KR102134263B1 - 폴리이미드 수지, 폴리이미드 수지 조성물, 그것을 사용한 터치 패널 및 그의 제조 방법, 컬러 필터 및 그의 제조 방법, 액정 소자 및 그의 제조 방법, 유기 el 소자 및 그의 제조 방법 - Google Patents

폴리이미드 수지, 폴리이미드 수지 조성물, 그것을 사용한 터치 패널 및 그의 제조 방법, 컬러 필터 및 그의 제조 방법, 액정 소자 및 그의 제조 방법, 유기 el 소자 및 그의 제조 방법 Download PDF

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KR102134263B1
KR102134263B1 KR1020187033962A KR20187033962A KR102134263B1 KR 102134263 B1 KR102134263 B1 KR 102134263B1 KR 1020187033962 A KR1020187033962 A KR 1020187033962A KR 20187033962 A KR20187033962 A KR 20187033962A KR 102134263 B1 KR102134263 B1 KR 102134263B1
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polyimide resin
polyimide
film
group
resin film
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KR1020187033962A
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Korean (ko)
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KR20190022487A (ko
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아키노리 사에키
가나 가와하라
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도레이 카부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L51/56—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
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    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
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    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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  • Polymers & Plastics (AREA)
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  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
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  • Theoretical Computer Science (AREA)
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  • Mathematical Physics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020187033962A 2016-06-24 2017-06-14 폴리이미드 수지, 폴리이미드 수지 조성물, 그것을 사용한 터치 패널 및 그의 제조 방법, 컬러 필터 및 그의 제조 방법, 액정 소자 및 그의 제조 방법, 유기 el 소자 및 그의 제조 방법 KR102134263B1 (ko)

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Application Number Priority Date Filing Date Title
JPJP-P-2016-125529 2016-06-24
JP2016125529 2016-06-24
PCT/JP2017/021902 WO2017221776A1 (ja) 2016-06-24 2017-06-14 ポリイミド樹脂、ポリイミド樹脂組成物、それを用いたタッチパネルおよびその製造方法、カラーフィルタおよびその製造方法、液晶素子およびその製造方法、有機ｅｌ素子およびその製造方法

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KR20190022487A KR20190022487A (ko) 2019-03-06
KR102134263B1 true KR102134263B1 (ko) 2020-07-15

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JP (1) JP6292351B1 (zh)
KR (1) KR102134263B1 (zh)
CN (1) CN109348718B (zh)
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WO (1) WO2017221776A1 (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6966847B2 (ja) * 2016-08-10 2021-11-17 日鉄ケミカル＆マテリアル株式会社 透明ポリイミドフィルムの製造方法
TWI813543B (zh) * 2016-08-10 2023-09-01 日商日鐵化學材料股份有限公司 聚醯亞胺前驅物、聚醯亞胺及透明聚醯亞胺膜的製造方法
JP6890999B2 (ja) * 2016-08-10 2021-06-18 日鉄ケミカル＆マテリアル株式会社 ポリイミド前駆体及びポリイミド
KR102514165B1 (ko) * 2017-07-28 2023-03-24 닛산 가가쿠 가부시키가이샤 액정 배향제, 액정 배향막 및 액정 표시 소자
WO2019198709A1 (ja) * 2018-04-10 2019-10-17 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
TWI673553B (zh) * 2018-04-26 2019-10-01 台虹科技股份有限公司 觸控面板感應器結構及其製作方法
KR20210003100A (ko) * 2018-05-01 2021-01-11 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 폴리이미드 수지, 폴리이미드 바니시 및 폴리이미드 필름
JP2019219525A (ja) * 2018-06-20 2019-12-26 日東電工株式会社 偏光フィルム、粘着剤層付き偏光フィルム、及び画像表示装置
JP7139715B2 (ja) * 2018-06-26 2022-09-21 大日本印刷株式会社 ポリイミドフィルム、積層体、ディスプレイ用表面材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置
KR20210088551A (ko) * 2018-11-09 2021-07-14 도레이 카부시키가이샤 폴리이미드 전구체, 폴리이미드, 폴리이미드 수지막 및 플렉시블 디바이스
CN110156990B (zh) * 2019-05-30 2020-12-08 武汉华星光电半导体显示技术有限公司 一种聚酰亚胺复合物、制备方法及其应用
JPWO2021033544A1 (zh) * 2019-08-20 2021-02-25
WO2021193530A1 (ja) 2020-03-24 2021-09-30 東レ株式会社 樹脂膜、その製造方法、樹脂組成物、ディスプレイおよびその製造方法
KR20220158227A (ko) 2020-03-24 2022-11-30 도레이 카부시키가이샤 수지 조성물, 그것을 사용한 표시 디바이스 또는 수광 디바이스의 제조 방법, 기판 및 디바이스
EP4177296A1 (en) * 2020-07-02 2023-05-10 Sumitomo Chemical Company, Limited Optical film
WO2022176919A1 (ja) * 2021-02-17 2022-08-25 株式会社カネカ ポリイミドフィルムおよびその製造方法、ハードコートフィルム、ならびに画像表示装置
KR102592539B1 (ko) * 2021-08-02 2023-10-23 한국기초과학지원연구원 미세 시편의 특성 측정 방법 및 장치
CN113990765B (zh) * 2021-12-28 2023-04-18 深圳市思坦科技有限公司 柔性发光器件的制备方法、柔性发光器件及发光装置
CN114437350B (zh) * 2022-03-04 2022-09-16 波米科技有限公司 一种聚酰亚胺树脂及其制备方法和应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013024849A1 (ja) 2011-08-18 2013-02-21 東レ株式会社 ポリアミド酸樹脂組成物、ポリイミド樹脂組成物およびポリイミドオキサゾール樹脂組成物ならびにそれらを含有するフレキシブル基板
CN103755987A (zh) 2014-01-20 2014-04-30 江苏冰城电材股份有限公司 耐热高透明性聚酰亚胺薄膜的制备方法
WO2016035593A1 (ja) 2014-09-02 2016-03-10 東レ株式会社 樹脂および感光性樹脂組成物
WO2016052323A1 (ja) 2014-09-30 2016-04-07 東レ株式会社 ディスプレイ用支持基板、それを用いたカラーフィルターおよびその製造方法、有機ｅｌ素子およびその製造方法、ならびにフレキシブル有機ｅｌディスプレイ

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4980447A (en) * 1989-03-09 1990-12-25 Hoechst Celanese Corp. Polyamide-polyimide and polybenzoxazole-polyimide polymer
US5173561A (en) * 1990-07-24 1992-12-22 Daychem Laboratories, Inc. Heat resistant polyimide-benzoxazole polymers and composites thereof
JPH1180350A (ja) 1997-09-12 1999-03-26 Hitachi Chem Co Ltd 光部品用ポリイミド及びこれを用いた光部品
JP3200838B2 (ja) 2000-12-04 2001-08-20 日本ビクター株式会社 エンコード装置、再生装置
KR101110938B1 (ko) * 2007-10-26 2012-03-14 아사히 가세이 가부시키가이샤 폴리이미드 전구체 및 폴리이미드 전구체를 포함하는 감광성 수지 조성물
JP2010085992A (ja) 2008-09-08 2010-04-15 Toyobo Co Ltd 光伝送材料、およびそれを用いた光導波路
JP5428950B2 (ja) * 2010-03-08 2014-02-26 富士電機株式会社 半導体素子用絶縁膜
JP6056548B2 (ja) * 2013-02-27 2017-01-11 日本ゼオン株式会社 配線回路基板の製造方法
KR101685035B1 (ko) * 2013-10-24 2016-12-12 한국화학연구원 박막 트랜지스터 유기 절연체용 고분자 화합물 및 이를 이용한 박막 트랜지스터
WO2015152178A1 (ja) * 2014-03-31 2015-10-08 日産化学工業株式会社 樹脂薄膜の製造方法および樹脂薄膜形成用組成物
JP2016204569A (ja) 2015-04-27 2016-12-08 宇部興産株式会社 ポリアミック酸溶液組成物およびポリイミドフィルム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013024849A1 (ja) 2011-08-18 2013-02-21 東レ株式会社 ポリアミド酸樹脂組成物、ポリイミド樹脂組成物およびポリイミドオキサゾール樹脂組成物ならびにそれらを含有するフレキシブル基板
CN103755987A (zh) 2014-01-20 2014-04-30 江苏冰城电材股份有限公司 耐热高透明性聚酰亚胺薄膜的制备方法
WO2016035593A1 (ja) 2014-09-02 2016-03-10 東レ株式会社 樹脂および感光性樹脂組成物
WO2016052323A1 (ja) 2014-09-30 2016-04-07 東レ株式会社 ディスプレイ用支持基板、それを用いたカラーフィルターおよびその製造方法、有機ｅｌ素子およびその製造方法、ならびにフレキシブル有機ｅｌディスプレイ

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