KR102399755B1 - 삼층 필름, 삼층 필름의 제조 방법, 적층판 및 프린트 회로 기판 - Google Patents

삼층 필름, 삼층 필름의 제조 방법, 적층판 및 프린트 회로 기판 Download PDF

Info

Publication number
KR102399755B1
KR102399755B1 KR1020150178080A KR20150178080A KR102399755B1 KR 102399755 B1 KR102399755 B1 KR 102399755B1 KR 1020150178080 A KR1020150178080 A KR 1020150178080A KR 20150178080 A KR20150178080 A KR 20150178080A KR 102399755 B1 KR102399755 B1 KR 102399755B1
Authority
KR
South Korea
Prior art keywords
group
liquid crystal
crystal polymer
layer
liquid composition
Prior art date
Application number
KR1020150178080A
Other languages
English (en)
Korean (ko)
Other versions
KR20160074407A (ko
Inventor
도요나리 이토
타카유키 스기야마
히데아키 네즈
Original Assignee
스미또모 가가꾸 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미또모 가가꾸 가부시키가이샤 filed Critical 스미또모 가가꾸 가부시키가이샤
Publication of KR20160074407A publication Critical patent/KR20160074407A/ko
Application granted granted Critical
Publication of KR102399755B1 publication Critical patent/KR102399755B1/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/164—Drying
    • B32B2038/168—Removing solvent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
KR1020150178080A 2014-12-18 2015-12-14 삼층 필름, 삼층 필름의 제조 방법, 적층판 및 프린트 회로 기판 KR102399755B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-256052 2014-12-18
JP2014256052 2014-12-18

Publications (2)

Publication Number Publication Date
KR20160074407A KR20160074407A (ko) 2016-06-28
KR102399755B1 true KR102399755B1 (ko) 2022-05-20

Family

ID=56147694

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150178080A KR102399755B1 (ko) 2014-12-18 2015-12-14 삼층 필름, 삼층 필름의 제조 방법, 적층판 및 프린트 회로 기판

Country Status (4)

Country Link
JP (1) JP6644542B2 (zh)
KR (1) KR102399755B1 (zh)
CN (1) CN105711207A (zh)
TW (1) TWI719955B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6450048B1 (ja) * 2018-02-14 2019-01-09 住友化学株式会社 積層体
JP7210401B2 (ja) * 2019-02-15 2023-01-23 住友化学株式会社 フィルム及び積層体
JP7366397B2 (ja) * 2019-08-27 2023-10-23 共同技研化学株式会社 積層フィルム及び該積層フィルムの製造方法
US11917753B2 (en) 2019-09-23 2024-02-27 Ticona Llc Circuit board for use at 5G frequencies
CN110655789A (zh) * 2019-09-23 2020-01-07 宁波今山新材料有限公司 低介电低损耗的5g应用材料及其制备方法
JP7509560B2 (ja) 2020-03-31 2024-07-02 日鉄ケミカル＆マテリアル株式会社 樹脂フィルム、金属張積層板及び回路基板
TWI749575B (zh) * 2020-06-02 2021-12-11 長興材料工業股份有限公司 芳香族液晶聚酯、液晶聚酯組合物及製備液晶聚酯膜之方法
JPWO2022113961A1 (zh) * 2020-11-24 2022-06-02
JPWO2022113963A1 (zh) * 2020-11-24 2022-06-02
WO2022114159A1 (ja) * 2020-11-27 2022-06-02 富士フイルム株式会社 液晶ポリマーフィルム及びその製造方法、並びに、積層体
KR20230116047A (ko) * 2021-02-18 2023-08-03 후지필름 가부시키가이샤 액정 폴리머 필름, 폴리머 필름, 및 적층체
WO2023058855A1 (ko) * 2021-10-08 2023-04-13 한화솔루션 주식회사 단면 fccl 및 양면 fccl의 제조 방법
WO2023162659A1 (ja) * 2022-02-28 2023-08-31 富士フイルム株式会社 メタマテリアル用基材、メタマテリアル及び積層体

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004315678A (ja) 2003-04-17 2004-11-11 Sumitomo Chem Co Ltd 液晶性ポリエステル溶液組成物
JP2006008976A (ja) 2004-05-28 2006-01-12 Sumitomo Chemical Co Ltd フィルムおよびそれを用いた積層体
JP2007106107A (ja) 2005-07-29 2007-04-26 Sumitomo Chemical Co Ltd 液晶ポリエステル銅張積層板
JP2007238915A (ja) 2006-02-07 2007-09-20 Sumitomo Chemical Co Ltd 液晶ポリエステルおよびその溶液組成物
JP2008290425A (ja) 2007-05-28 2008-12-04 Mitsubishi Materials Corp フレキシブル基材
JP2008290424A (ja) 2007-05-28 2008-12-04 Mitsubishi Materials Corp フレキシブル基材
JP2010238990A (ja) * 2009-03-31 2010-10-21 Nippon Steel Chem Co Ltd 複合接着フィルムおよびそれを用いた多層回路基板並びにその製造方法
JP2013032532A (ja) 2004-05-18 2013-02-14 Kaneka Corp 接着フィルムの製造方法
JP2013189535A (ja) * 2012-03-13 2013-09-26 Sumitomo Chemical Co Ltd 液晶ポリエステルフィルムの製造方法及び液晶ポリエステルフィルム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2002085621A1 (ja) * 2001-04-20 2004-08-05 東洋鋼鈑株式会社 積層板およびその積層板を用いた部品
JP2005186574A (ja) * 2003-12-26 2005-07-14 Kaneka Corp 接着性シートの製造方法および接着性シート、これを用いたフレキシブル金属張積層板
JP5411656B2 (ja) * 2009-02-24 2014-02-12 パナソニック株式会社 フレキシブルプリント配線板用積層板の製造方法、フレキシブルプリント配線板用積層板及びフレキシブルプリント配線板
JP2013001902A (ja) 2011-06-22 2013-01-07 Sumitomo Chemical Co Ltd 液晶ポリエステル含浸基材、その製造方法及びプリント配線板
TW201321178A (zh) * 2011-08-31 2013-06-01 Sumitomo Chemical Co 積層基材的製造方法、液晶聚酯膜的製造方法
JP2014120580A (ja) * 2012-12-14 2014-06-30 Mitsubishi Gas Chemical Co Inc 金属張積層板及びその製造方法並びにプリント配線板
CN105075404B (zh) * 2013-02-28 2018-07-20 住友化学株式会社 层叠板及其制造方法
JP6340180B2 (ja) * 2013-10-08 2018-06-06 東レ・デュポン株式会社 ポリイミド樹脂−液晶ポリマー複合フィルム及びその製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004315678A (ja) 2003-04-17 2004-11-11 Sumitomo Chem Co Ltd 液晶性ポリエステル溶液組成物
JP2013032532A (ja) 2004-05-18 2013-02-14 Kaneka Corp 接着フィルムの製造方法
JP2006008976A (ja) 2004-05-28 2006-01-12 Sumitomo Chemical Co Ltd フィルムおよびそれを用いた積層体
JP2007106107A (ja) 2005-07-29 2007-04-26 Sumitomo Chemical Co Ltd 液晶ポリエステル銅張積層板
JP2007238915A (ja) 2006-02-07 2007-09-20 Sumitomo Chemical Co Ltd 液晶ポリエステルおよびその溶液組成物
JP2008290425A (ja) 2007-05-28 2008-12-04 Mitsubishi Materials Corp フレキシブル基材
JP2008290424A (ja) 2007-05-28 2008-12-04 Mitsubishi Materials Corp フレキシブル基材
JP2010238990A (ja) * 2009-03-31 2010-10-21 Nippon Steel Chem Co Ltd 複合接着フィルムおよびそれを用いた多層回路基板並びにその製造方法
JP2013189535A (ja) * 2012-03-13 2013-09-26 Sumitomo Chemical Co Ltd 液晶ポリエステルフィルムの製造方法及び液晶ポリエステルフィルム

Also Published As

Publication number Publication date
JP6644542B2 (ja) 2020-02-12
KR20160074407A (ko) 2016-06-28
JP2016117281A (ja) 2016-06-30
CN105711207A (zh) 2016-06-29
TWI719955B (zh) 2021-03-01
TW201643043A (zh) 2016-12-16

Similar Documents

Publication Publication Date Title
KR102399755B1 (ko) 삼층 필름, 삼층 필름의 제조 방법, 적층판 및 프린트 회로 기판
TWI513582B (zh) 積層基材之製造方法，積層基材及印刷配線板
US20130101824A1 (en) Method for producing laminate, and laminate
CN104245306A (zh) 柔性金属包层层压板
TW202239833A (zh) 聚合物膜以及積層體及其製造方法
JP2022184736A (ja) 配線基板及び配線基板の製造方法
KR20130000335A (ko) 액정 폴리에스테르-함침 기재의 제조 방법
JP2022085734A (ja) 液晶ポリマーフィルム及び積層体
JP2022083294A (ja) ポリマーフィルム、及び、積層体
JP2013001105A (ja) 積層体
JP4901509B2 (ja) ポリイミド前駆体溶液の多層膜、多層ポリイミドフィルム、片面金属張積層板、および多層ポリイミドフィルムの製造方法
WO2012176764A1 (ja) 積層体及びその製造方法
KR20150122720A (ko) 적층판 및 그의 제조 방법
JP2022126429A (ja) ポリマーフィルム及び積層体
JP2013208891A (ja) 積層体及びその製造方法
JP2022184787A (ja) ポリマー膜及びその製造方法、並びに、積層体及びその製造方法
JP2010080479A (ja) プリント配線板用コア基板
JP2013199088A (ja) 積層体及びその製造方法
KR101439496B1 (ko) 폴리아믹산 수지 조성물과 이의 제조방법 및 이를 이용한 폴리이미드 금속적층체
KR20150112345A (ko) 다층 폴리이미드 필름의 제조방법
JP2010080480A (ja) 多層プリント配線板
KR102630417B1 (ko) 전자 회로 용품을 위한 다층 필름
US20230083002A1 (en) Polymer film and method of producing same, and laminate
JP2022184737A (ja) 配線基板及び配線基板の製造方法
KR20220162062A (ko) 배선 기판 및 배선 기판의 제조 방법

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant