IL230235A - Methods and systems for utilizing design data in combination with inspection data - Google Patents

Methods and systems for utilizing design data in combination with inspection data

Info

Publication number
IL230235A
IL230235A IL230235A IL23023513A IL230235A IL 230235 A IL230235 A IL 230235A IL 230235 A IL230235 A IL 230235A IL 23023513 A IL23023513 A IL 23023513A IL 230235 A IL230235 A IL 230235A
Authority
IL
Israel
Prior art keywords
data
systems
methods
combination
utilizing design
Prior art date
Application number
IL230235A
Other languages
Hebrew (he)
Inventor
Ashok Kulkarni
Brian Duffy
Kais Maayah
Gordon Rouse
Original Assignee
Kla Tencor Tech Corp
Ashok Kulkarni
Brian Duffy
Kais Maayah
Gordon Rouse
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/561,735 external-priority patent/US7676077B2/en
Priority claimed from US11/561,659 external-priority patent/US7570796B2/en
Application filed by Kla Tencor Tech Corp, Ashok Kulkarni, Brian Duffy, Kais Maayah, Gordon Rouse filed Critical Kla Tencor Tech Corp
Publication of IL230235A publication Critical patent/IL230235A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31718—Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Quality & Reliability (AREA)
  • Pathology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Data Mining & Analysis (AREA)
  • Databases & Information Systems (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
IL230235A 2005-11-18 2013-12-29 Methods and systems for utilizing design data in combination with inspection data IL230235A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US73794705P 2005-11-18 2005-11-18
US73829005P 2005-11-18 2005-11-18
US11/561,735 US7676077B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
PCT/US2006/061113 WO2007120280A2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
US11/561,659 US7570796B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data

Publications (1)

Publication Number Publication Date
IL230235A true IL230235A (en) 2015-05-31

Family

ID=38610775

Family Applications (14)

Application Number Title Priority Date Filing Date
IL191527A IL191527A (en) 2005-11-18 2008-05-18 Methods and systems for utilizing design data in combination with inspection data
IL230235A IL230235A (en) 2005-11-18 2013-12-29 Methods and systems for utilizing design data in combination with inspection data
IL230260A IL230260A (en) 2005-11-18 2013-12-31 Methods and systems for utilizing design data in combination with inspection data
IL234290A IL234290A (en) 2005-11-18 2014-08-25 Methods and systems for utilizing design data in combination with inspection data
IL234289A IL234289A (en) 2005-11-18 2014-08-25 Methods and systems for utilizing design data in combination with inspection data
IL234318A IL234318A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234316A IL234316A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234319A IL234319A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234317A IL234317A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234344A IL234344A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234343A IL234343A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234345A IL234345A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234346A IL234346A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL253189A IL253189B (en) 2005-11-18 2017-06-27 System and method for assigning classifications to defects detected on a wafer

Family Applications Before (1)

Application Number Title Priority Date Filing Date
IL191527A IL191527A (en) 2005-11-18 2008-05-18 Methods and systems for utilizing design data in combination with inspection data

Family Applications After (12)

Application Number Title Priority Date Filing Date
IL230260A IL230260A (en) 2005-11-18 2013-12-31 Methods and systems for utilizing design data in combination with inspection data
IL234290A IL234290A (en) 2005-11-18 2014-08-25 Methods and systems for utilizing design data in combination with inspection data
IL234289A IL234289A (en) 2005-11-18 2014-08-25 Methods and systems for utilizing design data in combination with inspection data
IL234318A IL234318A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234316A IL234316A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234319A IL234319A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234317A IL234317A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234344A IL234344A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234343A IL234343A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234345A IL234345A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234346A IL234346A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL253189A IL253189B (en) 2005-11-18 2017-06-27 System and method for assigning classifications to defects detected on a wafer

Country Status (5)

Country Link
EP (1) EP1955225A4 (en)
JP (12) JP5465880B2 (en)
KR (11) KR101789004B1 (en)
IL (14) IL191527A (en)
WO (2) WO2007120279A2 (en)

Families Citing this family (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9002497B2 (en) * 2003-07-03 2015-04-07 Kla-Tencor Technologies Corp. Methods and systems for inspection of wafers and reticles using designer intent data
EP1955225A4 (en) * 2005-11-18 2009-11-04 Kla Tencor Tech Corp Methods and systems for utilizing design data in combination with inspection data
WO2009020885A1 (en) * 2007-08-03 2009-02-12 Flir Systems, Inc. Wireless remote detector systems and methods
US9710903B2 (en) 2008-06-11 2017-07-18 Kla-Tencor Corp. System and method for detecting design and process defects on a wafer using process monitoring features
KR101841897B1 (en) * 2008-07-28 2018-03-23 케이엘에이-텐코어 코오포레이션 Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer
WO2011004534A1 (en) * 2009-07-09 2011-01-13 株式会社 日立ハイテクノロジーズ Semiconductor defect classifying method, semiconductor defect classifying apparatus, and semiconductor defect classifying program
CN102484084B (en) * 2009-07-17 2014-12-10 克拉-坦科股份有限公司 Scanner performance comparison and matching using design and defect data
US20130068949A1 (en) * 2010-05-31 2013-03-21 Kotoko Urano Charged particle beam device provided with automatic aberration correction method
EP2447889A1 (en) * 2010-10-29 2012-05-02 Siemens Aktiengesellschaft Method for modeling a defect management in a manufacturing process and for handling the defect during the production process based on said modeled defect management
TWI574136B (en) * 2012-02-03 2017-03-11 應用材料以色列公司 Method of design-based defect classification and system thereof
US8718353B2 (en) * 2012-03-08 2014-05-06 Kla-Tencor Corporation Reticle defect inspection with systematic defect filter
JP5943722B2 (en) 2012-06-08 2016-07-05 三菱重工業株式会社 Defect determination apparatus, radiation imaging system, and defect determination method
JP6092602B2 (en) * 2012-12-04 2017-03-08 株式会社安永 Defect inspection apparatus and defect inspection method
US9202763B2 (en) 2013-01-16 2015-12-01 Kabushiki Kaisha Toshiba Defect pattern evaluation method, defect pattern evaluation apparatus, and recording media
JP6152281B2 (en) 2013-02-25 2017-06-21 株式会社ニューフレアテクノロジー Pattern inspection method and pattern inspection apparatus
US10114368B2 (en) * 2013-07-22 2018-10-30 Applied Materials Israel Ltd. Closed-loop automatic defect inspection and classification
US9401016B2 (en) * 2014-05-12 2016-07-26 Kla-Tencor Corp. Using high resolution full die image data for inspection
TWI660856B (en) * 2014-07-08 2019-06-01 以色列奧寶科技有限公司 Improved systems and methods for computerized direct writing
US10267746B2 (en) 2014-10-22 2019-04-23 Kla-Tencor Corp. Automated pattern fidelity measurement plan generation
SG11201703585RA (en) * 2014-11-25 2017-06-29 Kla Tencor Corp Analyzing and utilizing landscapes
US9830421B2 (en) * 2014-12-31 2017-11-28 Kla-Tencor Corp. Alignment of inspection to design using built in targets
US10199283B1 (en) 2015-02-03 2019-02-05 Pdf Solutions, Inc. Method for processing a semiconductor wager using non-contact electrical measurements indicative of a resistance through a stitch, where such measurements are obtained by scanning a pad comprised of at least three parallel conductive stripes using a moving stage with beam deflection to account for motion of the stage
US9799575B2 (en) 2015-12-16 2017-10-24 Pdf Solutions, Inc. Integrated circuit containing DOEs of NCEM-enabled fill cells
US9875536B2 (en) 2015-03-31 2018-01-23 Kla-Tencor Corp. Sub-pixel and sub-resolution localization of defects on patterned wafers
US10539612B2 (en) * 2015-05-20 2020-01-21 Kla-Tencor Corporation Voltage contrast based fault and defect inference in logic chips
US9639645B2 (en) 2015-06-18 2017-05-02 Globalfoundries Inc. Integrated circuit chip reliability using reliability-optimized failure mechanism targeting
US9940704B2 (en) 2015-06-19 2018-04-10 KLA—Tencor Corporation Pre-layer defect site review using design
US9891275B2 (en) 2015-06-24 2018-02-13 International Business Machines Corporation Integrated circuit chip reliability qualification using a sample-specific expected fail rate
TWI684225B (en) * 2015-08-28 2020-02-01 美商克萊譚克公司 Self directed metrology and pattern classification
US9576772B1 (en) * 2015-08-31 2017-02-21 Fei Company CAD-assisted TEM prep recipe creation
KR102387459B1 (en) 2015-11-20 2022-04-15 삼성전자주식회사 A method for forming pattern of a semiconductor device
US10387601B2 (en) * 2015-11-26 2019-08-20 Kla-Tencor Corporation Methods to store dynamic layer content inside a design file
US10978438B1 (en) 2015-12-16 2021-04-13 Pdf Solutions, Inc. IC with test structures and E-beam pads embedded within a contiguous standard cell area
US10593604B1 (en) 2015-12-16 2020-03-17 Pdf Solutions, Inc. Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells
CN108700818B (en) * 2015-12-22 2020-10-16 Asml荷兰有限公司 Apparatus and method for process window characterization
US11205119B2 (en) * 2015-12-22 2021-12-21 Applied Materials Israel Ltd. Method of deep learning-based examination of a semiconductor specimen and system thereof
KR102451650B1 (en) * 2016-02-05 2022-10-11 에스케이하이닉스 주식회사 Stacked type seniconductor apparatus
KR102483787B1 (en) * 2016-02-25 2023-01-04 에스케이하이닉스 주식회사 Apparatus and Method for Modeling of Defect to Semiconductor Apparatus, and Computer Program Therefor, and System for Inspection of Defect to Semiconductor Apparatus
US10339262B2 (en) * 2016-03-29 2019-07-02 Kla-Tencor Corporation System and method for defining care areas in repeating structures of design data
US9929063B1 (en) 2016-04-04 2018-03-27 Pdf Solutions, Inc. Process for making an integrated circuit that includes NCEM-Enabled, tip-to-side gap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gates
US9905553B1 (en) 2016-04-04 2018-02-27 Pdf Solutions, Inc. Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, GATECNT-short-configured, and metal-short-configured, NCEM-enabled fill cells
US9646961B1 (en) 2016-04-04 2017-05-09 Pdf Solutions, Inc. Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, TS-short-configured, and metal-short-configured, NCEM-enabled fill cells
US10740888B2 (en) * 2016-04-22 2020-08-11 Kla-Tencor Corporation Computer assisted weak pattern detection and quantification system
US11443083B2 (en) * 2016-05-12 2022-09-13 Asml Netherlands B.V. Identification of hot spots or defects by machine learning
US11010886B2 (en) * 2016-05-17 2021-05-18 Kla-Tencor Corporation Systems and methods for automatic correction of drift between inspection and design for massive pattern searching
US10192302B2 (en) * 2016-05-25 2019-01-29 Kla-Tencor Corporation Combined patch and design-based defect detection
US10304177B2 (en) * 2016-06-29 2019-05-28 Kla-Tencor Corporation Systems and methods of using z-layer context in logic and hot spot inspection for sensitivity improvement and nuisance suppression
US10902576B2 (en) * 2016-08-12 2021-01-26 Texas Instruments Incorporated System and method for electronic die inking after automatic visual defect inspection
US10204290B2 (en) * 2016-10-14 2019-02-12 Kla-Tencor Corporation Defect review sampling and normalization based on defect and design attributes
US10395358B2 (en) * 2016-11-10 2019-08-27 Kla-Tencor Corp. High sensitivity repeater defect detection
US11047806B2 (en) * 2016-11-30 2021-06-29 Kla-Tencor Corporation Defect discovery and recipe optimization for inspection of three-dimensional semiconductor structures
US11237119B2 (en) * 2017-01-10 2022-02-01 Kla-Tencor Corporation Diagnostic methods for the classifiers and the defects captured by optical tools
US9748153B1 (en) 2017-03-29 2017-08-29 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second does of standard cell compatible, NCEM-enabled fill cells, with the first DOE including side-to-side short configured fill cells, and the second DOE including tip-to-side short configure
US9773774B1 (en) 2017-03-30 2017-09-26 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including chamfer short configured fill cells, and the second DOE including corner short configured fill cells
US10598617B2 (en) * 2017-05-05 2020-03-24 Kla-Tencor Corporation Metrology guided inspection sample shaping of optical inspection results
JP6819451B2 (en) * 2017-05-08 2021-01-27 信越化学工業株式会社 Large synthetic quartz glass substrate and its evaluation method and manufacturing method
KR102301556B1 (en) * 2017-05-22 2021-09-13 케이엘에이 코포레이션 Zone analysis for recipe optimization and measurement
KR102440742B1 (en) * 2017-05-25 2022-09-05 삼성전자주식회사 Inspecting system for semiconductor device and operating method of the same
US10648925B2 (en) * 2017-06-05 2020-05-12 Kla-Tencor Corporation Repeater defect detection
JP2020529621A (en) * 2017-06-06 2020-10-08 ケーエルエー コーポレイション Reticle optimization algorithm and optimal target design
US9786649B1 (en) 2017-06-27 2017-10-10 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including via open configured fill cells, and the second DOE including stitch open configured fill cells
US9768083B1 (en) 2017-06-27 2017-09-19 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including snake open configured fill cells
US10096530B1 (en) 2017-06-28 2018-10-09 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including stitch open configured fill cells
US9865583B1 (en) 2017-06-28 2018-01-09 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including snake open configured fill cells, and the second DOE including stitch open configured fill cells
US10620135B2 (en) * 2017-07-19 2020-04-14 Kla-Tencor Corp. Identifying a source of nuisance defects on a wafer
KR102614266B1 (en) * 2017-08-22 2023-12-14 삼성전자주식회사 A method for wafer inspection, and a method for manufacturing a semiconductor device using the same
US11037286B2 (en) * 2017-09-28 2021-06-15 Applied Materials Israel Ltd. Method of classifying defects in a semiconductor specimen and system thereof
KR20190073756A (en) 2017-12-19 2019-06-27 삼성전자주식회사 Semiconductor defect classification device, method for classifying defect of semiconductor, and semiconductor defect classification system
RU2754208C1 (en) * 2018-02-26 2021-08-30 Ф. Хоффманн-Ля Рош Аг Methods and systems for calibration and use of camera for determination of analyte in sample
US10585049B2 (en) * 2018-03-10 2020-03-10 Kla-Tencor Corporation Process-induced excursion characterization
US10677588B2 (en) * 2018-04-09 2020-06-09 Kla-Tencor Corporation Localized telecentricity and focus optimization for overlay metrology
US11797950B2 (en) * 2018-08-27 2023-10-24 Basf Corporation Method and system to digitally track and monitor an automotive refinish repair process
JP7113086B2 (en) * 2018-10-18 2022-08-04 株式会社図研 Design support device, design support method and program
US11049745B2 (en) * 2018-10-19 2021-06-29 Kla Corporation Defect-location determination using correction loop for pixel alignment
US11600505B2 (en) 2018-10-31 2023-03-07 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for systematic physical failure analysis (PFA) fault localization
CN109583721A (en) * 2018-11-16 2019-04-05 北京奇虎科技有限公司 A kind of appraisal procedure of channel, device and electronic equipment
JP2020161769A (en) * 2019-03-28 2020-10-01 Ｔａｓｍｉｔ株式会社 Image generation method
TWI700644B (en) * 2019-04-02 2020-08-01 精英電腦股份有限公司 Synchronous positioning device and method for circuit board or plate member
JP7245733B2 (en) * 2019-06-26 2023-03-24 株式会社日立ハイテク Wafer observation device and wafer observation method
US11526152B2 (en) * 2019-12-19 2022-12-13 X Development Llc Techniques for determining fabricability of designs by searching for forbidden patterns
CN111708255B (en) * 2020-06-19 2023-03-07 上海华虹宏力半导体制造有限公司 Method for forming SSA table of OPC
JP2022047442A (en) * 2020-09-11 2022-03-24 パナソニックＩｐマネジメント株式会社 Information processing method and information processing system
US20240053278A1 (en) * 2021-03-30 2024-02-15 Siemens Industry Software Inc. Method and system for detecting a false error on a component of a board inspected by an aoi machine
KR20230033445A (en) 2021-09-01 2023-03-08 에스케이하이닉스 주식회사 Method for failure analysis on semiconductor wafer and system thereof
KR102518783B1 (en) * 2022-06-23 2023-04-06 큐알티 주식회사 Beam controller capable of adaptive deformation, a test apparatus for semiconductor device using the same, and a test method for semiconductor device using the same
US20240112326A1 (en) * 2022-09-30 2024-04-04 Kla Corporation Inspection of adaptive patterned workpieces with dynamic design and deep learning-based rendering
KR102594471B1 (en) * 2022-12-07 2023-10-26 주식회사디아이 Multi-test zone controller for semiconductor test equipment

Family Cites Families (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02110565A (en) * 1988-10-20 1990-04-23 Matsushita Electron Corp Method and device for photo-mask inspection
US5054097A (en) * 1988-11-23 1991-10-01 Schlumberger Technologies, Inc. Methods and apparatus for alignment of images
US5252507A (en) * 1990-03-30 1993-10-12 Tactical Fabs, Inc. Very high density wafer scale device architecture
JP3017839B2 (en) * 1991-06-10 2000-03-13 東芝機械株式会社 Defect inspection method and inspection device
JP3730263B2 (en) * 1992-05-27 2005-12-21 ケーエルエー・インストルメンツ・コーポレーション Apparatus and method for automatic substrate inspection using charged particle beam
JPH06119452A (en) * 1992-10-02 1994-04-28 Fujitsu Ltd Device and method for processing image
JPH06265480A (en) * 1993-03-12 1994-09-22 Toshiba Corp Pattern defect inspection method and device
JP3370379B2 (en) * 1993-03-19 2003-01-27 株式会社日立製作所 Method for manufacturing semiconductor device
JP3051279B2 (en) * 1993-05-13 2000-06-12 シャープ株式会社 Bump appearance inspection method and bump appearance inspection device
US5544256A (en) 1993-10-22 1996-08-06 International Business Machines Corporation Automated defect classification system
JP3466286B2 (en) * 1994-08-09 2003-11-10 富士通株式会社 Pattern inspection method and pattern inspection device
US5991699A (en) 1995-05-04 1999-11-23 Kla Instruments Corporation Detecting groups of defects in semiconductor feature space
JPH0915161A (en) * 1995-06-27 1997-01-17 Hitachi Ltd Method and equipment for defect inspection
JPH10260011A (en) * 1997-03-19 1998-09-29 Olympus Optical Co Ltd Positioning device
JP3564958B2 (en) * 1997-08-07 2004-09-15 株式会社日立製作所 Inspection method and inspection apparatus using electron beam
JPH11251377A (en) * 1998-03-02 1999-09-17 Hitachi Ltd Defect inspection method/device and observation or analysis method/system for defect
JP4073088B2 (en) * 1998-08-20 2008-04-09 株式会社ルネサステクノロジ Manufacturing method of semiconductor substrate
JP2000065747A (en) * 1998-08-26 2000-03-03 Toshiba Corp Apparatus and method for inspection of defect of pattern
JP2000306964A (en) * 1999-04-22 2000-11-02 Hitachi Ltd Inspection data processing method, and inspection data processor
JP2000200356A (en) * 1999-01-08 2000-07-18 Hitachi Ltd Method and device for defect classification
JP3350477B2 (en) * 1999-04-02 2002-11-25 セイコーインスツルメンツ株式会社 Wafer inspection equipment
JP2001230289A (en) * 2000-02-15 2001-08-24 Hitachi Ltd Fault analyzing method and system
US7120285B1 (en) * 2000-02-29 2006-10-10 Advanced Micro Devices, Inc. Method for evaluation of reticle image using aerial image simulator
US6862142B2 (en) * 2000-03-10 2005-03-01 Kla-Tencor Technologies Corporation Multi-detector microscopic inspection system
US6507800B1 (en) * 2000-03-13 2003-01-14 Promos Technologies, Inc. Method for testing semiconductor wafers
JP3920003B2 (en) * 2000-04-25 2007-05-30 株式会社ルネサステクノロジ Inspection data processing method and apparatus
FR2813145B1 (en) * 2000-08-18 2002-11-29 St Microelectronics Sa METHOD FOR MANUFACTURING A CAPACITOR WITHIN AN INTEGRATED CIRCUIT, AND CORRESPONDING INTEGRATED CIRCUIT
US6634018B2 (en) * 2000-08-24 2003-10-14 Texas Instruments Incorporated Optical proximity correction
JP3678133B2 (en) * 2000-10-30 2005-08-03 株式会社日立製作所 Inspection system and semiconductor device manufacturing method
EP1337838B1 (en) * 2000-11-30 2007-01-10 SIGMA-C Software AG Method and device for determining the properties of an integrated circuit
JP2002244275A (en) * 2001-02-15 2002-08-30 Toshiba Corp Method and device for defect inspection of photomask and recording medium
JP4014379B2 (en) * 2001-02-21 2007-11-28 株式会社日立製作所 Defect review apparatus and method
JP2003023056A (en) * 2001-07-10 2003-01-24 Hitachi Ltd Method for sorting defect of semiconductor device, method for predicting yield of the semiconductor device, method for manufacturing the semiconductor device, defect-sorting system of semiconductor device and semiconductor device-sorting apparatus, and program used therefor and recording medium
JP4122735B2 (en) * 2001-07-24 2008-07-23 株式会社日立製作所 Semiconductor device inspection method and inspection condition setting method
JP3904419B2 (en) * 2001-09-13 2007-04-11 株式会社日立製作所 Inspection device and inspection system
US6918101B1 (en) * 2001-10-25 2005-07-12 Kla -Tencor Technologies Corporation Apparatus and methods for determining critical area of semiconductor design data
US6751519B1 (en) * 2001-10-25 2004-06-15 Kla-Tencor Technologies Corporation Methods and systems for predicting IC chip yield
US6886153B1 (en) * 2001-12-21 2005-04-26 Kla-Tencor Corporation Design driven inspection or measurement for semiconductor using recipe
JP2003215060A (en) * 2002-01-22 2003-07-30 Tokyo Seimitsu Co Ltd Pattern inspection method and inspection apparatus
JP2004031709A (en) * 2002-06-27 2004-01-29 Seiko Instruments Inc Waferless measuring recipe generating system
JP4073265B2 (en) * 2002-07-09 2008-04-09 富士通株式会社 Inspection apparatus and inspection method
US6959251B2 (en) * 2002-08-23 2005-10-25 Kla-Tencor Technologies, Corporation Inspection system setup techniques
JP2004117016A (en) * 2002-09-24 2004-04-15 Nec Kansai Ltd Semiconductor wafer defect inspecting apparatus
US7457736B2 (en) * 2002-11-21 2008-11-25 Synopsys, Inc. Automated creation of metrology recipes
US6882745B2 (en) * 2002-12-19 2005-04-19 Freescale Semiconductor, Inc. Method and apparatus for translating detected wafer defect coordinates to reticle coordinates using CAD data
JP2004227886A (en) * 2003-01-22 2004-08-12 Hitachi High-Technologies Corp Scanning electron microscope
JP2004296592A (en) * 2003-03-26 2004-10-21 Dainippon Screen Mfg Co Ltd Defect classification equipment, defect classification method, and program
JP2004294358A (en) * 2003-03-28 2004-10-21 Hitachi High-Technologies Corp Method and apparatus for inspecting defect
JP4230838B2 (en) * 2003-06-27 2009-02-25 株式会社日立ハイテクノロジーズ Inspection recipe setting method and defect inspection method in defect inspection apparatus
US6952653B2 (en) * 2003-04-29 2005-10-04 Kla-Tencor Technologies Corporation Single tool defect classification solution
JP2004333386A (en) * 2003-05-09 2004-11-25 Nec Corp Reticle inspection apparatus and reticle inspection method
JP4229767B2 (en) * 2003-06-30 2009-02-25 株式会社東京精密 Image defect inspection method, image defect inspection apparatus, and appearance inspection apparatus
US9002497B2 (en) * 2003-07-03 2015-04-07 Kla-Tencor Technologies Corp. Methods and systems for inspection of wafers and reticles using designer intent data
US7135344B2 (en) * 2003-07-11 2006-11-14 Applied Materials, Israel, Ltd. Design-based monitoring
KR20050072166A (en) * 2004-01-02 2005-07-11 삼성전자주식회사 Method for testing wafer
JP4771714B2 (en) * 2004-02-23 2011-09-14 株式会社Ｎｇｒ Pattern inspection apparatus and method
US7194709B2 (en) * 2004-03-05 2007-03-20 Keith John Brankner Automatic alignment of integrated circuit and design layout of integrated circuit to more accurately assess the impact of anomalies
JP4778685B2 (en) * 2004-03-10 2011-09-21 株式会社日立ハイテクノロジーズ Pattern shape evaluation method and apparatus for semiconductor device
JP2005283326A (en) * 2004-03-30 2005-10-13 Hitachi High-Technologies Corp Defect review method and its device
US7137083B2 (en) * 2004-04-01 2006-11-14 Verigy Ipco Verification of integrated circuit tests using test simulation and integrated circuit simulation with simulated failure
JP4154374B2 (en) * 2004-08-25 2008-09-24 株式会社日立ハイテクノロジーズ Pattern matching device and scanning electron microscope using the same
US7760347B2 (en) * 2005-05-13 2010-07-20 Applied Materials, Inc. Design-based method for grouping systematic defects in lithography pattern writing system
EP1955225A4 (en) * 2005-11-18 2009-11-04 Kla Tencor Tech Corp Methods and systems for utilizing design data in combination with inspection data

Also Published As

Publication number Publication date
KR20140091575A (en) 2014-07-21
JP2016029376A (en) 2016-03-03
KR101672157B1 (en) 2016-11-02
JP6127170B2 (en) 2017-05-10
KR20130043223A (en) 2013-04-29
KR101285967B1 (en) 2013-07-12
JP6364036B2 (en) 2018-07-25
JP2016139811A (en) 2016-08-04
JP5965467B2 (en) 2016-08-03
IL234290A (en) 2016-10-31
KR20180088924A (en) 2018-08-07
JP2009516832A (en) 2009-04-23
IL234344A (en) 2016-11-30
IL253189B (en) 2018-11-29
WO2007120280A2 (en) 2007-10-25
IL191527A0 (en) 2008-12-29
KR101565071B1 (en) 2015-11-03
KR20130055014A (en) 2013-05-27
IL234289A (en) 2016-10-31
JP2015062034A (en) 2015-04-02
KR101370154B1 (en) 2014-03-04
KR20130055013A (en) 2013-05-27
WO2007120279A2 (en) 2007-10-25
JP6023116B2 (en) 2016-11-09
JP2013238606A (en) 2013-11-28
KR20080080130A (en) 2008-09-02
IL234318A (en) 2017-04-30
IL234317A (en) 2017-04-30
KR101613048B1 (en) 2016-04-15
JP2012168195A (en) 2012-09-06
JP2014167476A (en) 2014-09-11
JP5932723B2 (en) 2016-06-08
JP5465880B2 (en) 2014-04-09
EP1955225A2 (en) 2008-08-13
IL234343A (en) 2016-11-30
KR101789004B1 (en) 2017-10-20
KR101530456B1 (en) 2015-06-22
JP2016136151A (en) 2016-07-28
KR20160138593A (en) 2016-12-05
IL230260A (en) 2016-05-31
JP6312642B2 (en) 2018-04-18
EP1955225A4 (en) 2009-11-04
KR20150013351A (en) 2015-02-04
KR101885585B1 (en) 2018-08-07
JP5466264B2 (en) 2014-04-09
KR20150033708A (en) 2015-04-01
JP5869657B2 (en) 2016-02-24
JP2016106228A (en) 2016-06-16
IL253189A0 (en) 2017-08-31
IL191527A (en) 2014-09-30
JP2013217940A (en) 2013-10-24
JP2016011962A (en) 2016-01-21
IL234316A (en) 2017-04-30
JP6312641B2 (en) 2018-04-18
KR101665168B1 (en) 2016-10-11
KR20150123962A (en) 2015-11-04
JP2015092173A (en) 2015-05-14
IL234346A (en) 2017-07-31
KR101682838B1 (en) 2016-12-12
IL234319A (en) 2016-10-31
KR20170118240A (en) 2017-10-24
WO2007120280A3 (en) 2008-09-18
IL234345A (en) 2016-11-30
WO2007120279A3 (en) 2008-11-20
JP6360845B2 (en) 2018-07-18
JP5763712B2 (en) 2015-08-12

Similar Documents

Publication Publication Date Title
IL234343A (en) Methods and systems for utilizing design data in combination with inspection data
IL226581B (en) Systems and methods for use in flash detection
EP1866625A4 (en) Glass inspection systems and methods for using same
EP1958121A4 (en) Systems and methods for non-traditional payment
IL192117A0 (en) Systems and methods for processing data flows
ZA200711195B (en) Application security in an interactive media environment
EP1977386A4 (en) Systems and methods for establishing first on the follow trading priority in electronic trading systems
EP2074577A4 (en) Payment systems and methods
EP1960555A4 (en) Methods and systems for designing primers and probes
EP2126915A4 (en) Memory system and method with serial and parallel modes
EP1987484A4 (en) Systems and methods for placing advertisements
EP2030011A4 (en) Systems and methods for analyzing nanoreporters
TWI348165B (en) Memeoy cell writing system and method thereof
IL192502A0 (en) Systems and methods for publishing selectively altered sensor data in real time
IL188131A0 (en) Application security in an interactive media environment
EP1949690A4 (en) Inspection system and method
EP1879693A4 (en) Methods and systems for reducing emissions
HK1126588A1 (en) Method and arrangement in an access system
GB2442694B (en) Strake systems and methods
EP1872121A4 (en) Printing systems and methods
GB2455190B (en) Systems and Methods for Witness Card Analysis
TWI372879B (en) Test equipmetn and pin-electronic card
EP1872265A4 (en) Systems and methods for utilizing digital assets
GB0618878D0 (en) Detection methods and systems
EP1899674A4 (en) Safe inspection system and kit

Legal Events

Date Code Title Description
FF Patent granted
KB Patent renewed
KB Patent renewed
KB Patent renewed