組基板、及其他印刷配 線基板之製程。 並且基板材料是在例如顯影程序、蝕刻程序、剝離程 序等之前段程序中爲形成電路而用處理液受到表面處理。 然後基板材料將在事後處理用之洗淨裝置中，用洗淨 液加以洗淨、除去所附著、殘留之處理液。另外該洗淨裝 置不僅是可作爲如此之處理程序的事後處理用，也有作爲 處理程序之預先處理用而使用之情況，此種情況下，則爲 了準備處理程序，先用洗淨液將附著於基板材料之微小麈 埃、或其他加以洗淨、除去。 並且’基板材料是用輸送機以水平姿勢下輸送，並使 之依序通過洗淨噴嘴、逆向噴嘴、空氣噴嘴。 洗淨噴嘴是至少在基板材料之上側相對配置成複數 個，且連接於泵或液槽，用以對基板材料噴射水洗液或其 他洗淨液，而洗淨、除去所附著、殘留的處理液及其他。 此外由上側洗淨噴嘴噴射之洗淨液，經洗淨處理後， 其大部分是在基板材料上面流向左右而由左右側端落下。 與此相對，由下側洗淨噴嘴噴射之洗淨液，經洗淨處理後， 則幾乎是全部由基板材料下面自然落下。 逆向噴嘴是在基板材料上側向上游側傾斜而相對配 置’且連接於泵或液槽，用以對基板材料上面使洗淨液等 向上游側斜成下降傾斜而噴射成幕狀。 -12 - 200412261 按經由洗淨噴嘴噴射於基板材料上面之洗淨液，雖有， 部分會滯留於基板材料上面，但該洗淨液將藉經由如此之 逆向噴嘴所噴出之強沖力的洗淨液等，使其大部分向上游 側推回後，由基板材料之左右側端落下。 空氣噴嘴是由至少在基板材料上側，向上游側傾斜而 相對配置且由向寬度方向呈直線的縫隙狀噴嘴構成，同時 連接於空氣壓縮機等空氣源，用以對該基板材料使空氣向 上游側傾斜而噴射成幕狀。 基板材料之上面或下面，經藉逆向噴嘴或因自然落下 而只不過是只有少許洗淨液殘留成薄膜狀而已，惟藉來自 於如此之空氣噴嘴的空氣即能將之加以除盡。 該洗淨裝置，是在洗淨噴嘴與空氣噴嘴之間設有連接 於泵或液槽的逆向噴嘴之簡單結構所構成。 (四）實施方式 <關於圖式> 茲根據圖式所示發明之實施方式將本發明詳加說明如 下。第1圖、第2圖、第3圖是用以說明本發明之實施方 式。其中第1圖是側剖面說明圖。第2圖是平面說明圖。 第3圖之（1 )圖是孔狀嘴之底面說明圖、（2 )圖是縫隙狀噴 嘴之底面說明圖，（3 )圖是印刷配線基板（基板材料）之平面 說明圖。 <關於基板B> 該洗淨裝置1是供使用於電路A用的基板B之製程。 因此先就此種基板B之槪要說明如下（請參閱第3圖（B))。 200412261 電路A用之基板係廣泛被使用於各種電子機器用，其 型式有單面基板、雙面基板、多層基板（包括最近之沉積 (b u i 1 d - u p )法者）等各種。並且作爲如此基板B的一環而 也有出現使1C (積體電路）、LSI (大型積體電路）元件、 被動元件、驅動元件、電容器等半導體構件，與電路A搭 配成一體的模組基板（半導體封裝基板），或在玻璃基質與 電路A —起埋設有半導體構件之玻璃基板，即等離子體顯 示器PDP (等離子體顯示面板）用之玻璃基板，或液晶LCD 用玻璃基板，或晶片型封裝（CSP )，塑膠球型柵狀陣列基板 PBGA等。當然本案專利說明書中所提及基板B，除先前之 印刷配線基板外，也包含此種各基板。 按如此之電路A用之基板B，是隨著電子機器之高性 能化、高功能化、小型輕量化而不斷地往高精確度化、精 巧化、極薄化、多層化等前進，使得形成於外表面，即上 面•表面或下面•背面之單面或雙面之電路A，甚至於形成 於內部的電路A之高密度化、微小化非常顯著。 基板B例如印刷配線基板，其縱橫是由例如500毫米 X 500毫米左右構成，厚度是絕緣層部分爲1.0毫米〜60 微米，電路A部分爲7 5微米〜3 5微米，惟最近則已極薄 化至25微米〜1 0微米左右。多層基板之情形時，全體厚 度也正在極薄化至1.0毫米〜0.4毫米左右。電路A之線 條寬或電路A之線間寬爲35微米〜25微米左右，也有微 小化傾向。 基板B是槪略具有如上所述構成。 -1 4 一 200412261 <關於基板B之製造方法實例>200412261 Description of the invention (The description of the invention should state: the technical field to which the invention belongs, the prior art, the content, the embodiments, and the drawings briefly explain) (1) the technical field to which the invention belongs The present invention relates to a cleaning device, details In other words, it relates to a cleaning device for cleaning a substrate material that has been surface-treated with a treatment liquid in a method for manufacturing a circuit substrate, and is used for cleaning. (II) Prior technical background With the high performance, high functionality, small size and light weight of electronic devices, the circuit substrates have also moved towards high precision, compactness, and ultra-thinness. High density and miniaturization are very remarkable. And in this substrate manufacturing process, the substrate liquid is sprayed with a processing liquid in each procedure to apply various surface treatments to the substrate material. For example, a processing solution such as a developing solution-> etching solution-stripping solution is sequentially ejected, and processing such as developing-etching-stripping is sequentially applied to form a circuit. On the other hand, for example, a sequential application of immersion in non-electrolytic copper plating solution—jet developing solution—immersion in electrolytic copper plating solution—jet peeling solution, etc. has been sequentially applied. Form a circuit. In addition, washing liquid such as water washing liquid is sprayed for post-processing of such procedures, and the washing treatment is performed. As mentioned above, in the manufacturing process of substrates, such as the recent manufacturing process of glass substrates for plasma displays or liquid crystals, the manufacturing process of module substrates packaged with semiconductor components, and other manufacturing processes of printed wiring boards, 200412261 After each procedure is applied to form a circuit, the surface of the substrate material is applied with an acidic or alkaline treatment solution, and then a cleaning treatment using a cleaning solution is performed as an after-treatment to adhere and remain on the substrate after surface treatment Cleaning and removal of material treatment liquid. In addition, such a cleaning process is increasingly important in terms of quality for such substrates where the density and miniaturization of circuits are continuously progressing as described above. In other words, if the subsequent cleaning treatment cannot be carried out, it will cause obstacles in the subsequent procedures and cause oxidation, which may cause obstacles in the assembly of semiconductor components. < Conventional technology > Conventionally, such a substrate material cleaning process has been performed using a cleaning nozzle and an air nozzle. In other words, this traditional cleaning process has always taken the following steps: while conveying the substrate material by a conveyor,-while spraying water washing liquid or other washing liquid, from a large number of washing nozzles arranged front to back and left to right,- After the substrate material is cleaned, air is sprayed from the oppositely disposed air nozzles, and θ is removed from the substrate material by the cleaning liquid sprayed through the cleaning nozzles and retained on the substrate material. Problems to be solved < About the first problem > However, such a conventional cleaning device has been criticized as follows: 0 200412261 The first problem of being criticized is that the cleaning solution cannot be removed reliably. That is, most of the cleaning liquid sprayed from the cleaning nozzle flows to the left and right of the substrate material while washing the substrate (the width direction orthogonal to the conveying direction), and then flows down from the left and right ends to fall. A part will still stay on the substrate. At the end of the cleaning process by the cleaning nozzle, the cleaning liquid flowing down at the end of the thickness of about several millimeters is still retained on the substrate, and the cleaning liquid retained in this way is expected to be borrowed from the air nozzle in the subsequent process. The air is blown to remove it, but its removal effect has not been reliable in the past. For a cleaning liquid having a thickness of several millimeters, it is difficult to remove all of the cleaning liquid due to its weak impulse due to its weak impulse. Especially in recent glass substrates, the size of the workpiece tends to become large, and the cleaning solution will stay on the large substrate into a large and thick stagnant water, which makes it more difficult to remove it reliably. In addition, the floating cleaning liquid scattered from the substrate due to air blowing may reattach to the substrate. In this way, on the substrate that has passed through the air nozzle section, water droplets of the cleaning solution may remain, or due to the water droplets, spots or stains may occur over time. Such water droplets, spots, and stains will inevitably cause various obstacles in the subsequent procedures, causing reasons such as oxidation or erosion of the circuit, and the assembly of semiconductor components will also cause various circuit accidents such as failure. As described above, for such a substrate where the density and miniaturization of the circuit are rapidly progressing, such an accident will cause a fatal injury in quality. < Question about the second issue > 200412261 Second, there are also problems with equipment costs or maintenance. -In the past, multiple air nozzles have been adopted as a countermeasure against the above-mentioned washing liquid retention phenomenon. However, this type of air nozzle requires very high accuracy in order to make the air spray uniformly, so that the price is as expensive as a unit price of hundreds of thousands of yen, so if you want to use multiple air nozzles, There are major problems in terms of equipment costs. In addition, the need for large-capacity air compressors to supply a large amount of air has led to criticism of problems in power costs, maintenance costs, and operating costs. (3) Contents of the invention < About the present invention > In view of this, the cleaning device of the present invention was completed by the present inventor's dedication to disseminating the results in order to solve the above-mentioned problems of the conventional method. It is characterized in that a reverse nozzle is arranged between the cleaning nozzle and the air nozzle, and the cleaning liquid is sprayed toward the upstream side, and the cleaning liquid retained on the substrate is pushed back to form the structure. Therefore, the object of the present invention is to provide a cleaning device for substrate manufacturing process, which can remove the cleaning liquid from the substrate material, and the cleaning device is superior in equipment cost or running cost and can be put into practical use. Washing device. [Technical method for solving the problem] < About each patent application scope claim item > The technical means of the present invention which can solve the problems described above are as follows. First, about item 1 is as follows. The cleaning device of claim 1 is characterized in that it is a 9-200412261 for the substrate manufacturing process, and a cleaning nozzle for sequentially spraying a cleaning liquid is provided for the substrate material conveyed by the conveyor, and the fluid is sprayed to the upstream side. Reverse nozzles, and air nozzles that spray air. The request item 2 is as follows. The cleaning device of claim 2 is characterized in that it is used in claim 1 to use a cleaning liquid to clean the substrate material that has been surface-treated with a processing liquid in order to form a circuit. The cleaning nozzle, the reverse nozzle, and the air nozzle are provided in this order from the upstream side to the downstream side. And 'the conveyor has a roller group or a wheel group for conveying the substrate material in a horizontal posture. The cleaning nozzles are oppositely disposed with respect to the substrate material to be conveyed, and are arranged in front, rear, left, and right to spray water washing liquid or other washing liquid. The reverse nozzle is arranged opposite to the conveyed direction of the substrate material at an upstream side opposite to the conveying direction, and is used to spray water washing liquid or other cleaning liquid. The air nozzle is disposed so as to face the substrate material to be conveyed. Request item 3 is as follows. The cleaning device of claim 3 is characterized in that: in the claim 3, the reverse nozzle is arranged for the substrate material to be conveyed so as to cover the entire width range of the substrate material, and is used for upwardly cleaning the substrate material. The swimming side is inclined downward and sprayed into a curtain shape. And by spraying such a cleaning liquid, it is possible to exert the function of pushing the cleaning liquid that is retained on the substrate material sprayed through the cleaning nozzle to the upstream side to push the cleaning liquid from the left and right sides of the substrate material. Shed. Request item 4 is as follows. The cleaning device of claim 4 is characterized in that: in claim 3, the air nozzle is arranged opposite to the substrate material to be conveyed so as to cover the entire width range of -10 to 200412261, and is shifted from left to right A slit-shaped nozzle with a straight line in the width direction is arranged at the same time and is inclined toward the upstream side and is relatively disposed. It is used to incline the substrate material toward the upstream side and spray it into a curtain shape. And by such an air jet, most of the remaining cleaning liquid is removed by the reverse nozzle or due to natural fall, and is removed by the substrate material. Request item 5 is as follows. The cleaning device of claim 5 is characterized in that, in claim 4, the cleaning nozzle is arranged at least on the upper side of the substrate material being conveyed, and is connected to a pump or a liquid tank via a pipe. The reverse nozzle is arranged at least on the upper side of the substrate material being conveyed, and is connected to a pump or a liquid tank via a pipe. The air nozzle is arranged at least above the substrate material being conveyed, and is connected to an air source via a pipe. Request item 6 is as follows. The cleaning device of claim 6 is characterized in that the cleaning device of claim 5 is a glass substrate for a plasma display or a liquid crystal, a module substrate encapsulating a semiconductor component, and other printed wiring substrates. The process. Request item 7 is as follows. The cleaning device of claim 7 is characterized in that: the cleaning device of claim 6 is used for pre-processing or post-processing of a processing program for removing the processing liquid and other residues attached to the substrate material. < Regarding effects > Since the present invention is constituted as described above, it has the following effects. -11-200412261 The cleaning device can be used in the manufacturing process of glass substrates for plasma displays or liquid crystals, or module substrates packaged with semiconductor components, and other printed wiring substrates. In addition, the substrate material is subjected to a surface treatment with a treatment liquid in order to form a circuit in a preceding process such as a development process, an etching process, and a peeling process. The substrate material is then cleaned in a cleaning device for post-processing with a cleaning solution to remove the attached and remaining processing solution. In addition, the cleaning device can be used not only for the post-processing of such a processing program, but also for the pre-processing of the processing program. In this case, in order to prepare the processing program, the cleaning solution will be attached to the Clean and remove the tiny angstroms of the substrate material or others. The substrate material is conveyed in a horizontal posture by a conveyor, and is sequentially passed through a cleaning nozzle, a reverse nozzle, and an air nozzle. The cleaning nozzles are arranged opposite to each other at least on the upper side of the substrate material, and are connected to a pump or a liquid tank, and are used for spraying water or other cleaning liquid on the substrate material to wash and remove the attached and remaining processing liquid. and others. In addition, after the cleaning liquid sprayed from the upper cleaning nozzle is subjected to the cleaning process, most of the cleaning liquid flows on the substrate material to the left and right and falls from the left and right side ends. In contrast, almost all of the cleaning liquid sprayed from the lower cleaning nozzle is naturally dropped from the bottom of the substrate material after the cleaning process. The reverse nozzle is relatively disposed on the substrate material and is inclined toward the upstream side, and is connected to a pump or a liquid tank. The reverse nozzle is used to incline the cleaning material and the like on the substrate material toward the upstream side to descend and incline into a curtain shape. -12-200412261 According to the cleaning liquid sprayed on the substrate material through the cleaning nozzle, although some of it will stay on the substrate material, the cleaning liquid will be cleaned by the strong impulse sprayed by such a reverse nozzle After the liquid is pushed back most of the way to the upstream side, it falls from the left and right side ends of the substrate material. The air nozzle is a slit-shaped nozzle that is arranged opposite to at least the upper side of the substrate material and is inclined toward the upstream side and is linear in the width direction. The air nozzle is also connected to an air source such as an air compressor and is used to make the substrate material air upstream. Slanted and sprayed into a curtain shape. Above or below the substrate material, only a small amount of cleaning solution remains in a thin film through the reverse nozzle or due to natural fall, but it can be removed by the air from such an air nozzle. The cleaning device has a simple structure in which a reverse nozzle connected to a pump or a liquid tank is provided between the cleaning nozzle and the air nozzle. (IV) Embodiments < About drawings > The present invention will be described in detail below based on the embodiments of the invention shown in the drawings. Figures 1, 2 and 3 are diagrams illustrating the embodiments of the present invention. FIG. 1 is a side sectional explanatory view. Fig. 2 is a plan explanatory view. (1) of FIG. 3 is an explanatory diagram of a bottom surface of a hole-shaped nozzle, (2) is an explanatory diagram of a bottom surface of a slit-shaped nozzle, and (3) is a plan explanatory diagram of a printed wiring board (substrate material). < About substrate B > The cleaning device 1 is a process for producing a substrate B for use in a circuit A. Therefore, the description of the substrate B is as follows (see Fig. 3 (B)). 200412261 Substrates for Circuit A are widely used in various electronic equipment. The types include single-sided substrates, double-sided substrates, and multi-layer substrates (including the recent deposition method (b u i 1 d-u p)). In addition, as a part of such a substrate B, there is also a module substrate (semiconductor) that integrates semiconductor components such as 1C (Integrated Circuit), LSI (Large Integrated Circuit), passive components, drive components, and capacitors with Circuit A. Package substrate), or a glass substrate embedded with semiconductor components in the glass substrate and circuit A, that is, a glass substrate for a plasma display PDP (plasma display panel), a glass substrate for a liquid crystal LCD, or a chip-type package (CSP ), Plastic ball grid array substrate PBGA, etc. Of course, the substrate B mentioned in the patent specification of this case includes such substrates in addition to the previous printed wiring substrate. According to such a substrate A for the circuit A, with the high performance, high functionality, small size and light weight of the electronic device, it is continuously progressing to high precision, compactness, ultra-thinning, multilayering, etc., so that On the outer surface, that is, the single-sided or double-sided circuit A on the upper surface, the lower surface, or the lower surface, and even the circuit A formed on the inside, the density and miniaturization are very significant. The substrate B is, for example, a printed wiring board. Its length and width are, for example, about 500 mm x 500 mm. The thickness is 1.0 mm to 60 μm in the insulating layer portion, and 75 μm to 35 μm in the circuit A portion. However, it has been extremely thin recently. To 25 microns to 10 microns. In the case of a multilayer substrate, the overall thickness is also extremely thin to about 1.0 mm to 0.4 mm. The line width of the circuit A or the line width of the circuit A is about 35 μm to 25 μm, and there is also a tendency to miniaturize. The substrate B has a structure as described above. -1 4-200412261 < Example of manufacturing method of substrate B >
« S 接著就使用該洗淨裝置1的基板B之製造方法說明如 下。首先就其第一實例之製造方法加以說明。在第一窨例 製造方法中，基板B之第一實例的印刷配線基板是經過下 述過程而製造。 首先準備襯銅疊層板之基板材料C，該襯銅疊層板是 在樹脂、玻璃布或陶瓷製之絕緣層（芯材料）外表面，以 熱壓接機等貼上銅箔而成者。然後以雷射等方法實施通孔 (throughhole)用之穿孔加工。 鲁 通孔是由基板材料C (基板B )之兩外表面間之穿通孔 構成，每一片形成有數百個以上之屬極小徑者，其徑是以 0.5亳米〜0.2毫米左右以下者爲多。通孔是供連接兩外表 面間或多層基板之電路A間之用，或供安裝於電路a的零 組件之裝配用。 按最近也開發出 NMBI [Neo-Manhattan Bump Interconnection(尼爾-曼哈頓（音譯）焊墊內連接）]法。該 @ NMBI是一種替代通孔而使用小突起狀的焊墊（bump)，而以 無須穿孔加工方式藉由焊墊來實現與通孔同等功能之技術。 然後在基板材料C之銅箱外表面（上面•表面、下面· 背面中之單面或雙面），以膜狀將光敏抗蝕劑塗敷或貼付在 一起。接著放上描繪有電路A之負片的電路照片，經由曝 光，使外表面之光敏抗鈾劑留下被曝光而硬化的電路A形 成部分，其他之不需要部分則以噴射顯影液而予以溶解除 去。 -15 - 200412261 接著如此之基板材料c的銅箔，會留下爲光敏抗蝕劑· 經硬化所被覆之電路A形成部分，光敏抗蝕劑經顯影處理 而被溶解除去之不需要部分則藉噴射蝕刻液（氯化銅（Π )、 氧化鐵（m ))之溶解除去作用來加以蝕刻。 接著所殘留之電路a形成部分，則藉噴射剝離液來加 以剝離除去，俾由剩下之電路A形成部分的銅箔，在基板 材料C之外表面（上面•表面、下面•背面之單面或雙面） 形成預定之電路A，如此便可製得基板B，即印刷配線基板。 並且在上述顯影程序、蝕刻程序、剝離程序，爲了各 自之事後處理用、或剝離程序後匯集作事後處理用，附設 有用以噴射水洗液、中和劑液及其他洗淨噴嘴之洗淨程序， 俾以洗淨除去附著於基板材料C外表面之顯影液、鈾刻液、 剝離液等處理液。第一實例之製造方法是由如此之濕式法 構成。 第一實例之製造方法是如上所述。 接著就第二實例之製造方法說明如下。基板B之一實 例的印刷配線基板之製造方法，是以上述第一實例之濕式 法爲其主流’但第二實例之半附加法也正在受到大多數的 使用。 該半附加法是首先在預先形成有通孔之基板材料C的 外表面（上面•表面、下面•背面中之單面或雙面）形成 非電解鍍銅膜。—然後以膜狀將光敏抗蝕劑塗敷或貼付在 該非電解鍍銅膜後，^放上描繪有電路A之負片的電路照 片，進行曝光。—因而光敏抗鈾劑就留下被曝光而硬化的 - 16 - 200412261 部分，其他部分’即電路A形成部分則藉噴射顯影液而予· 以溶解除去。 然後—對於電路A形成部分，即光敏抗蝕劑藉顯影處 理而被溶解除去的電鍍膜圖案部分，亦即非電解鍍銅膜露 出的部分，施加電解鍍銅，藉以形成電路A。 另外己硬化的電路A形成部分以外之剩下的光敏抗倉虫 劑，將藉噴射剝離液而加以剝膜除去，—露出的非電解鍍 銅膜就藉蝕刻液之噴射，受到快速鈾刻而被融解除去。— 此外按照前述方式也附加有洗淨程序以作爲各程序之事後 處理用。 第二實例之半附加法是以如此方式藉電解鍍銅形成電 路A，藉以製造基板B，即印刷配線基板。第二實例是構成 爲如上所述。 然而印刷配線基板之製造方法及其他電路A用之基板 B之製造方法，最近正在日益更趨於多樣化，除上述第一 實例、第二實例外，也有曾硏發出各種方法而使用。本發 明當然也能適用於如此之各種印刷配線基板及其他基板B 之製造方法。 基板B之製造方法是如上所述構成。 <關於洗淨裝置1之槪要> 以下參照第1圖至第3圖就洗淨裝置1說明如下。該 洗淨裝置1是在上述基板B之製程，用以爲了形成電路A 而經用處理液D施加表面處理之基板材料C，用洗淨液加 以洗淨。 - 17- 200412261 例如用以顯影處理程序、蝕刻程序、剝膜程序之事後 處理，即用以除去經施加屬前段程序的上述各程序之電路 A形成用表面處理之後，附著、殘留於基板材料C之顯影 液、鈾刻液、剝離液等處理液D。 第1圖中2爲此種前段程序之處理室2，3爲用以對基 板材料C噴射處理液D之噴嘴，4爲處理液D之液槽。基 板材料C是藉使用滾輪5之輸送機6，邊以水平姿勢被輸 送下，如依圖示例則邊由在上下相對配置的噴嘴3噴射處 理液D而實施表面處理。 並且洗淨裝置1，如依圖示例則具有自輸送方向之上 游側依序向下游側配置之三間洗淨室7與一間空氣室8。 各洗淨室7分別配置有洗淨噴嘴9 。另在最後端之洗 淨室7，在緊接著其最後段洗淨噴嘴9之處，配置有逆向 噴嘴1 0。在空氣室8則配置有空氣噴嘴1 1。洗淨噴嘴9或 逆向噴嘴1 〇，與空氣噴嘴1 1是以如此方式而配置在個別 之室。 如此，該洗淨裝置1是自輸送方向F上游側向下游側 依序設有用以對經爲輸送機6所輸送之該基板材料C，噴 射洗淨液E之洗淨噴嘴9，向上游側噴洗淨液E等流體之 逆向噴嘴1 0，以及噴射空氣G之空氣噴嘴1 1。 洗淨裝置1是槪略具有如上所述構成。 <關於輸送機6> - 1 8 - 200412261 茲就輸送機6配合第1圖說明如下。輸送機6具有如， 圖示例之滾輪5群，或輪子群，可以水平姿勢下輸送基板 材料C。 換句話說，洗淨裝置1之輸送機6，如依圖示例則是 使被旋轉驅動之滾輪5沿前後輸送方向F排設複數個而成 者。並且該輸送機6是自前段程序之處理室2起經過洗淨 裝置1之各洗淨室7，及空氣室8，並朝向由後段程序之爐 等構成之乾燥室1 2而連續排列者。基板材料C是載放在如 此之輸送機6的滾輪5上，沿輸送方向F以水平姿勢可由 上游側向下游側而移動。輸送機6是構成爲如上所述。 <關於洗淨噴嘴9> 接著參照第1圖、第2圖，就洗淨噴嘴9說明如下。 該洗淨裝置1之洗淨噴嘴9，是至少配置於被輸送之基板 材料C的上側，且介以配管1 3而連接於泵或液槽i 4。並 且洗淨噴嘴9是對於被輸送之該基板材料c，在前後左右 相對配置有複數個’用以噴射水洗液或其他之洗淨液。 關於此種洗淨噴嘴9更詳加說明如下。在各洗淨室7 內則對於基板材料C在隔著特定的上下間隔下，如依圖示 例則在雙面基板用基板材料C之上下兩側配置有噴管1 5。 在各洗淨室7中’噴管1 5是以對於被輸送之該基板材料^ 以掩盖其全1P田寬圍之方式沿左右寬度方向Η而配置，且 有複數支在前後輸送方向F隔著前後間隔下配置成複數 段。 一 19- 200412261 並且對於如此之各噴管1 5，在對於基板材料C的相對· 面（上面或下面）之正上方或正下方，以在寬度方向Η隔 著特定間隔下設有洗淨噴嘴9。 另外洗淨噴嘴9是使用如第2圖或第3圖之（1 )圖所示 之圖示例般對於噴管1 5朝寬度方向Η而排設的複數個吹出 孔型者’或不依照此種圖示例而如第3圖之（2 )圖所示般對 於噴管1 5朝寬度方向Η設成爲直線狀之單條縫隙狀型者。 洗淨液Ε是按每一洗淨室7，經由配管1 3向噴管1 5 壓送後，—由各噴管15之洗淨噴嘴9向以水平姿勢下輸送 過來之基板材料C噴射。 經噴射之洗淨液Ε則在基板材料C之外表面（上面· 表面或下面•背面），向右方向或左方向的寬度方向Η流動 後，—由左右兩側之兩側端流下而落下，—並流入下部之 液槽1 4，以加以回收。-> 經回收於液槽1 4之洗淨液Ε則加 以儲存，同時事後即以泵壓送至配管1 3，—而再循環使 用。 洗淨液Ε主要是使用水洗液，但使用摻有中和劑或其 他藥液的洗淨液Ε之情形也多。 洗淨噴嘴9是具有如上所述構成。 <關於逆向噴嘴10> 茲就逆向噴嘴10配合第1圖及第2圖說明如下。該洗 淨裝置1之逆向噴嘴1 〇，是相對於被輸送之基板材料C而 配置於上側，且向與輸送方向相反之上游側，斜成下降傾 斜而相對配置，同時介以配管1 6而連接於液槽1 4，用以 - 20- 200412261 噴射水洗液或其他洗淨液E。逆向噴嘴10是以掩蓋其全幅 寬範圍之方式而配置，且由向左右之寬度方向呈直線的縫 隙狀噴嘴構成，用以對基板材料c以向上游側斜成下降傾 斜下使洗淨液E噴射成幕狀。另外也可構成爲替代縫隙狀 噴嘴而使用所謂的扁平嘴者。 因此，藉如此之噴射洗淨液E，即能發揮使經該洗淨 噴嘴噴射而滯留於該基板材料上之洗淨液向上游側推回之 功能而使洗淨液E由該基板材料之左右兩側端流下。 關於如此之逆向噴嘴1 0更詳加說明如下。在最後端洗 淨室7之最後段洗淨噴嘴9之後，則以在隔著前後間隔下， 如依圖示例之情況則配置有一支液管（a q U a p i p e ) 1 7。 該液管1 7是在基板材料C之上側隔著特定的上下間隔 而配置，且以掩蓋基板材料C的全幅寬範圍之方式而沿左 右寬度方向Η而設置。 並且對於如此之液管1 7，如第2圖及第3圖之（2 )圖 所示，在寬度方向Η設有呈直線的一條縫隙狀噴嘴以作爲 逆向噴嘴1 0。此逆向噴嘴1 〇是向上游側例如由水平面朝 下方傾斜例如4 5度等而相對配置在基板材料c上側。 因此洗淨液E經由配管1 6壓送至液管1 7後，—即可 由液管17之逆向噴嘴10由斜向上方而向以水平姿勢下輸 送過來之該基板材料C，噴射成扁平的幕狀。 —並且經如此所噴射之洗淨液E，能使滯留於基板材料 C上之洗淨液E向上游側推回，—並與推回之洗淨液£ 一起 -21- 200412261 在基板上向左右寬度方向Η流動，—由左右兩側之兩側端· 流下而落，—且回收於下部之液槽1 4。 -經回收於液槽1 4之洗淨液Ε則與由上述洗淨噴嘴9 噴射、流下、回收之洗淨液Ε —起加以儲存，但往後仍經 由泵壓送至配管1 6，—而循環使用。 關於洗淨液Ε，則請參照曾就洗淨噴嘴9所陳述之節 段。 此外，逆向噴嘴1 0如依圖示例則使用縫隙狀型，惟不按照 該型而也可使用如第3圖之（1 )圖所示般，對於液管1 7在 寬度方向Η排設有眾多吹出孔之型式。當然此種吹出孔型 也可與縫隙狀型者同樣地向上游側斜成下降傾斜而配置。 另外由逆向噴嘴1 0，如依圖示例則將噴射供循環使用 的水洗液或其他洗淨液Ε，但不按照此方式而也可採取以 經由水系統供應之水洗液作爲洗淨液Ε而使用，使用後則 予以排水而作廢液處分之方式。另也可構成爲能噴射空氣 之方式。關於空氣之噴射方式可參照下述有關空氣噴嘴11 之節段。 逆向噴嘴1 0是構成爲如上所述。 <關於空氣噴嘴11> 茲就空氣噴嘴1 1配合第1圖及第2圖說明如下。該洗 淨裝置1之空氣噴嘴1 1是對於被輸送之該基板材料，至少 在上側相對配置且介以配管1 8連接於空氣壓縮機等空氣 源，用以噴射空氣G而吹刮。 -22 - 200412261 空氣噴嘴1 1是對於被輸送之該基板材料，以掩蓋其全， 幅寬範圍之方式而配置，由在左右寬度方向Η呈直線的縫 隙狀噴嘴構成，且向上游側傾斜而相對配置，用以對基板 材料C使空氣G向上游側傾斜而噴射成幕狀。 並且藉如此之空氣G的噴射使經由該逆向噴嘴或因自 然落下而除去大部分後所剩下之洗淨液，由該基板材料C 除去。 茲就如此之空氣噴嘴1 1更詳加說明如下。本該洗淨裝 置1則在緊接著最後端之洗淨室7，附設有空氣室8，且如 依圖不例則配置有一支風管1 9。 該風管1 9是在對於基板材料C隔著特定的上下間隔 下，如依圖示例則配置於雙面基板用之基板材料C上下兩 側，且以掩蓋基板材料C的全幅寬範圍之方式而沿左右寬 度方向Η而設置。另圖示例是配置有上下各一支，但是當 然也可配置成各有複數支。 並且對於如此之兩風管1 9，如第2圖、.第3圖之（2 ) 圖等所示，分別設有在寬度方向Η呈直線的一條縫隙狀噴. 嘴以作爲空氣噴嘴1 1。 上側之空氣噴嘴1 1是向上游側例如以自水平面4 5度 等向下斜成下降傾斜而相對配置於基板材料C之上側。下 側之空氣噴嘴1 1則向上游側例如以自水平面45度等向上 斜成上升傾斜而相對配置於基板材料C之下側。 空氣G是由空氣壓縮機、鼓風机、空氣栗、風扇、其 他之空氣源（未圖示），—經由配管1 8壓送至風管1 9後， - 23- 200412261 -由風管19之空氣噴嘴11向以水平姿勢輸送過來之該基 板材料C，如依圖示例則由斜上方與斜下方之上下，噴射 成扁平的幕狀而加以吹刮。 —因此經如此般噴射之空氣G，能除去滯留於基板材料 C之上面或下面之洗淨液E。—按經如此般噴射之空氣g， 若滯留於基板材料C之洗淨液E厚度多達數毫米左右時， 其除去效果有限，—但僅滯留極少量時，則可有效率地加 以除去。尤其是空氣G在使用加熱空氣時，即可有效地加 以除去。 空氣噴嘴1 1，如依圖示例是使用縫隙狀型者，但不按 照此而如第3圖之（1 )圖般使用風管1 9爲在寬度方向Η排 設有眾多吹出孔之型式。當然如此之吹出孔型也與縫隙狀 型同樣地應使之向上游側傾斜而配置。 空氣噴嘴1 1構成爲如上所述。 <關於作用> 本發明是構成爲如上所述。因此具有如下列作用。 該洗淨裝置1可用於基板Β之製程。即等離子體顯示 器用玻璃基板，液晶用玻璃基板、經封裝有半導體零組件 之模組基板、及其他印刷配線基板之製程。 並且其基板材料C是先在前段程序爲了形成電路而用 酸性或鹼性處理液加以表面處理。例如在顯影程序、餓刻 程序、剝離程序等中，對基板材料c噴射處理液D，而加 以表面處理（請參閱第1圖）。 -24 - 200412261 然後基板材料c將被輸往洗淨裝置1，俾爲事後處理 而貝施洗淨處理、藉以使經前段程序之表面處理後所附著、 殘留之處理液D用洗淨液E加以洗淨、除去。 換句g舌g兌，基板材料c是在洗淨裝置1中藉由具有滾 輪群5或輪子群之輸送機6，以水平姿勢下邊自上游側向 下游側沿輸送方向F輸送邊依序通過其次之洗淨噴嘴9、 逆向噴嘴1 0、空氣噴嘴1 1 (請參閱第丨圖）。 首先洗淨噴嘴9將對於基板材料c噴射洗淨液e (請 參閱第1圖及第2圖）。 即洗淨噴嘴9是至少配置於被輸送之基板材料c之上 側（在圖示例是上側與下側），且介以噴管1 5或泵連接於 液槽1 4。 並且洗淨噴嘴9是在基板材料c之前後左右相對配置 配有複數個’用以對基板材料噴射水洗液或其他洗淨液， 藉以洗淨、除去所附著、殘留的處理液D。 此外由上側洗淨噴嘴9噴射之洗淨液E，則將基板材 料C上面加以洗淨處理，同時其大部分則在基板材料c上 面流向左右（與輸送方向成正交之寬度方向H)後，由左 右側端流下、落下而回收。與此相對，由下側洗淨噴嘴9 噴射之洗淨液E ’則將基板材料^下面加以洗淨處理後， 幾乎是全部會由基板材料C下面藉重力自然落下而回收。 接著逆向噴嘴1 〇將對基板材料C噴射洗淨液E等流體 (請參閱第1圖及第2圖）。 200412261 即逆向噴嘴1 0是配置於被輸送之該基板材料c上側， 且由以掩蓋基板材料C的全幅寬範圍之方式而在左右寬度 方向Η呈直線的縫隙狀噴嘴構成。 並且向與輸送方向F逆向之上游側傾斜而相對配置， 且介以液管1 7或配管1 6連接於泵或液槽1 4。 因此逆向噴嘴1 0可對於被輸送之該基板材料C上面， 使水洗液或其他洗淨液Ε向上游側斜成下降傾斜而噴射成 幕狀。 藉來自於如此之逆向噴嘴1 0之洗淨液Ε等之噴射，即 可使前由洗淨噴嘴9噴射而滯留於基本上上面之洗淨液Ε， 向上游側推回。 即經由洗淨噴嘴9噴射於基板材料C上面之洗淨液Ε， 雖如上所述大部分會由基板材料C之左右側端流下、落下、 而被回收，但仍有部分會以數亳米左右之厚度而滯留於基 板材料C上面。 但如此厚厚地滯留的洗淨液Ε可在基板材料C上面藉 經由逆向噴嘴1 0以向上游側斜成向下傾斜而噴射成幕狀的 洗淨液Ε等，而向上游側予以推回。 經噴射成幕狀的洗淨液Ε等，是比噴射成幕狀的空氣， 對於厚厚的滯留者具有極強的沖力，可使其大部分向上游 側推回。並且被推回之洗淨液Ε，將按照前述方式由基板 材料C之左右側端流下、落下、而回收。«S Next, a method for manufacturing the substrate B using the cleaning device 1 will be described below. First, the manufacturing method of the first example will be described. In the first manufacturing method, the printed wiring board of the first example of the substrate B is manufactured through the following process. First, prepare a substrate material C of a copper-clad laminated board. The copper-clad laminated board is formed by pasting a copper foil on the outer surface of an insulating layer (core material) made of resin, glass cloth, or ceramics by a thermocompression bonding machine or the like. . Then, a perforation process for a through hole is performed by a method such as laser. Lutong holes are formed by through-holes between the two outer surfaces of the substrate material C (substrate B). Each piece is formed with hundreds or more of extremely small diameters, and the diameter is about 0.5 mm to 0.2 mm or less. many. The through hole is used for connecting between two external surfaces or between circuits A of a multilayer substrate, or for assembling components mounted on the circuit a. The NMBI [Neo-Manhattan Bump Interconnection] method has also recently been developed. The @ NMBI is a technology that uses small bumps instead of through-holes, and achieves the same function as through-holes by using pads without the need for punching processing. Then, on the outer surface (one or both sides of the upper surface, the lower surface, and the lower surface of the copper case of the substrate material C), a photoresist is applied or pasted together in a film form. Next, put a circuit picture depicting the negative of circuit A. After exposure, the photosensitive anti-uranium agent on the outer surface will leave the exposed part of circuit A that is hardened. The other unnecessary parts will be dissolved and removed by spraying the developer. . -15-200412261 Next, the copper foil of the substrate material c will leave a portion formed by the photoresist and the circuit A covered by hardening, and the unnecessary portion of the photoresist that has been dissolved and removed after development is borrowed. The etching solution (copper chloride (Π), iron oxide (m)) is sprayed to dissolve and remove it for etching. Then, the remaining circuit a forming part is peeled off by spraying a peeling liquid, and the copper foil formed by the remaining circuit A is on the outer surface of the substrate material C (on one side of the upper surface, the lower surface and the lower surface). Or double-sided) to form a predetermined circuit A, so that a substrate B can be obtained, that is, a printed wiring substrate. In addition, for the above-mentioned development program, etching program, and peeling program, for each post-processing, or after the peeling program, they are collected for post-processing, and a cleaning program for spraying a water washing liquid, a neutralizing agent liquid, and other cleaning nozzles is attached. (2) The processing liquids such as a developing solution, a uranium engraving solution, and a stripping solution adhering to the outer surface of the substrate material C are cleaned and removed. The manufacturing method of the first example is constituted by such a wet method. The manufacturing method of the first example is as described above. Next, the manufacturing method of the second example is explained as follows. The manufacturing method of the printed wiring board, which is an example of the substrate B, is based on the wet method of the first example described above, but the semi-additive method of the second example is also being used in most cases. In this semi-additive method, an electroless copper-plated film is first formed on the outer surface (one or both of the upper surface, the lower surface, and the lower surface) of the substrate material C having through holes formed in advance. -Then, after the photoresist is coated or pasted on the non-electrolytic copper-plated film in the form of a film, a photo of the circuit on which the negative of circuit A is depicted is placed and exposed. —Therefore, the photosensitive anti-uranium agent is left to be hardened by exposure-16-200412261, and the other part, namely the circuit A forming part, is dissolved and removed by spraying a developing solution. Then—for the circuit A forming portion, that is, the portion of the electroplated film pattern where the photoresist is dissolved and removed by the development process, that is, the portion where the non-electrolytic copper plating film is exposed, electrolytic copper plating is applied to form the circuit A. In addition, the remaining photosensitive anti-clogging agent other than the formed part of the hardened circuit A will be removed by spraying a stripping solution. The exposed non-electrolytic copper plating film is sprayed by an etching solution and subjected to rapid uranium etching. Removed by melting. — In addition to the above, a washing program is added for the post-processing of each program. The semi-additive method of the second example is to form a circuit A by electrolytic copper plating in such a manner as to manufacture a substrate B, that is, a printed wiring substrate. The second example is configured as described above. However, the manufacturing methods of printed wiring boards and the manufacturing methods of other substrates B for circuit A have recently become more and more diversified. In addition to the first and second examples described above, various methods have been developed and used. Of course, the present invention can also be applied to such various manufacturing methods of printed wiring boards and other substrates B. The manufacturing method of the substrate B is configured as described above. < About the cleaning device 1 > The following describes the cleaning device 1 with reference to Figs. 1 to 3. This cleaning device 1 is a process for preparing the substrate B in the above-mentioned substrate B. The substrate material C is subjected to a surface treatment with a treatment liquid D in order to form a circuit A, and is washed with a cleaning liquid. -17- 200412261 For example, it is used for post-processing of the development process, etching process, and peeling process, that is, to remove and adhere to and retain the substrate material C after the surface treatment for forming the circuit A after applying the above-mentioned procedures that belong to the previous stage. Processing solution D such as developer solution, uranium engraving solution, and stripping solution. In the first figure, 2 is a processing chamber 2 of the preceding procedure, 3 is a nozzle for spraying the processing liquid D on the substrate material C, and 4 is a liquid tank of the processing liquid D. The substrate material C is conveyed in a horizontal posture by a conveyor 6 using rollers 5 and, as shown in the figure, the treatment liquid D is sprayed from the nozzles 3 arranged opposite each other to perform surface treatment. In addition, as shown in the figure, the cleaning device 1 includes three cleaning chambers 7 and an air chamber 8 arranged in order from the upstream side to the downstream side in the conveying direction. Each cleaning chamber 7 is provided with a cleaning nozzle 9. In the cleaning chamber 7 at the rear end, a reverse nozzle 10 is arranged immediately after the cleaning nozzle 9 at the rear end. The air chamber 8 is provided with an air nozzle 11. The cleaning nozzle 9 or the reverse nozzle 10 and the air nozzle 11 are arranged in separate rooms in this manner. In this way, the cleaning device 1 is sequentially provided with a cleaning nozzle 9 for spraying the cleaning liquid E on the substrate material C conveyed by the conveyor 6 from the upstream side to the downstream side of the conveying direction F toward the upstream side. A reverse nozzle 10 for spraying fluid such as cleaning liquid E and an air nozzle 11 for spraying air G. The cleaning device 1 has a structure as described above. < About Conveyor 6 >-1 8-200412261 The following is a description of how the conveyor 6 fits in the first figure. The conveyor 6 includes, for example, a group of five rollers or a group of wheels as shown in the figure, and can transport the substrate material C in a horizontal posture. In other words, as shown in the figure, the conveyors 6 of the cleaning device 1 are formed by arranging a plurality of rollers 5 that are rotationally driven in the forward and backward conveying direction F. The conveyor 6 passes through the cleaning chamber 1 and the air chamber 8 of the washing device 1 from the processing chamber 2 of the previous stage, and is continuously arranged toward the drying chamber 12 constituted by a furnace or the like of the subsequent stage. The substrate material C is placed on the rollers 5 of the conveyor 6 as described above, and can be moved from the upstream side to the downstream side in a horizontal posture along the conveyance direction F. The conveyor 6 is configured as described above. < About cleaning nozzle 9 > Next, the cleaning nozzle 9 will be described with reference to Figs. 1 and 2. The cleaning nozzle 9 of the cleaning device 1 is disposed at least on the upper side of the substrate material C being conveyed, and is connected to a pump or a liquid tank i 4 via a pipe 13. In addition, the cleaning nozzle 9 is provided with a plurality of 's for the substrate material c to be conveyed in front, back, left, and right to spray water washing liquid or other cleaning liquid. The cleaning nozzle 9 will be described in more detail as follows. In each of the cleaning chambers 7, nozzles 15 are arranged on the upper and lower sides of the substrate material C for a double-sided substrate at a specific vertical interval with respect to the substrate material C, as shown in the figure. In each cleaning chamber 7, the 'nozzle 15' is arranged along the left and right width direction of the substrate material to be conveyed ^ so as to cover its entire 1P field width, and a plurality of branches are separated in the forward and backward conveying direction F. Arranged into plural segments under the forward and backward intervals. 19-200412261 And for each of the nozzles 15 above, the cleaning nozzles are provided directly above or below the opposite surface (upper or lower) of the substrate material C in a certain interval in the width direction. 9. In addition, the cleaning nozzle 9 uses a plurality of blowout holes arranged in the width direction of the nozzle 15 as shown in the example shown in FIG. 2 or 3 (1). An example of such a figure is a single slit-shaped type in which the nozzles 15 are linearly arranged in the width direction as shown in (2) of FIG. 3. The cleaning solution E is pressure-fed to the nozzles 15 through the pipes 13 for each cleaning chamber 7, and is sprayed from the cleaning nozzles 9 of the nozzles 15 to the substrate material C conveyed in a horizontal posture. The sprayed cleaning solution E flows on the outer surface (top surface, bottom surface, or back surface) of the substrate material C in the right or left width direction, and then flows down from the left and right side ends. ， —And flow into the lower liquid tank 14 for recycling. -> The cleaning liquid E recovered in the liquid tank 14 is stored, and at the same time, it is pumped to the piping 13 by the pump afterwards, and is recycled. As the cleaning solution E, a water cleaning solution is mainly used, but a cleaning solution E mixed with a neutralizing agent or other chemical solution is often used. The cleaning nozzle 9 is configured as described above. < About the reverse nozzle 10 > The description of the first nozzle and the second nozzle with respect to the reverse nozzle 10 will be described below. The reverse nozzle 10 of the cleaning device 1 is disposed on the upper side with respect to the substrate material C to be conveyed, and is disposed obliquely downward and inclined toward the upstream side opposite to the conveying direction, and is disposed oppositely through a pipe 16 It is connected to the liquid tank 14 for spraying water or other cleaning liquid E-20- 200412261. The reverse nozzle 10 is arranged so as to cover the entire width range, and is composed of a slit-shaped nozzle that is linear in the width direction from left to right. Spray into the curtain. Alternatively, a so-called flat nozzle may be used instead of the slit-shaped nozzle. Therefore, by spraying the cleaning liquid E, the cleaning liquid E sprayed by the cleaning nozzle and held on the substrate material can be pushed back to the upstream side, so that the cleaning liquid E can be removed from the substrate material. The left and right sides shed. A more detailed description of such a reverse nozzle 10 is as follows. After the cleaning nozzle 9 at the last stage of the final cleaning chamber 7, a liquid pipe (a q U a p i p e) 1 7 is arranged at intervals of the front and rear, as shown in the figure. The liquid pipe 17 is arranged on the upper side of the substrate material C with a specific vertical interval therebetween, and is provided in a right-left width direction so as to cover the entire width range of the substrate material C. In addition, as shown in FIG. 2 and FIG. 3 (2), such a liquid pipe 17 is provided with a slit-shaped nozzle in a straight line as the reverse nozzle 10. As shown in FIG. This reverse nozzle 10 is arranged on the upstream side of the substrate material c so as to be inclined toward the upstream side, for example, from a horizontal plane downward, for example, 45 degrees. Therefore, after the cleaning liquid E is pressure-fed to the liquid tube 17 through the pipe 16, the substrate material C, which can be conveyed in a horizontal posture from the oblique upward direction by the reverse nozzle 10 of the liquid tube 17, is sprayed into a flat shape. Curtain-like. —And the sprayed cleaning liquid E can push the cleaning liquid E retained on the substrate material C back to the upstream side, and together with the pushed cleaning liquid £ -21- 200412261 on the substrate The left and right width directions Η flow,-from the left and right sides of the two sides down · and fall down, and are recovered in the lower liquid tank 14. -The cleaning liquid E recovered in the liquid tank 14 is stored together with the cleaning liquid E sprayed, flowed down, and recovered from the cleaning nozzle 9 described above, but is still pumped to the piping 16 by pumping,- And recycle. Regarding the cleaning solution E, please refer to the paragraphs stated for the cleaning nozzle 9 previously. In addition, the reverse nozzle 10 uses a slit type as shown in the figure. However, instead of following this type, it can also be used. As shown in (1) of Figure 3, the liquid pipes 17 are arranged in the width direction. There are many types of blowout holes. Of course, such a blow-out hole type can also be arrange | positioned diagonally down to an upstream side similarly to a slit-shaped type. In addition, from the reverse nozzle 10, as shown in the figure, the water washing liquid or other washing liquid E for recycling is sprayed. However, instead of this method, the water washing liquid supplied through the water system may be used as the washing liquid E. For use, it will be drained and used as a method of waste liquid disposal after use. Alternatively, it may be configured so that air can be sprayed. Regarding the method of spraying air, refer to the following paragraphs about the air nozzle 11. The reverse nozzle 10 is configured as described above. < About the air nozzle 11 > The description of the air nozzle 11 1 with reference to Figs. 1 and 2 is as follows. The air nozzle 11 of the cleaning device 1 is disposed at least on the upper side of the substrate material to be conveyed, and is connected to an air source such as an air compressor via a pipe 18 to spray air G and blow. -22-200412261 The air nozzle 1 1 is arranged to cover the entire conveyed substrate material, covering the entire width of the substrate. It is composed of slit-shaped nozzles that are linear in the left and right width direction, and is inclined toward the upstream side. The relative arrangement is to spray the air G on the substrate material C toward the upstream side and spray it into a curtain shape. And by spraying such air G, most of the cleaning liquid remaining after removing most of the liquid through the reverse nozzle or by natural fall is removed by the substrate material C. Hereby, the air nozzle 11 is described in more detail as follows. The cleaning device 1 is provided with an air chamber 8 in the cleaning chamber 7 immediately after the rear end, and an air duct 19 is provided as shown in the figure. The air duct 19 is arranged on the upper and lower sides of the substrate material C for the double-sided substrate at a specific vertical interval with respect to the substrate material C, and covers the entire width of the substrate material C according to the example shown in the figure. The mode is set along the left and right width directions. The other example in the figure is configured with upper and lower branches, but of course it can also be configured with multiple branches each. And for these two air ducts 19, as shown in Fig. 2 and Fig. 3 (2), a slit-shaped spray is provided in the width direction. The nozzle is used as an air nozzle 1 1 . The upper air nozzle 11 is disposed on the upper side of the substrate material C, and is inclined toward the upstream side, for example, at an angle of 45 ° downward from the horizontal plane. The air nozzles 11 on the lower side are arranged on the upstream side, for example, at an angle of 45 degrees upward from the horizontal plane, so as to rise and incline, and are relatively disposed below the substrate material C. Air G is supplied by air compressors, blowers, air pumps, fans, and other air sources (not shown)-after being sent to the air pipe 19 through the pipe 18,-23- 200412261-air from the air pipe 19 The nozzle 11 conveys the substrate material C which is conveyed in a horizontal posture from the upper part to the lower part and the upper part to the lower part, as shown in the figure. -Therefore, the air G sprayed in this manner can remove the cleaning liquid E remaining on or under the substrate material C. —According to the air g sprayed in this way, if the thickness of the cleaning solution E retained in the substrate material C is about several millimeters, its removal effect is limited, but when only a small amount is retained, it can be efficiently removed. In particular, the air G can be effectively removed when heated air is used. The air nozzle 11 is a slit type as shown in the figure, but the air nozzle 19 is not used as shown in (1) of Fig. 3. It is a type with a large number of blowout holes arranged in the width direction. . Of course, the blowout hole pattern should also be arranged so that it is inclined to the upstream side in the same way as the slot type. The air nozzle 11 is configured as described above. < About Action > The present invention is configured as described above. Therefore, it has the following effects. The cleaning device 1 can be used in the manufacturing process of the substrate B. That is, processes for manufacturing glass substrates for plasma displays, glass substrates for liquid crystals, module substrates packaged with semiconductor components, and other printed wiring substrates. The substrate material C is first surface-treated with an acidic or alkaline treatment liquid in order to form a circuit in the previous procedure. For example, in the development process, the engraving process, and the peeling process, the substrate material c is sprayed with the treatment liquid D and then subjected to a surface treatment (see FIG. 1). -24-200412261 Then the substrate material c will be sent to the cleaning device 1 for cleaning up afterwards and cleaning treatment will be carried out, so that the cleaning solution E, which is attached and remaining after the surface treatment in the previous procedure, is used for cleaning solution E. Wash and remove. In other words, g and g are mixed, and the substrate material c is sequentially conveyed in the cleaning device 1 by the conveyor 6 having the roller group 5 or the wheel group in the horizontal posture from the upstream side to the downstream side in the conveying direction F. Followed by cleaning nozzle 9, reverse nozzle 10, air nozzle 1 1 (see figure 丨). First, the cleaning nozzle 9 sprays the cleaning liquid e on the substrate material c (see FIG. 1 and FIG. 2). That is, the cleaning nozzle 9 is arranged at least above the substrate material c to be conveyed (upper side and lower side in the example shown in the figure), and is connected to the liquid tank 14 through a nozzle 15 or a pump. In addition, the cleaning nozzles 9 are disposed opposite to each other before and after the substrate material c, and are provided with a plurality of 'for spraying water or other cleaning liquid on the substrate material, thereby cleaning and removing the attached and remaining processing liquid D. In addition, the cleaning liquid E sprayed from the upper cleaning nozzle 9 cleans the substrate material C, and most of it flows on the substrate material c to the left and right (width direction H orthogonal to the conveying direction). Recovered by flowing down and falling from the left and right side ends. In contrast, the cleaning liquid E 'sprayed from the lower cleaning nozzle 9 cleans the substrate material ^, and almost all of it is naturally recovered from the substrate material C by gravity. Next, the reverse nozzle 10 will spray a fluid such as the cleaning liquid E on the substrate material C (see Figs. 1 and 2). 200412261 That is, the reverse nozzle 10 is a slit-shaped nozzle arranged on the substrate material c to be conveyed and configured to cover the entire width of the substrate material C in a straight line in the left-right width direction. Further, it is arranged to be inclined toward the upstream side opposite to the conveying direction F, and is connected to a pump or a liquid tank 14 through a liquid pipe 17 or a pipe 16. Therefore, the reverse nozzle 10 can incline the water washing liquid or other washing liquid E to the upper side of the substrate material C being conveyed to the upstream side, and spray it into a curtain shape. By spraying the cleaning liquid E from the reverse nozzle 10 as described above, the cleaning liquid E sprayed from the cleaning nozzle 9 and stayed on the upper side can be pushed back to the upstream side. That is, the cleaning liquid E sprayed on the substrate material C through the cleaning nozzle 9 is mostly recovered from the left and right side ends of the substrate material C, as described above, but is still recovered by several millimeters. The thickness is left and right on the substrate material C. However, such a thickly retained cleaning liquid E can be pushed back toward the upstream side by spraying the cleaning liquid E on the substrate material C in an obliquely downward direction through the reverse nozzle 10 to the upstream side. . The sprayed cleaning liquid E, etc., is stronger than the air sprayed into the curtain, and has a strong impulse for thick detainees, and most of it can be pushed back to the upstream side. The pushed-back cleaning solution E will flow down, fall, and be recovered from the left and right side ends of the substrate material C as described above.
按最近之基板Β，例如玻璃基板，其工件大小有大型 化傾向，致譬如在縱橫超過1公尺左右之大的基板材料C 200412261 上面’洗淨液E就容易大量成爲寬且厚的積水狀而滯留， 但即使爲如此般滯留之洗淨液E，若使用由逆向噴嘴1 0噴 射成幕狀的洗淨液E，當可容易將之推回。 最後空氣噴嘴1 1即將對由洗淨室7輸出之基板材料C， 噴射空氣G (請參閱第1圖第2圖）。 空氣噴嘴1 1是配置於與配置有洗淨噴嘴9或逆向噴嘴 1 0的洗淨室7成個別之空氣室8，且配置於被輸送的基板 材料C之至少上側（圖示例是上側與下側），同時由以掩蓋 基板材料C的全幅寬範圍之方式而配置且由向寬度方向呈 直線之縫隙狀噴嘴構成。 並且向上游側傾斜而相對配置，且介以風管1 9或配管 1 8連接於空氣壓縮機或其他空氣源，用以對被輸送過來之 基板材料C將空氣G向上游側傾斜而噴射成幕狀而吹刮。 藉來自於如此之空氣噴嘴1 1的空氣G噴射，即可使經 由逆向噴嘴1 0或因自然落下而被除去大部分後所剩下的少 許洗淨液E，從基板材料C加以除去。 換句話說，如上所述，關於基板材料C上面是藉來自 於逆向噴嘴1 0的洗淨液E等之噴射，而關於基板材料C下 面則因自然洛下而只不過是只有少許洗淨液E會殘留成極 薄的幕狀而已。 ， 按對於要除盡如此般極其少數之液體而言，使用以幕 狀由空氣噴嘴1 1吹刮之空氣G，可以說是極有效的方法。 換句話說，空氣G之幕狀吹刮雖不適合於大量洗淨液E之 除去，但卻適合於極少量洗淨液E之完全除去。 - 27 - 200412261 譬如，對於大量滯留的洗淨液E，若用空氣G噴射而 吹刮，則將發生洗淨液E由基板材料c上飛散而漂浮，然 後再度附著於基板材料C上之現象。相對地對於極少量滯 留的洗淨液E，即使用空氣G噴射，也不致於發生如此之 飛散、再附著現象，因而可由空氣G確實除去洗淨液E。 如此若依照該洗淨裝置1，即可由基板材料C上面或 下面確實除去洗淨處理所使用之洗淨液E。 此外經由配置於下側之洗淨噴嘴9而噴射於基板材料 C下面之洗淨液E，由於幾乎全部會經洗淨處理後由基板材 料C自然落下，而以重力加以回收，因而不會如基板材料 C上面般發生上述洗淨液E的大量滯留問題，故不需配置 逆向噴嘴1 0。 換句話說關於基板材料C下面，只不過是只有極少許 之洗淨液E會殘留成極薄幕狀，因此僅由配置於下面之空 氣噴嘴丨i噴射空氣G，即能確實加以除去。 並且該洗淨裝置1，是在洗淨噴嘴9與空氣噴嘴1 1之 間設有設有逆向噴嘴1 0並以縫隙狀噴嘴構成逆向噴嘴1 〇， 同時介以配管1 6而連接於泵或液槽所成的簡單結構構成。 並且該洗淨裝置1是可容易地以追加方式搭配於既有 的此種傳統洗淨裝置。 [對照先前技術之功效] <本發明之特徵> 200412261 本發明之洗淨裝置1，其特徵爲如上所述在洗淨噴嘴 與空氣噴嘴間配置逆向噴嘴，而向上游側噴射洗淨液等， 藉以推回滯留於基板材料上之洗淨液而構成者。 因此本發明之洗淨裝置能發揮下述功效。 <第一功效> 第一，可有效地由基板上確實除去洗淨液。即若依照 本發明之洗淨裝置，由於由逆向噴嘴噴射之洗淨液等能向 上游側推回由洗淨噴嘴噴射而滯留於基板材料上之洗淨 液，因此，洗淨液幾乎全部會由基板材料左右兩側端流下 而落下。 如此，在基板材料上只不過是只會殘留少許的洗淨液， 因此可讓藉由空氣噴嘴吹刮的空氣來有效地完全除去。 因此能確實消除如同上述此種傳統洗淨裝置般在已通 過空氣噴嘴的基板材料上發生水滴殘留，或往後發生斑點、 污點等情事。因而能確實防止如在後續程序發生障礙，或 造成電路氧化或侵蝕等原因，或在半導體之裝配上招致障 礙等情事，藉以回避各種電路故障之危險。 如此，對於電路之高密度化、微小化正在不斷的進展 之此類基板而言，可期望提高品質或減少不良率之發生。 <第二功效> 第二，而且其係在成本方面優越而可實現。即本發明 之洗淨裝置是在洗淨噴嘴與空氣噴嘴間設置逆向噴嘴而成 之簡單結構構成，因此可容易地實現上述第一點。 -29 - 200412261 換句話說，與上述此種傳統洗淨裝置相比，可大幅度 地縮減所需空氣噴嘴支數，大大地減少設備成本。這是因 爲傳統裝置需要將高精確度且非常價昂的空氣噴嘴設成爲 複數支且多段之故。加上因不再需要配備大容量空氣壓縮 機等空氣源而使用大量空氣，因此在動力成本、維護成本、 運轉成本方面也有利。 如上所述，能解決此種傳統方式所存在之課題全部等， 本發明所發揮之功效極其顯著。 (五）圖式簡單說明 第1圖是關於本發明之洗淨裝置，用以說明本發明實 施方式之側剖面說明圖。 第2圖是用以說明本發明實施方式之平面說明圖。 第3圖是用以說明本發明實施方式，其中（1)圖是孔狀 嘴之底面說明圖、（2 )圖是縫隙狀噴嘴之底面說明圖，（3 ) 圖是印刷配線基板（基板材料）之平面說明圖。 圖式之元件符號對照表 1 洗淨裝置 2 處理室 3 噴嘴 4 液槽 5 滾輪 6 輸送機 7 洗淨室 8 空氣室 -3 0 - 洗淨噴嘴 逆向噴嘴 空氣噴嘴 乾燥室 配管 液槽 噴管 配管According to recent substrates B, such as glass substrates, the size of the workpiece tends to increase. For example, on a substrate material C 200412261 that is larger than about 1 meter in length and width, the 'cleaning solution E can easily become a large and thick stagnant water. However, even if the cleaning liquid E is retained in such a manner, if the cleaning liquid E sprayed into a curtain shape by the reverse nozzle 10 is used, it can be easily pushed back. Finally, the air nozzle 11 is to spray the air G on the substrate material C output from the cleaning chamber 7 (see FIG. 1 and FIG. 2). The air nozzle 11 is arranged in a separate air chamber 8 from the cleaning chamber 7 in which the washing nozzle 9 or the reverse nozzle 10 is arranged, and is arranged on at least the upper side of the substrate material C being conveyed (the example in the figure is the upper side and the (Bottom side), and is composed of a slit-shaped nozzle that is arranged so as to cover the entire width of the substrate material C and is linear in the width direction. It is inclined and arranged opposite to the upstream side, and is connected to an air compressor or other air source via a duct 19 or a pipe 18, and is used to incline the air G toward the upstream side of the substrate material C that is conveyed and spray it into The curtain is blown. By spraying the air G from the air nozzle 11 as described above, a small amount of the cleaning liquid E remaining after being largely removed by the reverse nozzle 10 or by natural fall can be removed from the substrate material C. In other words, as described above, the upper surface of the substrate material C is sprayed by the cleaning liquid E and the like from the reverse nozzle 10, and the lower surface of the substrate material C is only a little cleaning liquid because of natural rolling down. E will remain as a very thin curtain. It can be said that it is extremely effective to use the air G blown by the air nozzles 11 in a curtain shape to remove such a very small amount of liquid. In other words, although the curtain blowing of the air G is not suitable for the removal of a large amount of the cleaning solution E, it is suitable for the complete removal of a very small amount of the cleaning solution E. -27-200412261 For example, if a large amount of the remaining cleaning liquid E is sprayed and blown with air G, the cleaning liquid E will scatter and float from the substrate material c, and then adhere to the substrate material C again. . On the other hand, even if a small amount of the remaining cleaning liquid E is sprayed with air G, such scattering and re-attachment will not occur, so the cleaning liquid E can be reliably removed by the air G. In this way, according to the cleaning device 1, the cleaning liquid E used for the cleaning process can be reliably removed from above or below the substrate material C. In addition, the cleaning liquid E sprayed under the substrate material C through the cleaning nozzle 9 disposed on the lower side is almost completely dropped by the substrate material C after being subjected to the cleaning treatment, and is recovered by gravity, so it is not as good as Since a large amount of the above-mentioned cleaning solution E is retained on the substrate material C, the reverse nozzle 10 need not be arranged. In other words, only a very small amount of the cleaning liquid E remains as a very thin screen under the substrate material C. Therefore, the air G can be reliably removed only by spraying the air G through the air nozzles i located below. In addition, the cleaning device 1 is provided with a reverse nozzle 10 between the cleaning nozzle 9 and the air nozzle 11 and constitutes a reverse nozzle 10 with a slit-shaped nozzle, and is connected to a pump or a pipe 16 via a pipe. Simple structure made of liquid tank. In addition, the cleaning device 1 can be easily added to an existing conventional cleaning device in an additional manner. [Comparison with the effect of the prior art] < Features of the present invention > 200412261 The cleaning device 1 of the present invention is characterized in that a reverse nozzle is arranged between the cleaning nozzle and the air nozzle as described above, and the cleaning liquid is sprayed to the upstream side. It is constituted by pushing back the cleaning liquid retained on the substrate material. Therefore, the cleaning device of the present invention can exert the following effects. < First effect > First, the cleaning liquid can be effectively removed from the substrate. That is, according to the cleaning device of the present invention, since the cleaning liquid sprayed by the reverse nozzle can be pushed back to the upstream side, the cleaning liquid sprayed by the cleaning nozzle and retained on the substrate material can be almost completely cleaned. The left and right sides of the substrate material flow down and fall. In this way, only a small amount of cleaning liquid remains on the substrate material, so that the air blown by the air nozzle can be effectively and completely removed. Therefore, it is possible to surely eliminate the occurrence of water droplets remaining on the substrate material that has passed through the air nozzle, or the occurrence of spots and stains, as in the conventional cleaning device described above. Therefore, it is possible to surely prevent the occurrence of obstacles in the subsequent procedures, or cause oxidation or erosion of the circuit, or cause obstacles in the semiconductor assembly, thereby avoiding the danger of various circuit failures. In this way, for such substrates in which the density and miniaturization of circuits are continuously progressing, it is expected to improve the quality or reduce the occurrence of defects. < Second effect > Second, it is superior in terms of cost and is achievable. That is, the cleaning device of the present invention has a simple structure in which a reverse nozzle is provided between the cleaning nozzle and the air nozzle, so that the first point described above can be easily realized. -29-200412261 In other words, compared with the above-mentioned conventional cleaning device, the number of required air nozzles can be greatly reduced, and the equipment cost can be greatly reduced. This is because the conventional device requires a plurality of high-precision and very expensive air nozzles to be provided in multiple stages. In addition, because a large amount of air is no longer required to be equipped with an air source such as a large-capacity air compressor, it is also advantageous in terms of power costs, maintenance costs, and running costs. As described above, all the problems existing in such a conventional method can be solved, and the effect exerted by the present invention is extremely remarkable. (V) Brief Description of Drawings Fig. 1 is a side cross-sectional view of a cleaning device of the present invention, for explaining the embodiment of the present invention. Fig. 2 is a plan explanatory view for explaining an embodiment of the present invention. FIG. 3 is a diagram for explaining an embodiment of the present invention, wherein (1) is an explanatory diagram of a bottom surface of a hole-shaped nozzle, (2) is an explanatory diagram of a bottom surface of a slit-shaped nozzle, and (3) is a printed wiring substrate (substrate material) ) Plane illustration. Diagram of component symbol comparison table 1 Washing device 2 Processing chamber 3 Nozzle 4 Liquid tank 5 Roller 6 Conveyor 7 Washing chamber 8 Air chamber -3 0-Washing nozzle Reverse nozzle Air nozzle Drying chamber Pipe Liquid tank Nozzle Pipe
液管 配管 風管 電路 基板Liquid pipe piping duct circuit board
基板材料 處理液 洗淨液 輸送方向 空氣 寬度方向 -31-Substrate material Processing liquid Cleaning liquid Conveying direction Air Width direction -31-