TWI633141B - 樹脂片 - Google Patents

樹脂片 Download PDF

Info

Publication number
TWI633141B
TWI633141B TW106106034A TW106106034A TWI633141B TW I633141 B TWI633141 B TW I633141B TW 106106034 A TW106106034 A TW 106106034A TW 106106034 A TW106106034 A TW 106106034A TW I633141 B TWI633141 B TW I633141B
Authority
TW
Taiwan
Prior art keywords
resin
substrate
solder resist
resin layer
less
Prior art date
Application number
TW106106034A
Other languages
English (en)
Chinese (zh)
Other versions
TW201803937A (zh
Inventor
高橋昭仁
Original Assignee
住友電木股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友電木股份有限公司 filed Critical 住友電木股份有限公司
Publication of TW201803937A publication Critical patent/TW201803937A/zh
Application granted granted Critical
Publication of TWI633141B publication Critical patent/TWI633141B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
TW106106034A 2016-03-02 2017-02-23 樹脂片 TWI633141B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2016-040405 2016-03-02
JP2016040405A JP6107992B1 (ja) 2016-03-02 2016-03-02 樹脂シート

Publications (2)

Publication Number Publication Date
TW201803937A TW201803937A (zh) 2018-02-01
TWI633141B true TWI633141B (zh) 2018-08-21

Family

ID=58666438

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106106034A TWI633141B (zh) 2016-03-02 2017-02-23 樹脂片

Country Status (4)

Country Link
JP (1) JP6107992B1 (ja)
KR (1) KR101991378B1 (ja)
TW (1) TWI633141B (ja)
WO (1) WO2017150231A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017217815A1 (de) * 2017-10-06 2019-04-11 Conti Temic Microelectronic Gmbh Verfahren zum Herstellen einer elektronischen Komponente, elektronische Komponente und Lötstopplack

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012136693A (ja) * 2010-12-08 2012-07-19 Ajinomoto Co Inc 樹脂組成物
TW201529308A (zh) * 2013-11-12 2015-08-01 Sumitomo Bakelite Co 附樹脂層之載體材料、積層體、電路基板及電子裝置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064252A (ja) * 2000-08-22 2002-02-28 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルム、及びこれを用いた積層体、多層配線板
JP2004311527A (ja) * 2003-04-02 2004-11-04 Ngk Spark Plug Co Ltd 配線基板、並びに配線基板の製造方法
JP4687196B2 (ja) * 2005-03-30 2011-05-25 住友ベークライト株式会社 配線板
JP5056787B2 (ja) * 2009-03-31 2012-10-24 住友ベークライト株式会社 積層板、多層プリント配線板および半導体装置
JP2012073600A (ja) * 2010-08-31 2012-04-12 Fujifilm Corp 感光性組成物、並びに、感光性フィルム、永久パターン、永久パターン形成方法、及びプリント基板
WO2012176423A1 (ja) * 2011-06-21 2012-12-27 住友ベークライト株式会社 積層板の製造方法
JP5564144B1 (ja) 2013-01-15 2014-07-30 太陽インキ製造株式会社 硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012136693A (ja) * 2010-12-08 2012-07-19 Ajinomoto Co Inc 樹脂組成物
TW201529308A (zh) * 2013-11-12 2015-08-01 Sumitomo Bakelite Co 附樹脂層之載體材料、積層體、電路基板及電子裝置

Also Published As

Publication number Publication date
WO2017150231A1 (ja) 2017-09-08
TW201803937A (zh) 2018-02-01
JP6107992B1 (ja) 2017-04-05
KR20180099901A (ko) 2018-09-05
KR101991378B1 (ko) 2019-06-20
JP2017157722A (ja) 2017-09-07

Similar Documents

Publication Publication Date Title
TWI494337B (zh) 電路基板用環氧樹脂組成物,預浸體,積層板,樹脂片,印刷佈線板用積層基材,印刷佈線板及半導體裝置
JP5344022B2 (ja) エポキシ樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置
JP7258453B2 (ja) 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
KR102582537B1 (ko) 프린트 배선판의 제조 방법, 반도체 장치의 제조 방법
JP5206600B2 (ja) エポキシ樹脂組成物、プリプレグ、積層板、樹脂シート、多層プリント配線板、及び半導体装置
JP6410405B2 (ja) 樹脂基板、プリプレグ、プリント配線基板、半導体装置
JP2011213784A (ja) エポキシ樹脂前駆体組成物、プリプレグ、積層板、樹脂シート、プリント配線板および半導体装置
JP6557960B2 (ja) 半導体装置製造用部材、及びそれを用いた半導体装置の製造方法
JP5849390B2 (ja) エポキシ樹脂前駆体組成物、プリプレグ、積層板、樹脂シート、プリント配線板および半導体装置
JP2016065226A (ja) 熱硬化性樹脂組成物、キャリア付樹脂膜、および半導体装置
TWI633141B (zh) 樹脂片
JP6610069B2 (ja) ソルダーレジスト用樹脂組成物、キャリア付樹脂膜、配線基板、電子装置、および電子装置の製造方法
JP7225553B2 (ja) ソルダーレジスト形成用の樹脂シート
JP6409390B2 (ja) 配線基板、半導体パッケージ、電子装置、配線基板の製造方法、および半導体パッケージの製造方法
JP2013006328A (ja) 積層板、回路基板、および半導体パッケージ
JP7098881B2 (ja) 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP5471800B2 (ja) プリント配線板用積層材料およびその用途
TW201718798A (zh) 樹脂片材及電子裝置
JP7462380B2 (ja) ソルダーレジスト樹脂組成物、樹脂シート、梱包体及び回路基板
JP7058467B2 (ja) 樹脂シートおよび回路基板
JP5935314B2 (ja) 半導体装置の製造方法
JP7240085B2 (ja) 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP2017010992A (ja) 半導体装置及びその製造方法
JP2017212400A (ja) 樹脂シートおよび回路基板
JP2011144229A (ja) シアネート樹脂組成物、プリプレグ、積層板、プリント配線板、及び半導体装置