KR102145822B1 - 시트의 제조방법 - Google Patents

시트의 제조방법 Download PDF

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Publication number
KR102145822B1
KR102145822B1 KR1020147022561A KR20147022561A KR102145822B1 KR 102145822 B1 KR102145822 B1 KR 102145822B1 KR 1020147022561 A KR1020147022561 A KR 1020147022561A KR 20147022561 A KR20147022561 A KR 20147022561A KR 102145822 B1 KR102145822 B1 KR 102145822B1
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KR
South Korea
Prior art keywords
sheet
base layer
layer
substrate
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020147022561A
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English (en)
Korean (ko)
Other versions
KR20140128332A (ko
Inventor
갸엘 드프레
쟝-마리 보
Original Assignee
아르조 위긴스 파인 페이퍼즈 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=47624005&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR102145822(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from FR1250366A external-priority patent/FR2985744B1/fr
Priority claimed from FR1256336A external-priority patent/FR2992663B1/fr
Application filed by 아르조 위긴스 파인 페이퍼즈 리미티드 filed Critical 아르조 위긴스 파인 페이퍼즈 리미티드
Publication of KR20140128332A publication Critical patent/KR20140128332A/ko
Application granted granted Critical
Publication of KR102145822B1 publication Critical patent/KR102145822B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/06—Layered products comprising a layer of paper or cardboard specially treated, e.g. surfaced, parchmentised
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/22—Metallic printing; Printing with powdered inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0386—Paper sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Paper (AREA)
KR1020147022561A 2012-01-13 2012-12-21 시트의 제조방법 Expired - Fee Related KR102145822B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
FR1250366 2012-01-13
FR1250366A FR2985744B1 (fr) 2012-01-13 2012-01-13 Procede de fabrication d'une feuille electro-conductrice
FR1256336A FR2992663B1 (fr) 2012-07-02 2012-07-02 Procede de fabrication d'une feuille dont une face comporte une zone de plus grand lisse que le reste de la face
FR1256336 2012-07-02
PCT/EP2012/076829 WO2013104520A1 (fr) 2012-01-13 2012-12-21 Procédé de fabrication d'une feuille

Publications (2)

Publication Number Publication Date
KR20140128332A KR20140128332A (ko) 2014-11-05
KR102145822B1 true KR102145822B1 (ko) 2020-08-28

Family

ID=47624005

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147022561A Expired - Fee Related KR102145822B1 (ko) 2012-01-13 2012-12-21 시트의 제조방법

Country Status (14)

Country Link
US (1) US9648751B2 (enExample)
EP (1) EP2802711B1 (enExample)
JP (1) JP6378093B2 (enExample)
KR (1) KR102145822B1 (enExample)
CN (1) CN104204353B (enExample)
BR (1) BR112014017150A8 (enExample)
CA (1) CA2861728C (enExample)
ES (1) ES2657018T3 (enExample)
NO (1) NO2802711T3 (enExample)
PT (1) PT2802711T (enExample)
RU (1) RU2014127750A (enExample)
TW (1) TWI567758B (enExample)
WO (1) WO2013104520A1 (enExample)
ZA (1) ZA201404227B (enExample)

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FR2954361B1 (fr) 2009-12-23 2012-06-15 Arjo Wiggins Fine Papers Ltd Feuille imprimable ultra lisse et recyclable et son procede de fabrication
FR3012153B1 (fr) * 2013-10-21 2016-03-04 Arjo Wiggins Fine Papers Ltd Papier destine en particulier a l'impression d'une couche electro-conductrice
WO2015163281A1 (ja) * 2014-04-22 2015-10-29 王子ホールディングス株式会社 複合体及びその製造方法
US20180037009A1 (en) * 2015-02-13 2018-02-08 Centitvc- Centro De Nanotecnologia E Materiais Técnicos, Funcionais E Inteligentes Wood derived multilayer product with integrated electric circuit and manufacturing process
US9650746B2 (en) * 2015-06-11 2017-05-16 Golden Arrow Printing Co., Ltd. Pulp molding process and paper-shaped article made thereby
JP6986896B2 (ja) * 2016-09-08 2021-12-22 アイカ工業株式会社 熱硬化性樹脂化粧板及び天板並びに熱硬化性樹脂化粧板の製造方法
CN110036433A (zh) * 2016-09-27 2019-07-19 伊努鲁有限公司 电子器件的无损集成
EP3405011B1 (en) * 2017-05-16 2025-09-10 Fedrigoni S.P.A. Paper-in-resin electronics - process for producing it
WO2020076876A1 (en) 2018-10-09 2020-04-16 Reelables, Inc. Low-power electronic tape for tracking items
US12322270B2 (en) 2018-10-09 2025-06-03 Reelables, Inc. Method of fabrication of low-power electronic tape for tracking items
EP3643500A1 (en) * 2018-10-25 2020-04-29 HIDRIA d.o.o. Method for the production of a laminated core
RU2714631C1 (ru) * 2019-06-14 2020-02-18 Иван Сергеевич Демидов Плоский листовой материал с радиочастотной идентификацией
JP7268548B2 (ja) * 2019-09-03 2023-05-08 王子ホールディングス株式会社 疑似接着紙用原紙、疑似接着紙および配送伝票用紙
KR20220006670A (ko) 2020-07-08 2022-01-18 삼성디스플레이 주식회사 표시 장치
CN111976236B (zh) * 2020-09-01 2021-03-12 无锡睿龙新材料科技有限公司 一种多层聚合表面功能改性电子纤维布挠性高频覆铜板的制备方法
CN112793321A (zh) * 2020-12-02 2021-05-14 东莞市美盈森环保科技有限公司 纸塑材料上的电子油墨印刷工艺
IT202100010964A1 (it) * 2021-04-30 2022-10-30 Arti Grafiche Nidasio Digital S R L Metodo per la realizzazione di un prodotto in prevalenza cartaceo includente, al proprio interno, almeno un ricetrasmettitore di onde elettromagnetiche a radiofrequenza
FR3135869A1 (fr) * 2022-05-20 2023-11-24 Rodolphe Koehly Procédé de fabrication de ressources industrielles sous la forme de matériaux composites en couches complexes électriquement fonctionnelles
US11828027B1 (en) * 2022-08-31 2023-11-28 Packaging And Crating Technologies, Llc Fire resistant retail product packaging materials and method of manufacturing same
CN117656491B (zh) * 2023-12-12 2024-04-19 广州洁诺净化设备有限公司 一种电芯隔热片生产线、生产工艺方法及控制系统

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Also Published As

Publication number Publication date
BR112014017150A8 (pt) 2017-07-04
CN104204353B (zh) 2017-08-15
EP2802711A1 (fr) 2014-11-19
US20140322500A1 (en) 2014-10-30
PT2802711T (pt) 2018-01-30
WO2013104520A1 (fr) 2013-07-18
CA2861728C (fr) 2020-04-28
CN104204353A (zh) 2014-12-10
RU2014127750A (ru) 2016-03-10
TW201342399A (zh) 2013-10-16
CA2861728A1 (fr) 2013-07-18
KR20140128332A (ko) 2014-11-05
US9648751B2 (en) 2017-05-09
JP2015511182A (ja) 2015-04-16
ES2657018T3 (es) 2018-03-01
NO2802711T3 (enExample) 2018-03-24
JP6378093B2 (ja) 2018-08-22
TWI567758B (zh) 2017-01-21
BR112014017150A2 (pt) 2017-06-13
ZA201404227B (en) 2015-09-30
EP2802711B1 (fr) 2017-10-25

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