RU2014127750A - Способ изготовления листового материала - Google Patents
Способ изготовления листового материала Download PDFInfo
- Publication number
- RU2014127750A RU2014127750A RU2014127750A RU2014127750A RU2014127750A RU 2014127750 A RU2014127750 A RU 2014127750A RU 2014127750 A RU2014127750 A RU 2014127750A RU 2014127750 A RU2014127750 A RU 2014127750A RU 2014127750 A RU2014127750 A RU 2014127750A
- Authority
- RU
- Russia
- Prior art keywords
- layer
- sheet material
- electrically conductive
- base layer
- substrate
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract 25
- 238000004519 manufacturing process Methods 0.000 title claims abstract 4
- 238000000034 method Methods 0.000 claims abstract 27
- 239000000758 substrate Substances 0.000 claims abstract 17
- 239000002985 plastic film Substances 0.000 claims abstract 14
- 229920006255 plastic film Polymers 0.000 claims abstract 14
- 239000011230 binding agent Substances 0.000 claims abstract 11
- 238000007639 printing Methods 0.000 claims abstract 7
- 239000011248 coating agent Substances 0.000 claims abstract 4
- 238000000576 coating method Methods 0.000 claims abstract 4
- 239000003292 glue Substances 0.000 claims abstract 4
- 238000000137 annealing Methods 0.000 claims abstract 3
- 238000010438 heat treatment Methods 0.000 claims abstract 2
- 239000000976 ink Substances 0.000 claims 6
- 239000012528 membrane Substances 0.000 claims 4
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive effect Effects 0.000 claims 3
- 239000012799 electrically-conductive coating Substances 0.000 claims 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims 2
- 230000004888 barrier function Effects 0.000 claims 2
- 238000005520 cutting process Methods 0.000 claims 2
- 238000001035 drying Methods 0.000 claims 2
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 claims 2
- 239000005038 ethylene vinyl acetate Substances 0.000 claims 2
- 238000000608 laser ablation Methods 0.000 claims 2
- 239000011859 microparticle Substances 0.000 claims 2
- 238000000206 photolithography Methods 0.000 claims 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims 2
- 239000004814 polyurethane Substances 0.000 claims 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims 2
- 239000002318 adhesion promoter Substances 0.000 claims 1
- 230000000181 anti-adherent effect Effects 0.000 claims 1
- 239000011852 carbon nanoparticle Substances 0.000 claims 1
- 239000001913 cellulose Substances 0.000 claims 1
- 229920002678 cellulose Polymers 0.000 claims 1
- 229920001940 conductive polymer Polymers 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 238000004049 embossing Methods 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 238000007647 flexography Methods 0.000 claims 1
- 238000003306 harvesting Methods 0.000 claims 1
- 239000004816 latex Substances 0.000 claims 1
- 229920000126 latex Polymers 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000002082 metal nanoparticle Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000002121 nanofiber Substances 0.000 claims 1
- 238000007645 offset printing Methods 0.000 claims 1
- 239000000049 pigment Substances 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000005033 polyvinylidene chloride Substances 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 229920003048 styrene butadiene rubber Polymers 0.000 claims 1
- 230000008542 thermal sensitivity Effects 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000004033 plastic Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/06—Layered products comprising a layer of paper or cardboard specially treated, e.g. surfaced, parchmentised
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/22—Metallic printing; Printing with powdered inks
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0386—Paper sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Paper (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1250366 | 2012-01-13 | ||
| FR1250366A FR2985744B1 (fr) | 2012-01-13 | 2012-01-13 | Procede de fabrication d'une feuille electro-conductrice |
| FR1256336A FR2992663B1 (fr) | 2012-07-02 | 2012-07-02 | Procede de fabrication d'une feuille dont une face comporte une zone de plus grand lisse que le reste de la face |
| FR1256336 | 2012-07-02 | ||
| PCT/EP2012/076829 WO2013104520A1 (fr) | 2012-01-13 | 2012-12-21 | Procédé de fabrication d'une feuille |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| RU2014127750A true RU2014127750A (ru) | 2016-03-10 |
Family
ID=47624005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2014127750A RU2014127750A (ru) | 2012-01-13 | 2012-12-21 | Способ изготовления листового материала |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US9648751B2 (enExample) |
| EP (1) | EP2802711B1 (enExample) |
| JP (1) | JP6378093B2 (enExample) |
| KR (1) | KR102145822B1 (enExample) |
| CN (1) | CN104204353B (enExample) |
| BR (1) | BR112014017150A8 (enExample) |
| CA (1) | CA2861728C (enExample) |
| ES (1) | ES2657018T3 (enExample) |
| NO (1) | NO2802711T3 (enExample) |
| PT (1) | PT2802711T (enExample) |
| RU (1) | RU2014127750A (enExample) |
| TW (1) | TWI567758B (enExample) |
| WO (1) | WO2013104520A1 (enExample) |
| ZA (1) | ZA201404227B (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2954361B1 (fr) | 2009-12-23 | 2012-06-15 | Arjo Wiggins Fine Papers Ltd | Feuille imprimable ultra lisse et recyclable et son procede de fabrication |
| FR3012153B1 (fr) * | 2013-10-21 | 2016-03-04 | Arjo Wiggins Fine Papers Ltd | Papier destine en particulier a l'impression d'une couche electro-conductrice |
| WO2015163281A1 (ja) * | 2014-04-22 | 2015-10-29 | 王子ホールディングス株式会社 | 複合体及びその製造方法 |
| US20180037009A1 (en) * | 2015-02-13 | 2018-02-08 | Centitvc- Centro De Nanotecnologia E Materiais Técnicos, Funcionais E Inteligentes | Wood derived multilayer product with integrated electric circuit and manufacturing process |
| US9650746B2 (en) * | 2015-06-11 | 2017-05-16 | Golden Arrow Printing Co., Ltd. | Pulp molding process and paper-shaped article made thereby |
| JP6986896B2 (ja) * | 2016-09-08 | 2021-12-22 | アイカ工業株式会社 | 熱硬化性樹脂化粧板及び天板並びに熱硬化性樹脂化粧板の製造方法 |
| CN110036433A (zh) * | 2016-09-27 | 2019-07-19 | 伊努鲁有限公司 | 电子器件的无损集成 |
| EP3405011B1 (en) * | 2017-05-16 | 2025-09-10 | Fedrigoni S.P.A. | Paper-in-resin electronics - process for producing it |
| WO2020076876A1 (en) | 2018-10-09 | 2020-04-16 | Reelables, Inc. | Low-power electronic tape for tracking items |
| US12322270B2 (en) | 2018-10-09 | 2025-06-03 | Reelables, Inc. | Method of fabrication of low-power electronic tape for tracking items |
| EP3643500A1 (en) * | 2018-10-25 | 2020-04-29 | HIDRIA d.o.o. | Method for the production of a laminated core |
| RU2714631C1 (ru) * | 2019-06-14 | 2020-02-18 | Иван Сергеевич Демидов | Плоский листовой материал с радиочастотной идентификацией |
| JP7268548B2 (ja) * | 2019-09-03 | 2023-05-08 | 王子ホールディングス株式会社 | 疑似接着紙用原紙、疑似接着紙および配送伝票用紙 |
| KR20220006670A (ko) | 2020-07-08 | 2022-01-18 | 삼성디스플레이 주식회사 | 표시 장치 |
| CN111976236B (zh) * | 2020-09-01 | 2021-03-12 | 无锡睿龙新材料科技有限公司 | 一种多层聚合表面功能改性电子纤维布挠性高频覆铜板的制备方法 |
| CN112793321A (zh) * | 2020-12-02 | 2021-05-14 | 东莞市美盈森环保科技有限公司 | 纸塑材料上的电子油墨印刷工艺 |
| IT202100010964A1 (it) * | 2021-04-30 | 2022-10-30 | Arti Grafiche Nidasio Digital S R L | Metodo per la realizzazione di un prodotto in prevalenza cartaceo includente, al proprio interno, almeno un ricetrasmettitore di onde elettromagnetiche a radiofrequenza |
| FR3135869A1 (fr) * | 2022-05-20 | 2023-11-24 | Rodolphe Koehly | Procédé de fabrication de ressources industrielles sous la forme de matériaux composites en couches complexes électriquement fonctionnelles |
| US11828027B1 (en) * | 2022-08-31 | 2023-11-28 | Packaging And Crating Technologies, Llc | Fire resistant retail product packaging materials and method of manufacturing same |
| CN117656491B (zh) * | 2023-12-12 | 2024-04-19 | 广州洁诺净化设备有限公司 | 一种电芯隔热片生产线、生产工艺方法及控制系统 |
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| CN102318450B (zh) * | 2008-02-05 | 2016-10-19 | 普林斯顿大学理事会 | 印刷电子设备 |
| DE102008013073B4 (de) | 2008-03-06 | 2011-02-03 | Leonhard Kurz Stiftung & Co. Kg | Verfahren zur Herstellung eines Folienelements und Folienelement |
| WO2009118761A2 (en) | 2008-03-24 | 2009-10-01 | Bhandari Mohan Harakchand | Metallized paper based lidding material for blister packaging & process thereof |
| JP5188915B2 (ja) * | 2008-09-30 | 2013-04-24 | 富士フイルム株式会社 | 配線形成方法 |
| US20110079344A1 (en) * | 2009-10-03 | 2011-04-07 | Victor Shi-Yueh Sheu | Method for making a thin film having a metallic pattern layer |
| FR2954361B1 (fr) * | 2009-12-23 | 2012-06-15 | Arjo Wiggins Fine Papers Ltd | Feuille imprimable ultra lisse et recyclable et son procede de fabrication |
| KR102156532B1 (ko) | 2010-09-01 | 2020-09-16 | 엔티에이치 디그리 테크놀로지스 월드와이드 인코포레이티드 | 발광, 발전 또는 기타 전자 장치 및 이의 제조 방법 |
| WO2013027220A2 (en) * | 2011-08-24 | 2013-02-28 | Digiflex Ltd. | Process for dry-coating of flexogarphic surfaces |
-
2012
- 2012-12-21 US US14/365,562 patent/US9648751B2/en active Active
- 2012-12-21 CN CN201280067043.0A patent/CN104204353B/zh not_active Expired - Fee Related
- 2012-12-21 BR BR112014017150A patent/BR112014017150A8/pt not_active Application Discontinuation
- 2012-12-21 PT PT128189982T patent/PT2802711T/pt unknown
- 2012-12-21 RU RU2014127750A patent/RU2014127750A/ru unknown
- 2012-12-21 CA CA2861728A patent/CA2861728C/fr not_active Expired - Fee Related
- 2012-12-21 EP EP12818998.2A patent/EP2802711B1/fr active Active
- 2012-12-21 ES ES12818998.2T patent/ES2657018T3/es active Active
- 2012-12-21 KR KR1020147022561A patent/KR102145822B1/ko not_active Expired - Fee Related
- 2012-12-21 JP JP2014551565A patent/JP6378093B2/ja not_active Expired - Fee Related
- 2012-12-21 NO NO12818998A patent/NO2802711T3/no unknown
- 2012-12-21 WO PCT/EP2012/076829 patent/WO2013104520A1/fr not_active Ceased
-
2013
- 2013-01-10 TW TW102100911A patent/TWI567758B/zh not_active IP Right Cessation
-
2014
- 2014-06-09 ZA ZA2014/04227A patent/ZA201404227B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| BR112014017150A8 (pt) | 2017-07-04 |
| CN104204353B (zh) | 2017-08-15 |
| EP2802711A1 (fr) | 2014-11-19 |
| US20140322500A1 (en) | 2014-10-30 |
| PT2802711T (pt) | 2018-01-30 |
| WO2013104520A1 (fr) | 2013-07-18 |
| CA2861728C (fr) | 2020-04-28 |
| CN104204353A (zh) | 2014-12-10 |
| TW201342399A (zh) | 2013-10-16 |
| CA2861728A1 (fr) | 2013-07-18 |
| KR20140128332A (ko) | 2014-11-05 |
| US9648751B2 (en) | 2017-05-09 |
| JP2015511182A (ja) | 2015-04-16 |
| ES2657018T3 (es) | 2018-03-01 |
| NO2802711T3 (enExample) | 2018-03-24 |
| JP6378093B2 (ja) | 2018-08-22 |
| TWI567758B (zh) | 2017-01-21 |
| KR102145822B1 (ko) | 2020-08-28 |
| BR112014017150A2 (pt) | 2017-06-13 |
| ZA201404227B (en) | 2015-09-30 |
| EP2802711B1 (fr) | 2017-10-25 |
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