TWI633141B - 樹脂片 - Google Patents

樹脂片 Download PDF

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Publication number
TWI633141B
TWI633141B TW106106034A TW106106034A TWI633141B TW I633141 B TWI633141 B TW I633141B TW 106106034 A TW106106034 A TW 106106034A TW 106106034 A TW106106034 A TW 106106034A TW I633141 B TWI633141 B TW I633141B
Authority
TW
Taiwan
Prior art keywords
resin
substrate
solder resist
resin layer
less
Prior art date
Application number
TW106106034A
Other languages
English (en)
Chinese (zh)
Other versions
TW201803937A (zh
Inventor
高橋昭仁
Original Assignee
住友電木股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友電木股份有限公司 filed Critical 住友電木股份有限公司
Publication of TW201803937A publication Critical patent/TW201803937A/zh
Application granted granted Critical
Publication of TWI633141B publication Critical patent/TWI633141B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW106106034A 2016-03-02 2017-02-23 樹脂片 TWI633141B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2016-040405 2016-03-02
JP2016040405A JP6107992B1 (ja) 2016-03-02 2016-03-02 樹脂シート

Publications (2)

Publication Number Publication Date
TW201803937A TW201803937A (zh) 2018-02-01
TWI633141B true TWI633141B (zh) 2018-08-21

Family

ID=58666438

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106106034A TWI633141B (zh) 2016-03-02 2017-02-23 樹脂片

Country Status (4)

Country Link
JP (1) JP6107992B1 (ja)
KR (1) KR101991378B1 (ja)
TW (1) TWI633141B (ja)
WO (1) WO2017150231A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017217815A1 (de) * 2017-10-06 2019-04-11 Conti Temic Microelectronic Gmbh Verfahren zum Herstellen einer elektronischen Komponente, elektronische Komponente und Lötstopplack

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012136693A (ja) * 2010-12-08 2012-07-19 Ajinomoto Co Inc 樹脂組成物
TW201529308A (zh) * 2013-11-12 2015-08-01 Sumitomo Bakelite Co 附樹脂層之載體材料、積層體、電路基板及電子裝置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064252A (ja) * 2000-08-22 2002-02-28 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルム、及びこれを用いた積層体、多層配線板
JP2004311527A (ja) * 2003-04-02 2004-11-04 Ngk Spark Plug Co Ltd 配線基板、並びに配線基板の製造方法
JP4687196B2 (ja) * 2005-03-30 2011-05-25 住友ベークライト株式会社 配線板
JP5056787B2 (ja) * 2009-03-31 2012-10-24 住友ベークライト株式会社 積層板、多層プリント配線板および半導体装置
JP2012073600A (ja) * 2010-08-31 2012-04-12 Fujifilm Corp 感光性組成物、並びに、感光性フィルム、永久パターン、永久パターン形成方法、及びプリント基板
WO2012176423A1 (ja) * 2011-06-21 2012-12-27 住友ベークライト株式会社 積層板の製造方法
JP5564144B1 (ja) 2013-01-15 2014-07-30 太陽インキ製造株式会社 硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012136693A (ja) * 2010-12-08 2012-07-19 Ajinomoto Co Inc 樹脂組成物
TW201529308A (zh) * 2013-11-12 2015-08-01 Sumitomo Bakelite Co 附樹脂層之載體材料、積層體、電路基板及電子裝置

Also Published As

Publication number Publication date
KR20180099901A (ko) 2018-09-05
KR101991378B1 (ko) 2019-06-20
JP6107992B1 (ja) 2017-04-05
TW201803937A (zh) 2018-02-01
JP2017157722A (ja) 2017-09-07
WO2017150231A1 (ja) 2017-09-08

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