BR112014017150A2 - método para a produção de uma folha - Google Patents

método para a produção de uma folha

Info

Publication number
BR112014017150A2
BR112014017150A2 BR112014017150A BR112014017150A BR112014017150A2 BR 112014017150 A2 BR112014017150 A2 BR 112014017150A2 BR 112014017150 A BR112014017150 A BR 112014017150A BR 112014017150 A BR112014017150 A BR 112014017150A BR 112014017150 A2 BR112014017150 A2 BR 112014017150A2
Authority
BR
Brazil
Prior art keywords
layer
base layer
electroconductive
sheet
base
Prior art date
Application number
BR112014017150A
Other languages
English (en)
Other versions
BR112014017150A8 (pt
Inventor
Depres Gaël
Vau Jean-Marie
Original Assignee
Arjo Wiggins Fine Papers Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=47624005&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=BR112014017150(A2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from FR1250366A external-priority patent/FR2985744B1/fr
Priority claimed from FR1256336A external-priority patent/FR2992663B1/fr
Application filed by Arjo Wiggins Fine Papers Ltd filed Critical Arjo Wiggins Fine Papers Ltd
Publication of BR112014017150A2 publication Critical patent/BR112014017150A2/pt
Publication of BR112014017150A8 publication Critical patent/BR112014017150A8/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/06—Layered products comprising a layer of paper or cardboard specially treated, e.g. surfaced, parchmentised
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/22—Metallic printing; Printing with powdered inks
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0386—Paper sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Abstract

resumo “método para a produção de uma folha” método para a produção de uma folha eletrocondutiva, esta folha que compreende um substrato, em particular, feita de papel, e uma camada eletrocondutiva, o método compreendendo as etapas de: a) preparação de uma estrutura multi-camada compreendendo uma película de plástico, um revestimento anti-adesivo, e uma camada de base, com o revestimento anti-adesivo inserido entre a película de plástico e a camada de base, b) trans-laminação da estrutura multi-camada e o substrato, e c) a remoção da película de plástico e o revestimento anti-adesivo a partir do camada de base, em que a camada de base é uma camada de um material eletrocondutivo ou está coberto com uma camada eletrocondutiva de uma etapa adicional que consiste em: d1) depositar uma película eletrocondutiva sobre a camada de base; ou d2) impressão da camada de base com, pelo menos, uma tinta com propriedades elétricas, com a camada de base, sendo uma camada de impressão com uma base de aglutinante de que a taxa é 15% maior, em peso seco em relação ao peso total de matéria seca da camada.
BR112014017150A 2012-01-13 2012-12-21 método para a produção de uma folha BR112014017150A8 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1250366A FR2985744B1 (fr) 2012-01-13 2012-01-13 Procede de fabrication d'une feuille electro-conductrice
FR1256336A FR2992663B1 (fr) 2012-07-02 2012-07-02 Procede de fabrication d'une feuille dont une face comporte une zone de plus grand lisse que le reste de la face
PCT/EP2012/076829 WO2013104520A1 (fr) 2012-01-13 2012-12-21 Procédé de fabrication d'une feuille

Publications (2)

Publication Number Publication Date
BR112014017150A2 true BR112014017150A2 (pt) 2017-06-13
BR112014017150A8 BR112014017150A8 (pt) 2017-07-04

Family

ID=47624005

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014017150A BR112014017150A8 (pt) 2012-01-13 2012-12-21 método para a produção de uma folha

Country Status (14)

Country Link
US (1) US9648751B2 (pt)
EP (1) EP2802711B1 (pt)
JP (1) JP6378093B2 (pt)
KR (1) KR102145822B1 (pt)
CN (1) CN104204353B (pt)
BR (1) BR112014017150A8 (pt)
CA (1) CA2861728C (pt)
ES (1) ES2657018T3 (pt)
NO (1) NO2802711T3 (pt)
PT (1) PT2802711T (pt)
RU (1) RU2014127750A (pt)
TW (1) TWI567758B (pt)
WO (1) WO2013104520A1 (pt)
ZA (1) ZA201404227B (pt)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2954361B1 (fr) 2009-12-23 2012-06-15 Arjo Wiggins Fine Papers Ltd Feuille imprimable ultra lisse et recyclable et son procede de fabrication
FR3012153B1 (fr) * 2013-10-21 2016-03-04 Arjo Wiggins Fine Papers Ltd Papier destine en particulier a l'impression d'une couche electro-conductrice
EP3135488B1 (en) 2014-04-22 2023-12-06 Oji Holdings Corporation Composite and method for producing the same
WO2016128953A1 (en) * 2015-02-13 2016-08-18 Centi - Centro De Nanotecnologia E Materiais Técnicos Funcionais E Inteligentes Wood derived multilayer product with integrated electric circuit and manufacturing process
US9650746B2 (en) * 2015-06-11 2017-05-16 Golden Arrow Printing Co., Ltd. Pulp molding process and paper-shaped article made thereby
JP6986896B2 (ja) * 2016-09-08 2021-12-22 アイカ工業株式会社 熱硬化性樹脂化粧板及び天板並びに熱硬化性樹脂化粧板の製造方法
WO2018060256A1 (de) * 2016-09-27 2018-04-05 Inuru Gmbh Destruktionslose integration von elektronik
EP3405011A1 (en) * 2017-05-16 2018-11-21 Arjo Wiggins Fine Papers Limited Paper-in-resin electronics - process for producing it and application in manufactured products
WO2020076876A1 (en) 2018-10-09 2020-04-16 Reelables, Inc. Low-power electronic tape for tracking items
EP3643500A1 (en) * 2018-10-25 2020-04-29 HIDRIA d.o.o. Method for the production of a laminated core
RU2714631C1 (ru) * 2019-06-14 2020-02-18 Иван Сергеевич Демидов Плоский листовой материал с радиочастотной идентификацией
JP7268548B2 (ja) * 2019-09-03 2023-05-08 王子ホールディングス株式会社 疑似接着紙用原紙、疑似接着紙および配送伝票用紙
KR20220006670A (ko) 2020-07-08 2022-01-18 삼성디스플레이 주식회사 표시 장치
CN111976236B (zh) * 2020-09-01 2021-03-12 无锡睿龙新材料科技有限公司 一种多层聚合表面功能改性电子纤维布挠性高频覆铜板的制备方法
CN112793321A (zh) * 2020-12-02 2021-05-14 东莞市美盈森环保科技有限公司 纸塑材料上的电子油墨印刷工艺
IT202100010964A1 (it) * 2021-04-30 2022-10-30 Arti Grafiche Nidasio Digital S R L Metodo per la realizzazione di un prodotto in prevalenza cartaceo includente, al proprio interno, almeno un ricetrasmettitore di onde elettromagnetiche a radiofrequenza
FR3135869A1 (fr) * 2022-05-20 2023-11-24 Rodolphe Koehly Procédé de fabrication de ressources industrielles sous la forme de matériaux composites en couches complexes électriquement fonctionnelles
US11828027B1 (en) * 2022-08-31 2023-11-28 Packaging And Crating Technologies, Llc Fire resistant retail product packaging materials and method of manufacturing same
CN117656491B (zh) * 2023-12-12 2024-04-19 广州洁诺净化设备有限公司 一种电芯隔热片生产线、生产工艺方法及控制系统

Family Cites Families (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2747241C2 (de) 1977-10-21 1986-03-20 Helmuth 2058 Lauenburg Schmoock Verfahren zur Herstellung einer Schichtstoffkombination
US4349402A (en) 1980-02-08 1982-09-14 Transfer Print Foils, Inc. Method for producing a bright metalized foil or board
US4292397A (en) * 1980-04-17 1981-09-29 Dai Nippon Printing Co., Ltd. Method for preparing dry planographic plates with plasma
EP0038878A1 (en) 1980-04-28 1981-11-04 Koninklijke Emballage Industrie Van Leer B.V. Transfer metallizing process
DE3506278A1 (de) 1985-02-22 1986-08-28 Inst Zellstoff & Papier Verfahren zur verbesserung des holdouts von druckfarben, lacken und beschichtungsmassen auf flaechengebilden aus fasern sowie masse zur durchfuehrung des verfahrens und damit erzeugte flaechengebilde
JPH072426B2 (ja) 1985-06-18 1995-01-18 キヤノン株式会社 インクジエツト記録方法
JP2542187B2 (ja) 1986-03-12 1996-10-09 日本製紙株式会社 感熱転写記録用受像シ−ト
JPH02205311A (ja) 1989-02-03 1990-08-15 Fujitsu Ltd 厚膜コンデンサの製造方法
JPH02209797A (ja) * 1989-02-09 1990-08-21 Matsushita Electric Ind Co Ltd フレキシブルプリント回路用基板の製造方法
US5256621A (en) 1990-04-24 1993-10-26 Oji Paper Co., Ltd. Thermal transfer image-receiving sheet
EP0798126B1 (en) 1990-09-07 2003-10-22 Dai Nippon Printing Co., Ltd. Thermal transfer image receiving sheet, production process therefor and thermal transfer sheet
JPH04363292A (ja) 1990-09-27 1992-12-16 Dainippon Printing Co Ltd 熱転写受像シートの製造方法及び熱転写受像シート
JPH04163082A (ja) * 1990-10-25 1992-06-08 Nisshinbo Ind Inc 高精細な印刷が可能な印刷用紙
FR2672008B1 (fr) 1991-01-29 1994-09-02 Cros Jean Pierre Materiau pour impression et procede et installation d'impression au moyen de ce materiau.
GB9203568D0 (en) 1992-02-20 1992-04-08 Amblehurst Ltd Transfer method and device
JPH06297865A (ja) 1993-04-16 1994-10-25 Dainippon Printing Co Ltd 熱転写受像シート
JP3404602B2 (ja) 1993-12-02 2003-05-12 大日本印刷株式会社 中間転写記録媒体及び画像形成物
WO1997018090A1 (en) * 1995-11-13 1997-05-22 Kimberly-Clark Worldwide, Inc. Image-receptive coating
US5824120A (en) 1996-04-10 1998-10-20 Valence Technology, Inc. Electrically conductive adhesion promoters for current collectors
DE19628341C2 (de) 1996-07-13 1998-09-17 Sihl Gmbh Aufzeichnungsmaterial für Tintenstrahlverfahren mit wäßriger Tinte und Verwendung zum Herstellen wasserfester und lichtbeständiger Aufzeichnungen auf diesem Material
JPH10250245A (ja) 1997-03-17 1998-09-22 Mitsubishi Paper Mills Ltd 記録用紙
GB2323800B (en) * 1997-03-31 2000-12-27 Somar Corp Ink-jet recording film having improved ink fixing
JP3594788B2 (ja) 1997-06-16 2004-12-02 日東電工株式会社 印刷シート
US6215508B1 (en) 1997-10-15 2001-04-10 Robert A. Bryan Reverse image printing apparatus, cartridge and label, and method of making the same
JP2000001097A (ja) 1998-06-16 2000-01-07 Dainippon Printing Co Ltd 化粧材の製造方法
US6551692B1 (en) 1998-09-10 2003-04-22 Jodi A. Dalvey Image transfer sheet
EP1035504B2 (de) 1999-02-10 2003-08-06 X-ident technology GmbH RFID-Transponder mit bedruckbarer Oberfläche
CA2371258A1 (en) 1999-04-23 2000-11-02 Scott Williams Coated transfer sheet comprising a thermosetting or uv curable material
US6513434B1 (en) * 1999-05-17 2003-02-04 Fuji Photo Film Co., Ltd. On-press recording type lithographic printing method and apparatus
JP2001191478A (ja) * 2000-01-14 2001-07-17 Fuji Photo Film Co Ltd 機上描画平版印刷方法及び機上描画平版印刷装置
AU1731701A (en) * 1999-12-07 2001-06-18 Oji-Yuka Synthetic Paper Co., Ltd. Porous resin film
JP2001202021A (ja) 2000-01-17 2001-07-27 Nitto Denko Corp 印刷用シートの製造方法
EP1134694A1 (de) 2000-03-16 2001-09-19 Infineon Technologies AG Dokument mit integrierter elektronischer Schaltung
GB0007627D0 (en) 2000-03-30 2000-05-17 Sericol Ltd A radiation curable composition
US6465081B2 (en) * 2000-04-17 2002-10-15 3M Innovative Properties Company Image receptor sheet
DE60100682T2 (de) 2000-06-01 2004-03-11 Oji Paper Co., Ltd. Wärmeempfindliches Aufzeichnungsmaterial
WO2002031214A1 (de) 2000-10-09 2002-04-18 Hueck Folien Metallisierte folie und verfahren zu deren herstellung sowie deren anwendung
WO2003020519A1 (en) 2001-09-05 2003-03-13 Api Foils Limited Dieless foiling
US6819348B2 (en) * 2001-09-12 2004-11-16 Dai Nippon Printing Co., Ltd. Thermal transfer film, process for producing the same and method for image formation using said thermal transfer film
CA2465124A1 (en) 2001-11-01 2003-05-08 Yissum Research Development Company Of The Hebrew University In Jerusalem Ink-jet inks containing metal nanoparticles
DE10222433A1 (de) 2002-05-22 2003-12-11 Kurz Leonhard Fa Streifenförmiges Sicherheitselement
US6881458B2 (en) * 2002-06-03 2005-04-19 3M Innovative Properties Company Ink jet receptive coating
ES2439446T3 (es) 2002-10-02 2014-01-23 Leonhard Kurz Stiftung & Co. Kg Lámina con semiconductores orgánicos
CA2503202A1 (en) 2002-10-23 2004-05-06 Graphic Packaging International, Inc. Multi-layer metallized packaging material and method of making same
ES2548627T3 (es) 2003-01-30 2015-10-19 Pst Sensors (Pty) Limited Dispositivo semiconductor de película fina y procedimiento de fabricación de un dispositivo semiconductor de película fina
US6816125B2 (en) 2003-03-01 2004-11-09 3M Innovative Properties Company Forming electromagnetic communication circuit components using densified metal powder
JP2004265827A (ja) 2003-03-04 2004-09-24 Seiko Precision Inc Ｅｌシート
AT504572A1 (de) 2004-03-26 2008-06-15 Hueck Folien Gmbh Folienmaterial mit optischen merkmalen
DE102004014778A1 (de) 2004-03-26 2005-10-13 Leonard Kurz Gmbh & Co. Kg Sicherheits- und/oder Wertdokument
US7189676B2 (en) 2004-04-21 2007-03-13 Eastman Kodak Company Crosslinked copolymer dye-receiving layer
US20060073417A1 (en) * 2004-04-23 2006-04-06 Mark Hermesdorf Photopolymer plate and method for imaging the surface of a photopolymer plate
JP2006026522A (ja) 2004-07-15 2006-02-02 Seiko Epson Corp 薄膜パターンの形成方法、デバイスおよびその製造方法
DE102004045211B4 (de) 2004-09-17 2015-07-09 Ovd Kinegram Ag Sicherheitsdokument mit elektrisch gesteuertem Anzeigenelement
DE102004059465A1 (de) 2004-12-10 2006-06-14 Polyic Gmbh & Co. Kg Erkennungssystem
US20060189113A1 (en) 2005-01-14 2006-08-24 Cabot Corporation Metal nanoparticle compositions
DE102005017169B4 (de) 2005-04-13 2023-06-22 Ovd Kinegram Ag Transferfolie
JP2007011534A (ja) * 2005-06-29 2007-01-18 Oji Paper Co Ltd Ｉｃチップ内蔵シート
DE102005031448A1 (de) 2005-07-04 2007-01-11 Polyic Gmbh & Co. Kg Aktivierbare optische Schicht
WO2007045431A1 (de) 2005-10-20 2007-04-26 Man Roland Druckmaschinen Ag Herstellverfahren für verpackungs- und werbemittel
JP2009520251A (ja) 2005-12-09 2009-05-21 ケー． ビー．，インコーポレイテッド 高周波識別（ｒｆｉｄ）アンテナを含む導電パターンを作製するための方法及び材料
DE102006048523A1 (de) 2005-12-27 2007-08-02 Man Roland Druckmaschinen Ag Überdruckbare Prägebeschichtung
CN101491166B (zh) 2006-06-14 2011-09-28 巴斯夫欧洲公司 在载体上生产导电表面的方法
US20090233015A1 (en) 2006-07-24 2009-09-17 Tokuyama Corporation Printing sheet
US20080187651A1 (en) * 2006-10-24 2008-08-07 3M Innovative Properties Company Conductive ink formulations
US20080131590A1 (en) 2006-12-04 2008-06-05 Illinois Tool Works Inc. Method for printing electrically conductive circuits
US20080264682A1 (en) 2007-04-24 2008-10-30 John Catron Substrate and negative imaging method for providing transparent conducting patterns
DE102007048102A1 (de) 2007-10-06 2009-04-09 Leonhard Kurz Gmbh & Co. Kg Sicherheitselement zur Kennzeichnung eines Sicherheitsdokuments und Verfahren zu seiner Herstellung
DE102007051930A1 (de) 2007-10-29 2009-04-30 Leonhard Kurz Gmbh & Co. Kg Verfahren zur Herstellung einer Leiterbahnstruktur
JP5457371B2 (ja) 2008-02-05 2014-04-02 ザ、トラスティーズ オブ プリンストン ユニバーシティ 印刷電子機器
DE102008013073B4 (de) 2008-03-06 2011-02-03 Leonhard Kurz Stiftung & Co. Kg Verfahren zur Herstellung eines Folienelements und Folienelement
WO2009118761A2 (en) 2008-03-24 2009-10-01 Bhandari Mohan Harakchand Metallized paper based lidding material for blister packaging & process thereof
JP5188915B2 (ja) * 2008-09-30 2013-04-24 富士フイルム株式会社 配線形成方法
US20110079344A1 (en) 2009-10-03 2011-04-07 Victor Shi-Yueh Sheu Method for making a thin film having a metallic pattern layer
FR2954361B1 (fr) 2009-12-23 2012-06-15 Arjo Wiggins Fine Papers Ltd Feuille imprimable ultra lisse et recyclable et son procede de fabrication
KR102321916B1 (ko) 2010-09-01 2021-11-05 엔티에이치 디그리 테크놀로지스 월드와이드 인코포레이티드 발광, 발전 또는 기타 전자 장치 및 이의 제조 방법
EP2748677A2 (en) * 2011-08-24 2014-07-02 Digiflex Ltd. Process for dry-coating of flexographic surfaces

Also Published As

Publication number Publication date
JP2015511182A (ja) 2015-04-16
RU2014127750A (ru) 2016-03-10
CA2861728A1 (fr) 2013-07-18
CN104204353A (zh) 2014-12-10
KR102145822B1 (ko) 2020-08-28
US9648751B2 (en) 2017-05-09
NO2802711T3 (pt) 2018-03-24
CN104204353B (zh) 2017-08-15
PT2802711T (pt) 2018-01-30
TWI567758B (zh) 2017-01-21
TW201342399A (zh) 2013-10-16
KR20140128332A (ko) 2014-11-05
JP6378093B2 (ja) 2018-08-22
BR112014017150A8 (pt) 2017-07-04
US20140322500A1 (en) 2014-10-30
ZA201404227B (en) 2015-09-30
EP2802711A1 (fr) 2014-11-19
ES2657018T3 (es) 2018-03-01
CA2861728C (fr) 2020-04-28
WO2013104520A1 (fr) 2013-07-18
EP2802711B1 (fr) 2017-10-25

Similar Documents

Publication Publication Date Title
BR112014017150A2 (pt) método para a produção de uma folha
BR112015012286A2 (pt) processo para produção de uma placa de material dotada de uma camada decorativa
BR112015021536A2 (pt) arranjo, laminado e método para reduzir resistência aerodinâmica sobre um substrato
BR112015009655A2 (pt) método e aparelho para formar em um substrato um padrão de um material
MX2016002395A (es) Composiciones de revestimiento y aglutinantes para placas de yeso.
BR112016001879A2 (pt) Composição de múltiplas camadas para embalagem, e, método de preparação de uma composição de múltiplas camadas para embalagem
BR112013017149A2 (pt) película ou espuma microcapilar, estrutura e multicamada e artigo
BR112013007104A2 (pt) método de produzir um material de embalagem para uma embalagem retortável
MX2016003150A (es) Formulaciones de tinta y construcciones de películas de las mismas.
MX2014002440A (es) Composicion laminada, pelicula y metodos relacionados.
MX363312B (es) Lamina de seguridad que comprende un soporte coextruido.
BR112015018774A2 (pt) artigo e método para exibição de um gráfico
BR112014031779A2 (pt) filme com propriedades antiestáticas e seu método de fabricação, uso de um filme antiestático e artigo de manufatura
BR112016017565A2 (pt) Película de embalagem
BR112015029292A2 (pt) portador de esporos nanoestruturado
MX2013011753A (es) Poliesteres hiper - ramificados en tintas de impresion.
BR112017027904A2 (pt) processo para produção de um laminado consistindo em uma placa de suporte e em papel decorativo disposto sobre a placa de suporte
BR112015009750A2 (pt) método para preparo de uma poliolefina adesivada, poliolefina adesivada, uso de uma poliolefina, e, artigo de manufatura
BR112016006775A2 (pt) pilha de filmes ópticos e artigo
BR112015021776A2 (pt) material de gravação termossensível
MY161746A (en) Composition for forming low-refractive-index film, method of forming low-refractive-index film, and low-refractive-index film and antireflective film both formed by the formation method
BR112016020935A8 (pt) Método para produção de nanocelulose, seus precursores e concentrados
BR112016001115A8 (pt) papel resistente ao bolor e painel de gesso, revestimento de papel antimicrobiano e métodos relacionados
BR112013025621A2 (pt) materiais de multicamadas para a produção de acondicionamento, uso de poliéster hiper-ramificado, e, tintas de impressão
BR112019015439A8 (pt) Compósito tipo folha, método e uso do compósito tipo folha

Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]