JP2009520251A - 高周波識別(rfid)アンテナを含む導電パターンを作製するための方法及び材料 - Google Patents
高周波識別(rfid)アンテナを含む導電パターンを作製するための方法及び材料 Download PDFInfo
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- JP2009520251A JP2009520251A JP2008544542A JP2008544542A JP2009520251A JP 2009520251 A JP2009520251 A JP 2009520251A JP 2008544542 A JP2008544542 A JP 2008544542A JP 2008544542 A JP2008544542 A JP 2008544542A JP 2009520251 A JP2009520251 A JP 2009520251A
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- layer
- conductive metal
- adhesive layer
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- conductive
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0522—Using an adhesive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
Abstract
【選択図】 図5
Description
Claims (24)
- 導電性金属(24)層を剥離被覆剤(20)層の隣に供給する工程と、
パターン化された接着剤層(40)をターゲット基材(42)の隣に供給する工程と、
前記導電性金属(24)層の対応部分(70)が前記パターン化された接着剤層(40)に接触するように、前記導電性金属(24)層と前記パターン化された接着剤層(40)とを接触させる工程と、
前記剥離被覆剤(20)から前記導電性金属(24)層の対応部分(70)を剥ぎ取るように前記パターン化された接着剤層(40)を利用する工程と備えてなる、導電パターン化されたフィルム(74)の製造方法。 - 前記導電パターン化されたフィルム(74)が、RFIDアンテナである請求項1記載の方法。
- 前記導電性金属(24)層が、銅、銀、若しくはアルミニウムの少なくとも1つを備えてなる請求項1記載の方法。
- 前記導電性金属(24)層が、約5〜約1,000オングストロームの厚さである請求項1記載の方法。
- 前記剥離被覆剤(20)層が、ニトロセルロール、アクリル、エポキシ、ポリエステル、ポリエーテル、ケトン、ポリアミド、シリコン、エポキシアクリレート、シリコンアクリレート、ポリエステルアクリレート、ポリエーテルアクリレート、アクリル酸のエステル類、単機能アクリレート樹脂類、多機能アクリレート樹脂類、又はポリエステルアクリレートをベースとするオリゴマーアクリレートポリマー類若しくはポリエーテルアクリレート樹脂類の組み合わせの少なくとも1つを備えてなる請求項1記載の方法。
- 前記剥離被覆剤(20)層が、3,000平方フィート当たり0.025〜5.0lbsの厚さで塗布されてなる請求項1記載の方法。
- さらに、前記剥離被覆剤(20)層の隣にベースポリマー物質(22)層を備えてなる請求項1記載の方法。
- 前記剥離被覆剤(20)層が、前記導電性金属(24)層よりも前記ベースポリマー物質(22)層により一層密着する請求項7記載の方法。
- 前記ベースポリマー物質(22)の層が、ポリオレフィン、ポリエチレン、PET、ポリエステル、熱可塑性ポリエステル、ポリカルボネート、ポリプロピレン、2軸配向されたポリプロピレン(BOPP)、ポリスルホン、若しくはこれらの組み合わせの少なくとも1つを備えてなる請求項7記載の方法。
- 前記パターン化された接着剤層(40)が、導電性経路のパターンにあることを特徴とする請求項1記載の方法。
- 前記パターン化された接着剤層(40)がRFIDアンテナのパターンにあることを特徴とする請求項1記載の方法。
- 前記パターン化された接着剤層(40)が、エネルギー硬化性アクリレート樹脂類、アクリル酸のエステル類、単機能アクリレート樹脂類、多機能アクリレート樹脂類、ポリエステルアクリレートをベースとするオリゴマーアクリレートポリマー類、若しくはポリエステルアクリレート樹脂類を少なくとも1つ備えてなる請求項1記載の方法。
- 前記パターン化された接着剤層(40)が感圧接着剤を備えてなる請求項1記載の方法。
- 前記ターゲット基材(42)が、RFIDタグ若しくはラベルを備えてなる請求項1記載の方法。
- 前記ターゲット基材(42)が、ポリエステル、PET、ポリプロピレン、ポリオレフィン、ポリカーボネート、ポリスルホンを少なくとも1つ備えてなる請求項1記載の方法。
- さらに、前記パターン化された接着剤層を硬化する工程を備えてなる請求項1記載の方法。
- 前記硬化する工程が、対流式オーブン、紫外線硬化ランプ、若しくは電子ビーム硬化ユニットの少なくとも1つによって硬化する工程を備えてなる請求項16記載の方法。
- さらに、前記導電性金属(24)層の隣に電気部品(80)を供給する工程と、該電気部品(80)と前記パターン化された接着剤(40)とを接触させる工程とを備えてなる請求項1記載の方法。
- 前記電気部品(80)がコンピューターチップである請求項18記載の方法。
- 導電性金属(24)層を剥離被覆剤(20)層の隣に供給する工程と、
前記導電性金属(24)層に電気部品(80)を直接付ける工程と、
RFIDアンテナの形にエネルギー硬化性接着剤層(40)をターゲット基材(42)に塗布する工程と、
前記導電性金属(24)層の対応部分(70)が前記エネルギー硬化性接着剤層(40)に接触するように、前記エネルギー硬化性接着剤層(40)及び前記導電性金属(24)を積層する工程とを備えてなり、
前記エネルギー硬化性接着剤層(40)が、前記導電性金属(24)層の対応部分(70)を前記剥離被覆剤(20)から剥離するRFIDアンテナの製造方法。 - 前記電気部品(80)がコンピューターチップである請求項20記載の方法。
- 前記導電性金属(24)層の対応部分(70)が、RFIDアンテナの形である請求項20記載の方法。
- ターゲット基材(42)と、
該ターゲット基材(42)に隣接するパターン化された接着剤層(40)と、
該パターン化された接着剤層(40)に隣接する導電性金属(24)層の対応部分(70)とを備えてなり、
該対応部分(70)が剥離被覆剤(20)層からの剥離によって構築され配置されてなるRFID装置。 - 前記RFID装置が、タグ若しくはラベルである請求項23記載のRFIDアンテナ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US74934905P | 2005-12-09 | 2005-12-09 | |
PCT/US2006/046933 WO2007070391A1 (en) | 2005-12-09 | 2006-12-11 | Method and material for manufacturing electrically conductive patterns, including radio frequency identification (rfid) antennas |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009520251A true JP2009520251A (ja) | 2009-05-21 |
JP2009520251A5 JP2009520251A5 (ja) | 2010-03-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008544542A Pending JP2009520251A (ja) | 2005-12-09 | 2006-12-11 | 高周波識別(rfid)アンテナを含む導電パターンを作製するための方法及び材料 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20090250522A1 (ja) |
EP (1) | EP1964031A1 (ja) |
JP (1) | JP2009520251A (ja) |
KR (1) | KR20080095842A (ja) |
CN (1) | CN101341500B (ja) |
AU (1) | AU2006326694A1 (ja) |
CA (1) | CA2630834A1 (ja) |
WO (1) | WO2007070391A1 (ja) |
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2006
- 2006-12-11 EP EP06839234A patent/EP1964031A1/en not_active Withdrawn
- 2006-12-11 WO PCT/US2006/046933 patent/WO2007070391A1/en active Application Filing
- 2006-12-11 KR KR1020087015850A patent/KR20080095842A/ko not_active Application Discontinuation
- 2006-12-11 CA CA002630834A patent/CA2630834A1/en not_active Abandoned
- 2006-12-11 US US12/095,056 patent/US20090250522A1/en not_active Abandoned
- 2006-12-11 JP JP2008544542A patent/JP2009520251A/ja active Pending
- 2006-12-11 AU AU2006326694A patent/AU2006326694A1/en not_active Abandoned
- 2006-12-11 CN CN2006800462911A patent/CN101341500B/zh not_active Expired - Fee Related
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JP2003209421A (ja) * | 2002-01-17 | 2003-07-25 | Dainippon Printing Co Ltd | 透明アンテナを有するrfidタグ、及びその製造方法 |
JP2004342755A (ja) * | 2003-05-14 | 2004-12-02 | Shinko Electric Ind Co Ltd | 平面コイルの製造方法 |
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JP2016179581A (ja) * | 2015-03-24 | 2016-10-13 | トッパン・フォームズ株式会社 | 複写帳票 |
JP2016201068A (ja) * | 2015-04-14 | 2016-12-01 | トッパン・フォームズ株式会社 | Rfidメディアの製造方法 |
Also Published As
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AU2006326694A1 (en) | 2007-06-21 |
CA2630834A1 (en) | 2007-06-21 |
CN101341500A (zh) | 2009-01-07 |
CN101341500B (zh) | 2011-03-02 |
US20090250522A1 (en) | 2009-10-08 |
KR20080095842A (ko) | 2008-10-29 |
WO2007070391A1 (en) | 2007-06-21 |
EP1964031A1 (en) | 2008-09-03 |
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