IL253189B - A system and method for assigning a rating to defects found in a chip manufacturing substrate - Google Patents

A system and method for assigning a rating to defects found in a chip manufacturing substrate

Info

Publication number
IL253189B
IL253189B IL253189A IL25318917A IL253189B IL 253189 B IL253189 B IL 253189B IL 253189 A IL253189 A IL 253189A IL 25318917 A IL25318917 A IL 25318917A IL 253189 B IL253189 B IL 253189B
Authority
IL
Israel
Prior art keywords
rating
assigning
chip manufacturing
manufacturing substrate
defects found
Prior art date
Application number
IL253189A
Other languages
Hebrew (he)
Other versions
IL253189A0 (en
Inventor
Kulkarni Ashok
Duffy Brian
Maayah Kais
Rouse Gordon
Original Assignee
Kla Tencor Tech Corporation
Kulkarni Ashok
Duffy Brian
Maayah Kais
Rouse Gordon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/561,735 external-priority patent/US7676077B2/en
Priority claimed from US11/561,659 external-priority patent/US7570796B2/en
Application filed by Kla Tencor Tech Corporation, Kulkarni Ashok, Duffy Brian, Maayah Kais, Rouse Gordon filed Critical Kla Tencor Tech Corporation
Publication of IL253189A0 publication Critical patent/IL253189A0/en
Publication of IL253189B publication Critical patent/IL253189B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31718—Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Quality & Reliability (AREA)
  • Analytical Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
IL253189A 2005-11-18 2017-06-27 A system and method for assigning a rating to defects found in a chip manufacturing substrate IL253189B (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US73794705P 2005-11-18 2005-11-18
US73829005P 2005-11-18 2005-11-18
US11/561,735 US7676077B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
PCT/US2006/061113 WO2007120280A2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
US11/561,659 US7570796B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data

Publications (2)

Publication Number Publication Date
IL253189A0 IL253189A0 (en) 2017-08-31
IL253189B true IL253189B (en) 2018-11-29

Family

ID=38610775

Family Applications (14)

Application Number Title Priority Date Filing Date
IL191527A IL191527A (en) 2005-11-18 2008-05-18 Methods and systems for utilizing design data in combination with inspection data
IL230235A IL230235A (en) 2005-11-18 2013-12-29 Systems and methods for using planning information together with test information
IL230260A IL230260A (en) 2005-11-18 2013-12-31 Systems and methods for using planning information together with test information
IL234290A IL234290A (en) 2005-11-18 2014-08-25 Methods and systems for utilizing design data in combination with inspection data
IL234289A IL234289A (en) 2005-11-18 2014-08-25 Systems and methods for using planning information together with test information
IL234318A IL234318A (en) 2005-11-18 2014-08-26 Systems and methods for using planning information together with test information
IL234317A IL234317A (en) 2005-11-18 2014-08-26 Systems and methods for using planning information together with test information
IL234316A IL234316A (en) 2005-11-18 2014-08-26 Systems and methods for using planning information together with test information
IL234319A IL234319A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234345A IL234345A (en) 2005-11-18 2014-08-27 Systems and methods for using planning information together with test information
IL234344A IL234344A (en) 2005-11-18 2014-08-27 Systems and methods for using planning information together with test information
IL234346A IL234346A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234343A IL234343A (en) 2005-11-18 2014-08-27 Systems and methods for using planning information together with test information
IL253189A IL253189B (en) 2005-11-18 2017-06-27 A system and method for assigning a rating to defects found in a chip manufacturing substrate

Family Applications Before (13)

Application Number Title Priority Date Filing Date
IL191527A IL191527A (en) 2005-11-18 2008-05-18 Methods and systems for utilizing design data in combination with inspection data
IL230235A IL230235A (en) 2005-11-18 2013-12-29 Systems and methods for using planning information together with test information
IL230260A IL230260A (en) 2005-11-18 2013-12-31 Systems and methods for using planning information together with test information
IL234290A IL234290A (en) 2005-11-18 2014-08-25 Methods and systems for utilizing design data in combination with inspection data
IL234289A IL234289A (en) 2005-11-18 2014-08-25 Systems and methods for using planning information together with test information
IL234318A IL234318A (en) 2005-11-18 2014-08-26 Systems and methods for using planning information together with test information
IL234317A IL234317A (en) 2005-11-18 2014-08-26 Systems and methods for using planning information together with test information
IL234316A IL234316A (en) 2005-11-18 2014-08-26 Systems and methods for using planning information together with test information
IL234319A IL234319A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234345A IL234345A (en) 2005-11-18 2014-08-27 Systems and methods for using planning information together with test information
IL234344A IL234344A (en) 2005-11-18 2014-08-27 Systems and methods for using planning information together with test information
IL234346A IL234346A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234343A IL234343A (en) 2005-11-18 2014-08-27 Systems and methods for using planning information together with test information

Country Status (5)

Country Link
EP (1) EP1955225A4 (en)
JP (12) JP5465880B2 (en)
KR (11) KR101370154B1 (en)
IL (14) IL191527A (en)
WO (2) WO2007120279A2 (en)

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