KR101991378B1 - 수지 시트 - Google Patents

수지 시트 Download PDF

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Publication number
KR101991378B1
KR101991378B1 KR1020187024273A KR20187024273A KR101991378B1 KR 101991378 B1 KR101991378 B1 KR 101991378B1 KR 1020187024273 A KR1020187024273 A KR 1020187024273A KR 20187024273 A KR20187024273 A KR 20187024273A KR 101991378 B1 KR101991378 B1 KR 101991378B1
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KR
South Korea
Prior art keywords
resin
substrate
resin layer
solder resist
less
Prior art date
Application number
KR1020187024273A
Other languages
English (en)
Korean (ko)
Other versions
KR20180099901A (ko
Inventor
아키히토 다카하시
Original Assignee
스미또모 베이크라이트 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 스미또모 베이크라이트 가부시키가이샤 filed Critical 스미또모 베이크라이트 가부시키가이샤
Publication of KR20180099901A publication Critical patent/KR20180099901A/ko
Application granted granted Critical
Publication of KR101991378B1 publication Critical patent/KR101991378B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020187024273A 2016-03-02 2017-02-20 수지 시트 KR101991378B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-040405 2016-03-02
JP2016040405A JP6107992B1 (ja) 2016-03-02 2016-03-02 樹脂シート
PCT/JP2017/006047 WO2017150231A1 (ja) 2016-03-02 2017-02-20 樹脂シート

Publications (2)

Publication Number Publication Date
KR20180099901A KR20180099901A (ko) 2018-09-05
KR101991378B1 true KR101991378B1 (ko) 2019-06-20

Family

ID=58666438

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187024273A KR101991378B1 (ko) 2016-03-02 2017-02-20 수지 시트

Country Status (4)

Country Link
JP (1) JP6107992B1 (ja)
KR (1) KR101991378B1 (ja)
TW (1) TWI633141B (ja)
WO (1) WO2017150231A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017217815A1 (de) * 2017-10-06 2019-04-11 Conti Temic Microelectronic Gmbh Verfahren zum Herstellen einer elektronischen Komponente, elektronische Komponente und Lötstopplack

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311527A (ja) 2003-04-02 2004-11-04 Ngk Spark Plug Co Ltd 配線基板、並びに配線基板の製造方法
JP2006278993A (ja) * 2005-03-30 2006-10-12 Sumitomo Bakelite Co Ltd 配線板
JP2010238907A (ja) * 2009-03-31 2010-10-21 Sumitomo Bakelite Co Ltd 積層板、多層プリント配線板および半導体装置
JP2012073600A (ja) 2010-08-31 2012-04-12 Fujifilm Corp 感光性組成物、並びに、感光性フィルム、永久パターン、永久パターン形成方法、及びプリント基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064252A (ja) * 2000-08-22 2002-02-28 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルム、及びこれを用いた積層体、多層配線板
JP6123152B2 (ja) * 2010-12-08 2017-05-10 味の素株式会社 樹脂組成物
WO2012176423A1 (ja) * 2011-06-21 2012-12-27 住友ベークライト株式会社 積層板の製造方法
JP5564144B1 (ja) 2013-01-15 2014-07-30 太陽インキ製造株式会社 硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
WO2015072261A1 (ja) * 2013-11-12 2015-05-21 住友ベークライト株式会社 樹脂層付きキャリア材料、積層体、回路基板および電子装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311527A (ja) 2003-04-02 2004-11-04 Ngk Spark Plug Co Ltd 配線基板、並びに配線基板の製造方法
JP2006278993A (ja) * 2005-03-30 2006-10-12 Sumitomo Bakelite Co Ltd 配線板
JP2010238907A (ja) * 2009-03-31 2010-10-21 Sumitomo Bakelite Co Ltd 積層板、多層プリント配線板および半導体装置
JP2012073600A (ja) 2010-08-31 2012-04-12 Fujifilm Corp 感光性組成物、並びに、感光性フィルム、永久パターン、永久パターン形成方法、及びプリント基板

Also Published As

Publication number Publication date
WO2017150231A1 (ja) 2017-09-08
TW201803937A (zh) 2018-02-01
JP6107992B1 (ja) 2017-04-05
TWI633141B (zh) 2018-08-21
KR20180099901A (ko) 2018-09-05
JP2017157722A (ja) 2017-09-07

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