KR101613048B1 - 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 - Google Patents

검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 Download PDF

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KR101613048B1
KR101613048B1 KR1020157000055A KR20157000055A KR101613048B1 KR 101613048 B1 KR101613048 B1 KR 101613048B1 KR 1020157000055 A KR1020157000055 A KR 1020157000055A KR 20157000055 A KR20157000055 A KR 20157000055A KR 101613048 B1 KR101613048 B1 KR 101613048B1
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design data
wafer
delete delete
inspection
defects
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Korean (ko)
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KR20150013351A (ko
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아쇽 쿨카니
브라이언 더피
카이스 마야
고든 로우즈
쿠람 자파
사가 크케어
엘리스 창
알렌 팍
피터 로즈
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케이엘에이-텐코 코포레이션
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Priority claimed from US11/561,659 external-priority patent/US7570796B2/en
Priority claimed from US11/561,735 external-priority patent/US7676077B2/en
Publication of KR20150013351A publication Critical patent/KR20150013351A/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G06F17/30—
    • G06F17/30002—
    • G06F17/30005—
    • G06F17/30067—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31718—Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Quality & Reliability (AREA)
  • Analytical Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020157000055A 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 Active KR101613048B1 (ko)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US73794705P 2005-11-18 2005-11-18
US73829005P 2005-11-18 2005-11-18
US60/738,290 2005-11-18
US60/737,947 2005-11-18
US11/561,659 US7570796B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
PCT/US2006/061113 WO2007120280A2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
US11/561,735 US7676077B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
US11/561,735 2006-11-20
US11/561,659 2006-11-20

Related Parent Applications (1)

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KR1020137006368A Division KR101665168B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템

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KR20150013351A KR20150013351A (ko) 2015-02-04
KR101613048B1 true KR101613048B1 (ko) 2016-04-15

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KR1020157000055A Active KR101613048B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020167033159A Active KR101789004B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020137006368A Active KR101665168B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020177029140A Active KR101885585B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020157030359A Active KR101672157B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020087014775A Active KR101285967B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및시스템
KR1020137009231A Active KR101370154B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020137009234A Active KR101530456B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020157002473A Active KR101682838B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020147015035A Active KR101565071B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020187021977A Withdrawn KR20180088924A (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템

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KR1020167033159A Active KR101789004B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020137006368A Active KR101665168B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020177029140A Active KR101885585B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020157030359A Active KR101672157B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020087014775A Active KR101285967B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및시스템
KR1020137009231A Active KR101370154B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020137009234A Active KR101530456B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020157002473A Active KR101682838B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020147015035A Active KR101565071B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020187021977A Withdrawn KR20180088924A (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템

Country Status (5)

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EP (1) EP1955225A4 (enExample)
JP (12) JP5465880B2 (enExample)
KR (11) KR101613048B1 (enExample)
IL (14) IL191527A (enExample)
WO (2) WO2007120279A2 (enExample)

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KR20180128510A (ko) * 2016-04-22 2018-12-03 케이엘에이-텐코 코포레이션 컴퓨터에 의해 지원되는 약한 패턴 검출 및 정량화 시스템
US12228862B2 (en) * 2015-12-31 2025-02-18 Asml Netherlands B.V. Selection of measurement locations for patterning processes

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