PT2802711T - Método de fabrico de uma folha - Google Patents

Método de fabrico de uma folha

Info

Publication number
PT2802711T
PT2802711T PT128189982T PT12818998T PT2802711T PT 2802711 T PT2802711 T PT 2802711T PT 128189982 T PT128189982 T PT 128189982T PT 12818998 T PT12818998 T PT 12818998T PT 2802711 T PT2802711 T PT 2802711T
Authority
PT
Portugal
Prior art keywords
sheet
producing
Prior art date
Application number
PT128189982T
Other languages
English (en)
Inventor
Depres Gaël
Marie Vau Jean
Original Assignee
Arjo Wiggins Fine Papers Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=47624005&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PT2802711(T) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from FR1250366A external-priority patent/FR2985744B1/fr
Priority claimed from FR1256336A external-priority patent/FR2992663B1/fr
Application filed by Arjo Wiggins Fine Papers Ltd filed Critical Arjo Wiggins Fine Papers Ltd
Publication of PT2802711T publication Critical patent/PT2802711T/pt

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00Layered products comprising a layer of paper or cardboard
    • B32B29/06Layered products comprising a layer of paper or cardboard specially treated, e.g. surfaced, parchmentised
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/22Metallic printing; Printing with powdered inks
    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21HPULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00Special paper not otherwise provided for, e.g. made by multi-step processes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0386Paper sheets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
PT128189982T 2012-01-13 2012-12-21 Método de fabrico de uma folha PT2802711T (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1250366A FR2985744B1 (fr) 2012-01-13 2012-01-13 Procede de fabrication d'une feuille electro-conductrice
FR1256336A FR2992663B1 (fr) 2012-07-02 2012-07-02 Procede de fabrication d'une feuille dont une face comporte une zone de plus grand lisse que le reste de la face

Publications (1)

Publication Number Publication Date
PT2802711T true PT2802711T (pt) 2018-01-30

Family

ID=47624005

Family Applications (1)

Application Number Title Priority Date Filing Date
PT128189982T PT2802711T (pt) 2012-01-13 2012-12-21 Método de fabrico de uma folha

Country Status (14)

Country Link
US (1) US9648751B2 (pt)
EP (1) EP2802711B1 (pt)
JP (1) JP6378093B2 (pt)
KR (1) KR102145822B1 (pt)
CN (1) CN104204353B (pt)
BR (1) BR112014017150A8 (pt)
CA (1) CA2861728C (pt)
ES (1) ES2657018T3 (pt)
NO (1) NO2802711T3 (pt)
PT (1) PT2802711T (pt)
RU (1) RU2014127750A (pt)
TW (1) TWI567758B (pt)
WO (1) WO2013104520A1 (pt)
ZA (1) ZA201404227B (pt)

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CN106457798A (zh) 2014-04-22 2017-02-22 王子控股株式会社 复合体及其制造方法
EP3256314B1 (en) * 2015-02-13 2020-08-26 CENTITVC - Centro de Nanotecnologia e Materiais Tecnicos, Funcionais e Inteligentes Wood derived multilayer product with integrated electric circuit and manufacturing process
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CN115116349A (zh) * 2016-09-27 2022-09-27 伊努鲁有限公司 电子器件的无损集成
EP3405011A1 (en) * 2017-05-16 2018-11-21 Arjo Wiggins Fine Papers Limited Paper-in-resin electronics - process for producing it and application in manufactured products
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EP3643500A1 (en) * 2018-10-25 2020-04-29 HIDRIA d.o.o. Method for the production of a laminated core
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JP7268548B2 (ja) * 2019-09-03 2023-05-08 王子ホールディングス株式会社 疑似接着紙用原紙、疑似接着紙および配送伝票用紙
KR20220006670A (ko) 2020-07-08 2022-01-18 삼성디스플레이 주식회사 표시 장치
CN111976236B (zh) * 2020-09-01 2021-03-12 无锡睿龙新材料科技有限公司 一种多层聚合表面功能改性电子纤维布挠性高频覆铜板的制备方法
CN112793321A (zh) * 2020-12-02 2021-05-14 东莞市美盈森环保科技有限公司 纸塑材料上的电子油墨印刷工艺
IT202100010964A1 (it) * 2021-04-30 2022-10-30 Arti Grafiche Nidasio Digital S R L Metodo per la realizzazione di un prodotto in prevalenza cartaceo includente, al proprio interno, almeno un ricetrasmettitore di onde elettromagnetiche a radiofrequenza
FR3135869A1 (fr) * 2022-05-20 2023-11-24 Rodolphe Koehly Procédé de fabrication de ressources industrielles sous la forme de matériaux composites en couches complexes électriquement fonctionnelles
US11828027B1 (en) * 2022-08-31 2023-11-28 Packaging And Crating Technologies, Llc Fire resistant retail product packaging materials and method of manufacturing same
CN117656491B (zh) * 2023-12-12 2024-04-19 广州洁诺净化设备有限公司 一种电芯隔热片生产线、生产工艺方法及控制系统

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Also Published As

Publication number Publication date
US20140322500A1 (en) 2014-10-30
TWI567758B (zh) 2017-01-21
EP2802711B1 (fr) 2017-10-25
BR112014017150A8 (pt) 2017-07-04
CA2861728A1 (fr) 2013-07-18
RU2014127750A (ru) 2016-03-10
JP6378093B2 (ja) 2018-08-22
KR20140128332A (ko) 2014-11-05
CN104204353B (zh) 2017-08-15
CA2861728C (fr) 2020-04-28
ZA201404227B (en) 2015-09-30
CN104204353A (zh) 2014-12-10
NO2802711T3 (pt) 2018-03-24
WO2013104520A1 (fr) 2013-07-18
US9648751B2 (en) 2017-05-09
EP2802711A1 (fr) 2014-11-19
KR102145822B1 (ko) 2020-08-28
BR112014017150A2 (pt) 2017-06-13
JP2015511182A (ja) 2015-04-16
ES2657018T3 (es) 2018-03-01
TW201342399A (zh) 2013-10-16

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