TWI633141B - 樹脂片 - Google Patents
樹脂片 Download PDFInfo
- Publication number
- TWI633141B TWI633141B TW106106034A TW106106034A TWI633141B TW I633141 B TWI633141 B TW I633141B TW 106106034 A TW106106034 A TW 106106034A TW 106106034 A TW106106034 A TW 106106034A TW I633141 B TWI633141 B TW I633141B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- substrate
- solder resist
- resin layer
- less
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP2016-040405 | 2016-03-02 | ||
JP2016040405A JP6107992B1 (ja) | 2016-03-02 | 2016-03-02 | 樹脂シート |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201803937A TW201803937A (zh) | 2018-02-01 |
TWI633141B true TWI633141B (zh) | 2018-08-21 |
Family
ID=58666438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106106034A TWI633141B (zh) | 2016-03-02 | 2017-02-23 | 樹脂片 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6107992B1 (ja) |
KR (1) | KR101991378B1 (ja) |
TW (1) | TWI633141B (ja) |
WO (1) | WO2017150231A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017217815A1 (de) * | 2017-10-06 | 2019-04-11 | Conti Temic Microelectronic Gmbh | Verfahren zum Herstellen einer elektronischen Komponente, elektronische Komponente und Lötstopplack |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012136693A (ja) * | 2010-12-08 | 2012-07-19 | Ajinomoto Co Inc | 樹脂組成物 |
TW201529308A (zh) * | 2013-11-12 | 2015-08-01 | Sumitomo Bakelite Co | 附樹脂層之載體材料、積層體、電路基板及電子裝置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002064252A (ja) * | 2000-08-22 | 2002-02-28 | Kanegafuchi Chem Ind Co Ltd | ポリイミドフィルム、及びこれを用いた積層体、多層配線板 |
JP2004311527A (ja) * | 2003-04-02 | 2004-11-04 | Ngk Spark Plug Co Ltd | 配線基板、並びに配線基板の製造方法 |
JP4687196B2 (ja) * | 2005-03-30 | 2011-05-25 | 住友ベークライト株式会社 | 配線板 |
JP5056787B2 (ja) * | 2009-03-31 | 2012-10-24 | 住友ベークライト株式会社 | 積層板、多層プリント配線板および半導体装置 |
JP2012073600A (ja) * | 2010-08-31 | 2012-04-12 | Fujifilm Corp | 感光性組成物、並びに、感光性フィルム、永久パターン、永久パターン形成方法、及びプリント基板 |
WO2012176423A1 (ja) * | 2011-06-21 | 2012-12-27 | 住友ベークライト株式会社 | 積層板の製造方法 |
JP5564144B1 (ja) | 2013-01-15 | 2014-07-30 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
-
2016
- 2016-03-02 JP JP2016040405A patent/JP6107992B1/ja active Active
-
2017
- 2017-02-20 KR KR1020187024273A patent/KR101991378B1/ko active IP Right Grant
- 2017-02-20 WO PCT/JP2017/006047 patent/WO2017150231A1/ja active Application Filing
- 2017-02-23 TW TW106106034A patent/TWI633141B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012136693A (ja) * | 2010-12-08 | 2012-07-19 | Ajinomoto Co Inc | 樹脂組成物 |
TW201529308A (zh) * | 2013-11-12 | 2015-08-01 | Sumitomo Bakelite Co | 附樹脂層之載體材料、積層體、電路基板及電子裝置 |
Also Published As
Publication number | Publication date |
---|---|
WO2017150231A1 (ja) | 2017-09-08 |
TW201803937A (zh) | 2018-02-01 |
JP6107992B1 (ja) | 2017-04-05 |
KR20180099901A (ko) | 2018-09-05 |
KR101991378B1 (ko) | 2019-06-20 |
JP2017157722A (ja) | 2017-09-07 |
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